JPS569026B2 - - Google Patents

Info

Publication number
JPS569026B2
JPS569026B2 JP5718276A JP5718276A JPS569026B2 JP S569026 B2 JPS569026 B2 JP S569026B2 JP 5718276 A JP5718276 A JP 5718276A JP 5718276 A JP5718276 A JP 5718276A JP S569026 B2 JPS569026 B2 JP S569026B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5718276A
Other languages
Japanese (ja)
Other versions
JPS51141365A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS51141365A publication Critical patent/JPS51141365A/ja
Publication of JPS569026B2 publication Critical patent/JPS569026B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02Cleaning by the force of jets or sprays
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00Cleaning and liquid contact with solids
    • Y10S134/902Semiconductor wafer

Landscapes

  • Cleaning By Liquid Or Steam (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP51057182A 1975-05-19 1976-05-18 Device for stripping and cleaning substrate Granted JPS51141365A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/578,735 US3990462A (en) 1975-05-19 1975-05-19 Substrate stripping and cleaning apparatus

Publications (2)

Publication Number Publication Date
JPS51141365A JPS51141365A (en) 1976-12-06
JPS569026B2 true JPS569026B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1981-02-26

Family

ID=24314084

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51057182A Granted JPS51141365A (en) 1975-05-19 1976-05-18 Device for stripping and cleaning substrate

Country Status (3)

Country Link
US (1) US3990462A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS51141365A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE2621952C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10865914B2 (en) 2017-04-28 2020-12-15 Nibco Inc. High temperature leak prevention for piping components and connections

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US4132567A (en) * 1977-10-13 1979-01-02 Fsi Corporation Apparatus for and method of cleaning and removing static charges from substrates
US4197000A (en) * 1978-05-23 1980-04-08 Fsi Corporation Positive developing method and apparatus
US4286541A (en) * 1979-07-26 1981-09-01 Fsi Corporation Applying photoresist onto silicon wafers
FR2516408B1 (fr) * 1981-11-19 1985-07-26 Dassault Electronique Machine a laver les circuits electroniques
US4429983A (en) 1982-03-22 1984-02-07 International Business Machines Corporation Developing apparatus for exposed photoresist coated wafers
US4458704A (en) * 1982-10-29 1984-07-10 Xertronix, Inc. Apparatus for processing semiconductor wafers
US4735220A (en) * 1983-04-13 1988-04-05 Chandler Don G Turntable having superstructure for holding wafer baskets
US4982753A (en) * 1983-07-26 1991-01-08 National Semiconductor Corporation Wafer etching, cleaning and stripping apparatus
US4801335A (en) * 1984-07-02 1989-01-31 Fsi Corporation Rinsing in acid processing of substrates
US4682615A (en) * 1984-07-02 1987-07-28 Fsi Corporation Rinsing in acid processing of substrates
US4691722A (en) * 1984-08-01 1987-09-08 Fsi Corporation Bowl for liquid spray processing machine
JPS61251135A (ja) * 1985-04-30 1986-11-08 Toshiba Corp 自動現像装置
US4674521A (en) * 1985-05-20 1987-06-23 Machine Technology, Inc. Rinsing apparatus and method
US4695327A (en) * 1985-06-13 1987-09-22 Purusar Corporation Surface treatment to remove impurities in microrecesses
US4682614A (en) * 1985-07-26 1987-07-28 Fsi Corporation Wafer processing machine
US4664133A (en) * 1985-07-26 1987-05-12 Fsi Corporation Wafer processing machine
US4745422A (en) * 1985-11-18 1988-05-17 Kabushiki Kaisha Toshiba Automatic developing apparatus
US4777732A (en) 1986-06-12 1988-10-18 Oki Electric Industry Co., Ltd. Wafer centrifugal drying apparatus
JPS6314434A (ja) * 1986-07-04 1988-01-21 Dainippon Screen Mfg Co Ltd 基板表面処理方法および装置
US5022419A (en) * 1987-04-27 1991-06-11 Semitool, Inc. Rinser dryer system
WO1989000895A1 (en) * 1987-07-29 1989-02-09 Purusar Corporation Surface treatment to remove impurities in microrecesses
US5224504A (en) * 1988-05-25 1993-07-06 Semitool, Inc. Single wafer processor
US4900395A (en) * 1989-04-07 1990-02-13 Fsi International, Inc. HF gas etching of wafers in an acid processor
JP2824282B2 (ja) * 1989-07-14 1998-11-11 ヤマハ発動機株式会社 表面処理装置
US5169408A (en) * 1990-01-26 1992-12-08 Fsi International, Inc. Apparatus for wafer processing with in situ rinse
US5069236A (en) * 1990-03-07 1991-12-03 Pathway Systems, Inc. Method and apparatus for cleaning disks
US5107880A (en) * 1990-03-07 1992-04-28 Pathway Systems, Inc. Disk cleaning apparatus
US5087323A (en) * 1990-07-12 1992-02-11 Idaho Research Foundation, Inc. Fine line pattern formation by aerosol centrifuge etching technique
DE9013668U1 (de) * 1990-09-29 1992-01-30 HAMATECH Halbleiter-Maschinenbau und Technologie GmbH, 7137 Sternenfels Vorrichtung für die Halbleitertechnik
US5089084A (en) * 1990-12-03 1992-02-18 Micron Technology, Inc. Hydrofluoric acid etcher and cascade rinser
US5224503A (en) * 1992-06-15 1993-07-06 Semitool, Inc. Centrifugal wafer carrier cleaning apparatus
US5316035A (en) * 1993-02-19 1994-05-31 Fluoroware, Inc. Capacitive proximity monitoring device for corrosive atmosphere environment
JP3415670B2 (ja) * 1994-03-03 2003-06-09 三菱電機株式会社 ウエハ洗浄装置
DE4414560A1 (de) * 1994-04-18 1995-10-19 Peter Semmler & Co Ohg Verfahren und Vorrichtung zum Zerstäuben und flächigen oder partiellen Auftragen von Flüssigkeiten
FR2724333B1 (fr) * 1994-09-14 1996-12-20 Eco Filtration Procede de traitement d'objets par projection d'un agent actif liquide et installation correspondante
US5772784A (en) * 1994-11-14 1998-06-30 Yieldup International Ultra-low particle semiconductor cleaner
US5958146A (en) * 1994-11-14 1999-09-28 Yieldup International Ultra-low particle semiconductor cleaner using heated fluids
US6065424A (en) * 1995-12-19 2000-05-23 Cornell Research Foundation, Inc. Electroless deposition of metal films with spray processor
US5779816A (en) * 1997-01-30 1998-07-14 Trinh; Tieu T. Nozzle and system for use in wafer cleaning procedures
US5861064A (en) * 1997-03-17 1999-01-19 Fsi Int Inc Process for enhanced photoresist removal in conjunction with various methods and chemistries
US6125863A (en) * 1998-06-30 2000-10-03 Semitool, Inc. Offset rotor flat media processor
US6062239A (en) * 1998-06-30 2000-05-16 Semitool, Inc. Cross flow centrifugal processor
US6432214B2 (en) 1998-07-10 2002-08-13 Semitool, Inc. Cleaning apparatus
US6904920B2 (en) * 1998-07-10 2005-06-14 Semitool, Inc. Method and apparatus for cleaning containers
US6548411B2 (en) * 1999-01-22 2003-04-15 Semitool, Inc. Apparatus and methods for processing a workpiece
US6516815B1 (en) * 1999-07-09 2003-02-11 Applied Materials, Inc. Edge bead removal/spin rinse dry (EBR/SRD) module
US6340395B1 (en) * 2000-01-18 2002-01-22 Advanced Micro Devices, Inc. Salsa clean process
JP4007766B2 (ja) * 2000-02-29 2007-11-14 東京エレクトロン株式会社 液処理装置および液処理方法
KR100360402B1 (ko) * 2000-03-22 2002-11-13 삼성전자 주식회사 회전성 분사노즐을 구비하는 웨이퍼 건조 장치 및 이를이용한 웨이퍼 건조 방법
US6418945B1 (en) * 2000-07-07 2002-07-16 Semitool, Inc. Dual cassette centrifugal processor
JP3662484B2 (ja) * 2000-08-09 2005-06-22 エム・エフエスアイ株式会社 ウェット処理方法及びウェット処理装置
US6951221B2 (en) * 2000-09-22 2005-10-04 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
US6705331B2 (en) * 2000-11-20 2004-03-16 Dainippon Screen Mfg., Co., Ltd. Substrate cleaning apparatus
US20020139400A1 (en) * 2001-03-27 2002-10-03 Semitool, Inc. Vertical process reactor
JP3713447B2 (ja) * 2001-04-05 2005-11-09 東京エレクトロン株式会社 現像処理装置
US20040025901A1 (en) * 2001-07-16 2004-02-12 Semitool, Inc. Stationary wafer spin/spray processor
MY126260A (en) * 2001-10-09 2006-09-29 Matsushita Electric Ind Co Ltd Method and apparatus for removing film and method for manufacturing display panel
US6824612B2 (en) 2001-12-26 2004-11-30 Applied Materials, Inc. Electroless plating system
US6770565B2 (en) 2002-01-08 2004-08-03 Applied Materials Inc. System for planarizing metal conductive layers
JP4017463B2 (ja) * 2002-07-11 2007-12-05 株式会社荏原製作所 洗浄方法
US7326305B2 (en) * 2004-01-30 2008-02-05 Intersil Americas, Inc. System and method for decapsulating an encapsulated object
US7836900B2 (en) * 2004-04-02 2010-11-23 Tokyo Electron Limited Substrate processing system, substrate processing method, recording medium and software
WO2006107549A1 (en) 2005-04-01 2006-10-12 Fsi International, Inc. Compact duct system incorporating moveable and nestable baffles for use in tools used to process microelectronic workpieces with one or more treatment fluids
US8387635B2 (en) 2006-07-07 2013-03-05 Tel Fsi, Inc. Barrier structure and nozzle device for use in tools used to process microelectronic workpieces with one or more treatment fluids
WO2009020524A1 (en) * 2007-08-07 2009-02-12 Fsi International, Inc. Rinsing methodologies for barrier plate and venturi containment systems in tools used to process microelectronic workpieces with one or more treatment fluids, and related apparatuses
US8235062B2 (en) 2008-05-09 2012-08-07 Fsi International, Inc. Tools and methods for processing microelectronic workpieces using process chamber designs that easily transition between open and closed modes of operation
CN102041526B (zh) * 2010-11-25 2012-10-31 三门三友冶化技术开发有限公司 阴极板的清洗装置
US20130019904A1 (en) * 2011-07-20 2013-01-24 Illinois Tool Works Inc. Batch cleaning apparatus and method for batch cleaning printed circuit boards
US10589325B2 (en) * 2011-10-18 2020-03-17 MKN Maschinenfabrik Kurt Neubauer GmbH & Co. KG Cooking appliance with a pan and a method for cleaning the pan
CN109570111B (zh) * 2018-12-11 2021-06-22 廖斓词 一种改进的护理器械清洗消毒装置
WO2023192837A2 (en) * 2022-03-28 2023-10-05 Pallidus, Inc. Electrochemical systems and methods for finishing sic wafers
CN116213337B (zh) * 2022-12-26 2024-05-24 北京长源朗弘科技有限公司 一种油缸缸体加工的清洁装置

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US2003003A (en) * 1931-11-11 1935-05-28 Westinghouse Electric & Mfg Co Dishwasher
US2208646A (en) * 1937-10-15 1940-07-23 Chrysler Corp Coating material recovery process
US2562076A (en) * 1946-02-05 1951-07-24 Weisselberg Arnold Dishwashing machine with impeller coaxial with jet actuated rotary basket
US2515702A (en) * 1946-05-31 1950-07-18 Wallace C Douglass Cleaning apparatus for lamp shades having a rotary support, fluid spray, and drier
DE1503744A1 (de) * 1965-09-01 1969-04-10 Bosch Hausgeraete Gmbh Geschirrspuelmaschine
US3413827A (en) * 1967-04-05 1968-12-03 Borg Warner Jet action for liquid treatment of materials
US3769992A (en) * 1971-12-06 1973-11-06 Fluoroware Inc Spray processing machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10865914B2 (en) 2017-04-28 2020-12-15 Nibco Inc. High temperature leak prevention for piping components and connections

Also Published As

Publication number Publication date
DE2621952C2 (de) 1982-05-19
JPS51141365A (en) 1976-12-06
DE2621952A1 (de) 1976-12-09
US3990462A (en) 1976-11-09

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