DE2548914A1 - Verfahren zur erniedrigung des dekantiervolumens bei der regeneration stromloser kupferabscheidungsbaeder - Google Patents
Verfahren zur erniedrigung des dekantiervolumens bei der regeneration stromloser kupferabscheidungsbaederInfo
- Publication number
- DE2548914A1 DE2548914A1 DE19752548914 DE2548914A DE2548914A1 DE 2548914 A1 DE2548914 A1 DE 2548914A1 DE 19752548914 DE19752548914 DE 19752548914 DE 2548914 A DE2548914 A DE 2548914A DE 2548914 A1 DE2548914 A1 DE 2548914A1
- Authority
- DE
- Germany
- Prior art keywords
- copper
- refreshing
- concentrate
- bath
- decanting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000010949 copper Substances 0.000 title claims description 65
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 51
- 229910052802 copper Inorganic materials 0.000 title claims description 50
- 238000000034 method Methods 0.000 title claims description 15
- 230000008929 regeneration Effects 0.000 title description 7
- 238000011069 regeneration method Methods 0.000 title description 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 58
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 50
- 239000012141 concentrate Substances 0.000 claims description 46
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 27
- 238000007747 plating Methods 0.000 claims description 26
- 239000008139 complexing agent Substances 0.000 claims description 15
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 7
- 150000001879 copper Chemical class 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- -1 copper (II) fluoroborate Chemical compound 0.000 claims description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 2
- 229910000366 copper(II) sulfate Inorganic materials 0.000 claims description 2
- ZQLBQWDYEGOYSW-UHFFFAOYSA-L copper;disulfamate Chemical compound [Cu+2].NS([O-])(=O)=O.NS([O-])(=O)=O ZQLBQWDYEGOYSW-UHFFFAOYSA-L 0.000 claims description 2
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 claims 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims 1
- 238000010908 decantation Methods 0.000 claims 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims 1
- 235000008504 concentrate Nutrition 0.000 description 38
- 239000000243 solution Substances 0.000 description 25
- 230000008021 deposition Effects 0.000 description 12
- 230000007423 decrease Effects 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 7
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 5
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 3
- 239000003125 aqueous solvent Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005137 deposition process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 235000014666 liquid concentrate Nutrition 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US54976675A | 1975-02-13 | 1975-02-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2548914A1 true DE2548914A1 (de) | 1976-08-26 |
Family
ID=24194310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19752548914 Withdrawn DE2548914A1 (de) | 1975-02-13 | 1975-10-31 | Verfahren zur erniedrigung des dekantiervolumens bei der regeneration stromloser kupferabscheidungsbaeder |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JPS5194427A (enrdf_load_stackoverflow) |
| AU (1) | AU8560475A (enrdf_load_stackoverflow) |
| BE (1) | BE834955A (enrdf_load_stackoverflow) |
| CH (1) | CH602930A5 (enrdf_load_stackoverflow) |
| DE (1) | DE2548914A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2300820A1 (enrdf_load_stackoverflow) |
| IT (1) | IT1052574B (enrdf_load_stackoverflow) |
| NL (1) | NL7512406A (enrdf_load_stackoverflow) |
| SE (1) | SE7511587L (enrdf_load_stackoverflow) |
-
1975
- 1975-10-09 AU AU85604/75A patent/AU8560475A/en not_active Expired
- 1975-10-16 SE SE7511587A patent/SE7511587L/xx unknown
- 1975-10-23 NL NL7512406A patent/NL7512406A/xx not_active Application Discontinuation
- 1975-10-23 FR FR7532481A patent/FR2300820A1/fr active Granted
- 1975-10-28 BE BE161325A patent/BE834955A/xx unknown
- 1975-10-31 DE DE19752548914 patent/DE2548914A1/de not_active Withdrawn
- 1975-11-04 CH CH1438775A patent/CH602930A5/xx not_active IP Right Cessation
- 1975-12-15 IT IT52679/75A patent/IT1052574B/it active
- 1975-12-25 JP JP50154148A patent/JPS5194427A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| SE7511587L (sv) | 1976-08-16 |
| FR2300820A1 (fr) | 1976-09-10 |
| BE834955A (fr) | 1976-04-28 |
| CH602930A5 (enrdf_load_stackoverflow) | 1978-08-15 |
| IT1052574B (it) | 1981-07-20 |
| NL7512406A (nl) | 1976-08-17 |
| FR2300820B3 (enrdf_load_stackoverflow) | 1978-07-28 |
| JPS5194427A (enrdf_load_stackoverflow) | 1976-08-19 |
| AU8560475A (en) | 1977-04-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8128 | New person/name/address of the agent |
Representative=s name: HENKEL, G., DR.PHIL. FEILER, L., DR.RER.NAT. HAENZ |
|
| 8141 | Disposal/no request for examination |