AU8560475A - Reducing decant volume in regeneration of electroless copper plating bath - Google Patents
Reducing decant volume in regeneration of electroless copper plating bathInfo
- Publication number
- AU8560475A AU8560475A AU85604/75A AU8560475A AU8560475A AU 8560475 A AU8560475 A AU 8560475A AU 85604/75 A AU85604/75 A AU 85604/75A AU 8560475 A AU8560475 A AU 8560475A AU 8560475 A AU8560475 A AU 8560475A
- Authority
- AU
- Australia
- Prior art keywords
- regeneration
- reducing
- plating bath
- copper plating
- electroless copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
- 230000008929 regeneration Effects 0.000 title 1
- 238000011069 regeneration method Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US54976675A | 1975-02-13 | 1975-02-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU8560475A true AU8560475A (en) | 1977-04-21 |
Family
ID=24194310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU85604/75A Expired AU8560475A (en) | 1975-02-13 | 1975-10-09 | Reducing decant volume in regeneration of electroless copper plating bath |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JPS5194427A (enrdf_load_stackoverflow) |
| AU (1) | AU8560475A (enrdf_load_stackoverflow) |
| BE (1) | BE834955A (enrdf_load_stackoverflow) |
| CH (1) | CH602930A5 (enrdf_load_stackoverflow) |
| DE (1) | DE2548914A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2300820A1 (enrdf_load_stackoverflow) |
| IT (1) | IT1052574B (enrdf_load_stackoverflow) |
| NL (1) | NL7512406A (enrdf_load_stackoverflow) |
| SE (1) | SE7511587L (enrdf_load_stackoverflow) |
-
1975
- 1975-10-09 AU AU85604/75A patent/AU8560475A/en not_active Expired
- 1975-10-16 SE SE7511587A patent/SE7511587L/xx unknown
- 1975-10-23 NL NL7512406A patent/NL7512406A/xx not_active Application Discontinuation
- 1975-10-23 FR FR7532481A patent/FR2300820A1/fr active Granted
- 1975-10-28 BE BE161325A patent/BE834955A/xx unknown
- 1975-10-31 DE DE19752548914 patent/DE2548914A1/de not_active Withdrawn
- 1975-11-04 CH CH1438775A patent/CH602930A5/xx not_active IP Right Cessation
- 1975-12-15 IT IT52679/75A patent/IT1052574B/it active
- 1975-12-25 JP JP50154148A patent/JPS5194427A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| SE7511587L (sv) | 1976-08-16 |
| FR2300820A1 (fr) | 1976-09-10 |
| BE834955A (fr) | 1976-04-28 |
| CH602930A5 (enrdf_load_stackoverflow) | 1978-08-15 |
| IT1052574B (it) | 1981-07-20 |
| NL7512406A (nl) | 1976-08-17 |
| DE2548914A1 (de) | 1976-08-26 |
| FR2300820B3 (enrdf_load_stackoverflow) | 1978-07-28 |
| JPS5194427A (enrdf_load_stackoverflow) | 1976-08-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AU496780B2 (en) | Additives in baths forthe electrodeposition of copper | |
| AU2225477A (en) | Acid copper plating baths | |
| JPS51149134A (en) | Nonncyanideeseries silver plating bath | |
| JPS51145576A (en) | Preetching solution preetching of polysuleon and other polymers for electroless plating | |
| JPS5489942A (en) | Acid bath solution for plating copper and nitrogennsulfur composition | |
| JPS5281032A (en) | Tinngold electroplating bath and plating method | |
| JPS5253735A (en) | Silver plating method and silver plating bath | |
| HK42179A (en) | Electroless copper plating bath | |
| IL51772A0 (en) | Electroless copper plating | |
| JPS5220339A (en) | Chemical copper plating solution | |
| AU8560475A (en) | Reducing decant volume in regeneration of electroless copper plating bath | |
| ZA706968B (en) | Electroless copper plating solution and process | |
| JPS5217335A (en) | Chemical copper plating solution | |
| JPS5260869A (en) | Method of electroless copper plating | |
| JPS5262136A (en) | Regeneration method of inferion plating bath | |
| JPS5217334A (en) | Electroless copper plating solution | |
| JPS544248A (en) | Method of selective plating in continuous plating bath | |
| JPS52105540A (en) | Silver bath for lusterous plating of nonncyanide | |
| JPS5235128A (en) | Method of silver plating | |
| JPS51128647A (en) | Method of zinc plating bath | |
| JPS51135836A (en) | Electroless copper plating solusion | |
| JPS5223530A (en) | Treating method of chemical copper plating solution | |
| JPS5232829A (en) | Method of pretreatment in partial chemical plating of metal | |
| JPS5214537A (en) | Rhodium plating bath | |
| JPS5271346A (en) | Method of purifying and regenerating nickel plating solution taken out from multilayer nickel plating bath |