DE2528119A1 - Elektrisch leitendes band - Google Patents

Elektrisch leitendes band

Info

Publication number
DE2528119A1
DE2528119A1 DE19752528119 DE2528119A DE2528119A1 DE 2528119 A1 DE2528119 A1 DE 2528119A1 DE 19752528119 DE19752528119 DE 19752528119 DE 2528119 A DE2528119 A DE 2528119A DE 2528119 A1 DE2528119 A1 DE 2528119A1
Authority
DE
Germany
Prior art keywords
electrically conductive
conductive tape
finger
tape
metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19752528119
Other languages
German (de)
English (en)
Inventor
Hugo Dipl Phys Dr Ruechardt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Priority to DE19752528119 priority Critical patent/DE2528119A1/de
Priority to GB16956/76A priority patent/GB1511415A/en
Priority to FR7618807A priority patent/FR2315770A1/fr
Priority to IT24540/76A priority patent/IT1064051B/it
Priority to JP51074970A priority patent/JPS523384A/ja
Publication of DE2528119A1 publication Critical patent/DE2528119A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials

Landscapes

  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
DE19752528119 1975-06-24 1975-06-24 Elektrisch leitendes band Ceased DE2528119A1 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE19752528119 DE2528119A1 (de) 1975-06-24 1975-06-24 Elektrisch leitendes band
GB16956/76A GB1511415A (en) 1975-06-24 1976-04-27 Connecting strips
FR7618807A FR2315770A1 (fr) 1975-06-24 1976-06-21 Ruban electriquement conducteur
IT24540/76A IT1064051B (it) 1975-06-24 1976-06-22 Nastro elettroconduttore
JP51074970A JPS523384A (en) 1975-06-24 1976-06-24 Comb teeth shaped conductor for semiconductor elements or integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752528119 DE2528119A1 (de) 1975-06-24 1975-06-24 Elektrisch leitendes band

Publications (1)

Publication Number Publication Date
DE2528119A1 true DE2528119A1 (de) 1977-01-20

Family

ID=5949834

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19752528119 Ceased DE2528119A1 (de) 1975-06-24 1975-06-24 Elektrisch leitendes band

Country Status (5)

Country Link
JP (1) JPS523384A (enExample)
DE (1) DE2528119A1 (enExample)
FR (1) FR2315770A1 (enExample)
GB (1) GB1511415A (enExample)
IT (1) IT1064051B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3019207A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip
JPS5793559A (en) * 1980-12-03 1982-06-10 Nec Corp Semiconductor device
JPS57117265A (en) * 1981-01-13 1982-07-21 Nec Corp Semiconductor device
JPS57134941A (en) * 1981-02-13 1982-08-20 Nec Corp Semiconductor device
JPS57145356A (en) * 1981-03-03 1982-09-08 Nec Corp Semiconductor device
FR2521350B1 (fr) * 1982-02-05 1986-01-24 Hitachi Ltd Boitier porteur de puce semi-conductrice
JPS59128736U (ja) * 1984-01-17 1984-08-30 日本電気株式会社 半導体集積回路装置
JPS6359593A (ja) * 1986-08-30 1988-03-15 株式会社東芝 携帯可能媒体における実装方法
AU2003216033A1 (en) * 2003-02-24 2004-09-17 Infineon Technologies Ag A plastics leadframe and an integrated circuit package fabricated using the leadframe
JP5737966B2 (ja) * 2011-01-25 2015-06-17 キヤノン株式会社 液体吐出ヘッドおよび液体吐出ヘッドの製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1193519A (en) * 1967-08-31 1970-06-03 Texas Instruments Ltd Semiconductor Devices
GB1306031A (enExample) * 1971-01-01 1973-02-07
US3777365A (en) * 1972-03-06 1973-12-11 Honeywell Inf Systems Circuit chips having beam leads attached by film strip process

Also Published As

Publication number Publication date
FR2315770A1 (fr) 1977-01-21
GB1511415A (en) 1978-05-17
JPS523384A (en) 1977-01-11
IT1064051B (it) 1985-02-18
FR2315770B1 (enExample) 1982-10-22

Similar Documents

Publication Publication Date Title
DE3884039T2 (de) Verbindungsverfahren zum Testen und Montieren von elektronischen Bauelementen.
DE112006002516B4 (de) Chip-Widertand und Befestigungsstruktur für einen Chip-Widerstand
DE2732529C2 (de) Gedruckte Schaltungsplatine
DE3913221A1 (de) Halbleiteranordnung
EP0777955A1 (de) Gerät mit einer elektrischen schaltungsanordnung
DE4301915A1 (de) Mehrfachchip-Halbleitervorrichtung
EP1393605B1 (de) Leiterplatte mit mindestens einem elektronischen bauteil
DE3428881A1 (de) Verfahren zum herstellen einer integrierten schaltungsvorrichtung
DE2807350C2 (de) Flüssigkristall-Anzeigevorrichtung in Baueinheit mit einem integrierten Schaltkreis
DE3010876A1 (de) Verfahren zur herstellung einer leiterplatte
DE1259988B (de) Verfahren zum Herstellen flexibler elektrischer Schaltkreiselemente
DE102006015447A1 (de) Leistungshalbleiterbauelement mit einem Leistungshalbleiterchip und Verfahren zur Herstellung desselben
DE3005773A1 (de) Oberflaechenwellen-bauelement
DE3930858C2 (de) Modulaufbau
EP0953186B1 (de) Chipkartenmodul
DE4129964C2 (de) Verfahren zur Herstellung einer elektrisch leitenden Befestigung einer integrierten Schaltung auf einer gedruckten Schaltung
DE3618751A1 (de) Kupferband (leiterrahmenband)
DE68914214T2 (de) Zusammenbau- und Packungsverfahren eines Sensorelementes.
DE2508702B2 (de) Elektrisches Bauelement
DE1764477B1 (de) Keramischer kondensator
DE10339022A1 (de) Halbleitervorrichtung
DE102006062494A1 (de) Elektrische Vorrichtung mit einem Trägerelement mit zumindest einer speziellen Anschlussfläche und einem oberflächenmontierten Bauelement
DE3151933C2 (de) Elektrischer Verbinder
EP0854548B1 (de) Elektrische Kontaktvorrichtung
EP0576708A1 (de) Integrierter Schaltkreis mit Leiterrahmen

Legal Events

Date Code Title Description
OF Willingness to grant licences before publication of examined application
OD Request for examination
8131 Rejection