FR2315770A1 - Ruban electriquement conducteur - Google Patents

Ruban electriquement conducteur

Info

Publication number
FR2315770A1
FR2315770A1 FR7618807A FR7618807A FR2315770A1 FR 2315770 A1 FR2315770 A1 FR 2315770A1 FR 7618807 A FR7618807 A FR 7618807A FR 7618807 A FR7618807 A FR 7618807A FR 2315770 A1 FR2315770 A1 FR 2315770A1
Authority
FR
France
Prior art keywords
electrically conductive
conductive tape
tape
electrically
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7618807A
Other languages
English (en)
French (fr)
Other versions
FR2315770B1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of FR2315770A1 publication Critical patent/FR2315770A1/fr
Application granted granted Critical
Publication of FR2315770B1 publication Critical patent/FR2315770B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
FR7618807A 1975-06-24 1976-06-21 Ruban electriquement conducteur Granted FR2315770A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752528119 DE2528119A1 (de) 1975-06-24 1975-06-24 Elektrisch leitendes band

Publications (2)

Publication Number Publication Date
FR2315770A1 true FR2315770A1 (fr) 1977-01-21
FR2315770B1 FR2315770B1 (enExample) 1982-10-22

Family

ID=5949834

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7618807A Granted FR2315770A1 (fr) 1975-06-24 1976-06-21 Ruban electriquement conducteur

Country Status (5)

Country Link
JP (1) JPS523384A (enExample)
DE (1) DE2528119A1 (enExample)
FR (1) FR2315770A1 (enExample)
GB (1) GB1511415A (enExample)
IT (1) IT1064051B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3019207A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip
JPS5793559A (en) * 1980-12-03 1982-06-10 Nec Corp Semiconductor device
JPS57117265A (en) * 1981-01-13 1982-07-21 Nec Corp Semiconductor device
JPS57134941A (en) * 1981-02-13 1982-08-20 Nec Corp Semiconductor device
JPS57145356A (en) * 1981-03-03 1982-09-08 Nec Corp Semiconductor device
FR2521350B1 (fr) * 1982-02-05 1986-01-24 Hitachi Ltd Boitier porteur de puce semi-conductrice
JPS59128736U (ja) * 1984-01-17 1984-08-30 日本電気株式会社 半導体集積回路装置
JPS6359593A (ja) * 1986-08-30 1988-03-15 株式会社東芝 携帯可能媒体における実装方法
AU2003216033A1 (en) * 2003-02-24 2004-09-17 Infineon Technologies Ag A plastics leadframe and an integrated circuit package fabricated using the leadframe
JP5737966B2 (ja) * 2011-01-25 2015-06-17 キヤノン株式会社 液体吐出ヘッドおよび液体吐出ヘッドの製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1193519A (en) * 1967-08-31 1970-06-03 Texas Instruments Ltd Semiconductor Devices
GB1306031A (enExample) * 1971-01-01 1973-02-07
US3777365A (en) * 1972-03-06 1973-12-11 Honeywell Inf Systems Circuit chips having beam leads attached by film strip process

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1193519A (en) * 1967-08-31 1970-06-03 Texas Instruments Ltd Semiconductor Devices
GB1306031A (enExample) * 1971-01-01 1973-02-07
US3777365A (en) * 1972-03-06 1973-12-11 Honeywell Inf Systems Circuit chips having beam leads attached by film strip process

Also Published As

Publication number Publication date
DE2528119A1 (de) 1977-01-20
GB1511415A (en) 1978-05-17
JPS523384A (en) 1977-01-11
IT1064051B (it) 1985-02-18
FR2315770B1 (enExample) 1982-10-22

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Legal Events

Date Code Title Description
ST Notification of lapse