DE2437348B2 - Verfahren zur herstellung von reliefstrukturen - Google Patents
Verfahren zur herstellung von reliefstrukturenInfo
- Publication number
- DE2437348B2 DE2437348B2 DE19742437348 DE2437348A DE2437348B2 DE 2437348 B2 DE2437348 B2 DE 2437348B2 DE 19742437348 DE19742437348 DE 19742437348 DE 2437348 A DE2437348 A DE 2437348A DE 2437348 B2 DE2437348 B2 DE 2437348B2
- Authority
- DE
- Germany
- Prior art keywords
- radiation
- sensitive
- relief structures
- groups
- soluble polymeric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 9
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000012704 polymeric precursor Substances 0.000 claims description 15
- 230000005855 radiation Effects 0.000 claims description 10
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 7
- 150000001805 chlorine compounds Chemical class 0.000 claims description 4
- 150000004985 diamines Chemical class 0.000 claims description 4
- 150000001991 dicarboxylic acids Chemical class 0.000 claims description 4
- 125000005442 diisocyanate group Chemical group 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims description 2
- RPDJEKMSFIRVII-UHFFFAOYSA-N oxomethylidenehydrazine Chemical compound NN=C=O RPDJEKMSFIRVII-UHFFFAOYSA-N 0.000 claims description 2
- 238000006068 polycondensation reaction Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000005496 tempering Methods 0.000 claims description 2
- 125000002837 carbocyclic group Chemical group 0.000 claims 1
- 125000000623 heterocyclic group Chemical group 0.000 claims 1
- 239000010410 layer Substances 0.000 description 7
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 230000004304 visual acuity Effects 0.000 description 3
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- -1 N-substituted maleimide groups Chemical group 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 125000005059 halophenyl group Chemical group 0.000 description 2
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 2
- 150000003949 imides Chemical group 0.000 description 2
- 238000002329 infrared spectrum Methods 0.000 description 2
- 125000005429 oxyalkyl group Chemical group 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- FYSNRJHAOHDILO-UHFFFAOYSA-N thionyl chloride Chemical compound ClS(Cl)=O FYSNRJHAOHDILO-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical compound OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- 229940076442 9,10-anthraquinone Drugs 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 125000005036 alkoxyphenyl group Chemical group 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 description 1
- 150000001717 carbocyclic compounds Chemical class 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 150000002391 heterocyclic compounds Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005580 one pot reaction Methods 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- UGQZLDXDWSPAOM-UHFFFAOYSA-N pyrrolo[3,4-f]isoindole-1,3,5,7-tetrone Chemical compound C1=C2C(=O)NC(=O)C2=CC2=C1C(=O)NC2=O UGQZLDXDWSPAOM-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Polyurethanes Or Polyureas (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Priority Applications (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19742437348 DE2437348B2 (de) | 1974-08-02 | 1974-08-02 | Verfahren zur herstellung von reliefstrukturen |
| AT450775A AT359288B (de) | 1974-08-02 | 1975-06-12 | Verfahren zur herstellung von reliefstrukturen |
| US05/598,829 US4040831A (en) | 1974-08-02 | 1975-07-24 | Method for the preparation of relief structures |
| BE158565A BE831681R (fr) | 1974-08-02 | 1975-07-24 | Procede de fabrication de structures en relief |
| IT25727/75A IT1049569B (it) | 1974-08-02 | 1975-07-25 | Procedimento per formare strutture in rilievo costituite di polimeri molto resistenti al calore |
| FR7523799A FR2280925A2 (fr) | 1974-08-02 | 1975-07-30 | Procede de fabrication de structures en relief |
| NLAANVRAGE7509204,A NL180144C (nl) | 1974-08-02 | 1975-08-01 | Werkwijze ter vervaardiging van reliefstructuren uit fotopolymeren. |
| JP9412075A JPS5541422B2 (env) | 1974-08-02 | 1975-08-01 | |
| GB32364/75A GB1512973A (en) | 1974-08-02 | 1975-08-01 | Radiationsensitive prepolymers and their use for the production of relief structures |
| US05/972,432 USRE30186E (en) | 1974-08-02 | 1978-12-22 | Method for the preparation of relief structures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19742437348 DE2437348B2 (de) | 1974-08-02 | 1974-08-02 | Verfahren zur herstellung von reliefstrukturen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE2437348A1 DE2437348A1 (de) | 1976-02-19 |
| DE2437348B2 true DE2437348B2 (de) | 1976-10-07 |
Family
ID=5922319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19742437348 Granted DE2437348B2 (de) | 1974-08-02 | 1974-08-02 | Verfahren zur herstellung von reliefstrukturen |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US4040831A (env) |
| JP (1) | JPS5541422B2 (env) |
| AT (1) | AT359288B (env) |
| BE (1) | BE831681R (env) |
| DE (1) | DE2437348B2 (env) |
| FR (1) | FR2280925A2 (env) |
| GB (1) | GB1512973A (env) |
| IT (1) | IT1049569B (env) |
| NL (1) | NL180144C (env) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2914619A1 (de) * | 1978-04-14 | 1979-10-25 | Toray Industries | Lichtempfindliches material |
| EP0025506A1 (de) * | 1979-08-21 | 1981-03-25 | Siemens Aktiengesellschaft | Polyoxazol-Vorstufen, deren Herstellung und Verwendung |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1980000706A1 (fr) * | 1978-09-29 | 1980-04-17 | Hitachi Ltd | Composition polymere sensible a la lumiere |
| DE2919841A1 (de) * | 1979-05-16 | 1980-11-20 | Siemens Ag | Verfahren zur phototechnischen herstellung von reliefstrukturen |
| US4329419A (en) * | 1980-09-03 | 1982-05-11 | E. I. Du Pont De Nemours And Company | Polymeric heat resistant photopolymerizable composition for semiconductors and capacitors |
| US4369247A (en) * | 1980-09-03 | 1983-01-18 | E. I. Du Pont De Nemours And Company | Process of producing relief structures using polyamide ester resins |
| US4410612A (en) * | 1980-09-03 | 1983-10-18 | E. I. Du Pont De Nemours And Company | Electrical device formed from polymeric heat resistant photopolymerizable composition |
| US4414312A (en) * | 1980-09-03 | 1983-11-08 | E. I. Du Pont De Nemours & Co. | Photopolymerizable polyamide ester resin compositions containing an oxygen scavenger |
| JPS58223149A (ja) * | 1982-06-22 | 1983-12-24 | Toray Ind Inc | 感光性ポリイミド用現像液 |
| US4579809A (en) * | 1982-10-22 | 1986-04-01 | Ciba-Geigy Corporation | Positive image formation |
| US4548891A (en) * | 1983-02-11 | 1985-10-22 | Ciba Geigy Corporation | Photopolymerizable compositions containing prepolymers with olefin double bonds and titanium metallocene photoinitiators |
| EP0119719B1 (en) * | 1983-03-03 | 1987-05-06 | Toray Industries, Inc. | Radiation sensitive polymer composition |
| DE3411660A1 (de) * | 1984-03-29 | 1985-10-03 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung von polyimid- und polyisoindolochinazolindion-vorstufen |
| DE3513779A1 (de) * | 1985-04-17 | 1986-10-23 | Merck Patent Gmbh, 6100 Darmstadt | Stabilisierte loesungen strahlungsvernetzbarer polymervorstufen hochwaermebestaendiger polymere |
| US4741988A (en) * | 1985-05-08 | 1988-05-03 | U.S. Philips Corp. | Patterned polyimide film, a photosensitive polyamide acid derivative and an electrophoretic image-display cell |
| EP0291779B1 (de) * | 1987-05-18 | 1994-07-27 | Siemens Aktiengesellschaft | Wärmebeständige Positivresists und Verfahren zur Herstellung wärmebeständiger Reliefstrukturen |
| DE3717933A1 (de) * | 1987-05-27 | 1988-12-08 | Hoechst Ag | Photopolymerisierbares gemisch, dieses enthaltendes aufzeichnungsmaterial und verfahren zur herstellung von hochwaermebestaendigen reliefstrukturen |
| US5270431A (en) * | 1987-07-23 | 1993-12-14 | Basf Aktiengesellschaft | Preparation of oligomeric or polymeric radiation-reactive intermediates for solvent-structured layers |
| DE3808927A1 (de) * | 1988-03-17 | 1989-10-05 | Ciba Geigy Ag | Negativ-fotoresists von polyimid-typ mit 1,2-disulfonen |
| DE3837612A1 (de) * | 1988-11-05 | 1990-05-23 | Ciba Geigy Ag | Positiv-fotoresists von polyimid-typ |
| US5006488A (en) * | 1989-10-06 | 1991-04-09 | International Business Machines Corporation | High temperature lift-off process |
| DE4217688A1 (de) * | 1992-05-29 | 1993-12-02 | Basf Lacke & Farben | Durch Einwirkung von Strahlung vernetzendes Gemisch und dessen Verwendung zur Herstellung hochtemperaturbeständiger Reliefstrukturen |
| DE4218718A1 (de) * | 1992-06-06 | 1993-12-09 | Basf Lacke & Farben | Verfahren zur Herstellung strukturierter Schichten wärmebeständiger Polykondensate |
| US5756260A (en) * | 1993-02-16 | 1998-05-26 | Sumitomo Bakelite Company Limited | Photosensitive polyimide resin composition containing a stabilizer and method for formation of relief pattern using same |
| US5777068A (en) * | 1994-09-13 | 1998-07-07 | Nippon Zeon Co., Ltd. | Photosensitive polyimide resin composition |
| JP3170174B2 (ja) | 1995-04-18 | 2001-05-28 | 日本ゼオン株式会社 | ポリイミド系樹脂組成物 |
| US5886136A (en) * | 1995-09-12 | 1999-03-23 | Nippon Zeon Co., Ltd. | Pattern forming process |
| US5648451A (en) * | 1995-10-10 | 1997-07-15 | Sumitomo Bakelite Company Limited | Process for producing photosensitive resin |
| US5856065A (en) * | 1996-03-27 | 1999-01-05 | Olin Microelectronic Chemicals, Inc. | Negative working photoresist composition based on polyimide primers |
| WO1999013381A1 (en) * | 1997-09-11 | 1999-03-18 | Arch Specialty Chemicals, Inc. | A negatively acting photoresist composition based on polyimide precursors |
| US6160081A (en) * | 1997-10-31 | 2000-12-12 | Nippon Zeon Co., Ltd. | Photosensitive polyimide resin composition |
| JP4529252B2 (ja) | 1999-09-28 | 2010-08-25 | 日立化成デュポンマイクロシステムズ株式会社 | ポジ型感光性樹脂組成物、パターンの製造法及び電子部品 |
| US6511789B2 (en) | 2000-06-26 | 2003-01-28 | Arch Specialty Chemicals, Inc. | Photosensitive polyimide precursor compositions |
| US6582879B2 (en) | 2001-03-27 | 2003-06-24 | Korea Research Institute Of Chemical Technology | Reactive photo acid-generating agent and heat-resistant photoresist composition with polyamide precursor |
| WO2003038526A1 (fr) * | 2001-10-30 | 2003-05-08 | Kaneka Corporation | Composition de resine photosensible et films et stratifies photosensibles ainsi obtenus |
| EP1609024B1 (en) * | 2003-03-11 | 2015-09-30 | Fujifilm Electronic Materials USA, Inc. | Photosensitive resin compositions |
| WO2007034604A1 (ja) * | 2005-09-22 | 2007-03-29 | Hitachi Chemical Dupont Microsystems Ltd. | ネガ型感光性樹脂組成物、パターン形成方法及び電子部品 |
| KR20140009592A (ko) | 2006-03-16 | 2014-01-22 | 아사히 가라스 가부시키가이샤 | 네거티브형 감광성 함불소 방향족계 수지 조성물 |
| KR101025395B1 (ko) * | 2006-06-20 | 2011-03-28 | 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 | 네거티브형 감광성 수지 조성물, 패턴의 제조방법 및 전자부품 |
| JP5434588B2 (ja) * | 2007-03-12 | 2014-03-05 | 日立化成デュポンマイクロシステムズ株式会社 | 感光性樹脂組成物、該樹脂組成物を用いたパターン硬化膜の製造方法及び電子部品 |
| KR101275474B1 (ko) * | 2007-10-29 | 2013-06-14 | 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 | 포지티브형 감광성 수지 조성물, 패턴의 제조방법 및 전자부품 |
| KR102011084B1 (ko) | 2011-07-26 | 2019-08-14 | 제이엔씨 주식회사 | 광경화성 잉크젯 잉크, 경화막, 전자 회로 기판 및 그 제조 방법 |
| TWI636075B (zh) | 2013-05-17 | 2018-09-21 | 富士軟片電子材料美國股份有限公司 | 新穎聚合物及含有該聚合物之熱固性組成物 |
| JP7140687B2 (ja) | 2017-09-11 | 2022-09-21 | フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド | 誘電フィルム形成用組成物 |
| JP6926939B2 (ja) * | 2017-10-23 | 2021-08-25 | 東京エレクトロン株式会社 | 半導体装置の製造方法 |
| CN114787240A (zh) | 2019-10-04 | 2022-07-22 | 富士胶片电子材料美国有限公司 | 平坦化方法及组合物 |
| KR20230146530A (ko) | 2021-02-16 | 2023-10-19 | 솔베이 스페셜티 폴리머스 이태리 에스.피.에이. | 낮은 유전 손실률을 갖는 폴리이미드 |
| WO2022175169A1 (en) | 2021-02-16 | 2022-08-25 | Solvay Specialty Polymers Italy S.P.A. | Polyimides having low dielectric loss |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3475176A (en) * | 1966-09-06 | 1969-10-28 | Eastman Kodak Co | Azide sensitized photosensitive prepolymer compositions |
| US3650746A (en) * | 1969-06-16 | 1972-03-21 | Grace W R & Co | Dual image formation on separate supports of photocurable composition |
| US3858510A (en) * | 1971-03-11 | 1975-01-07 | Asahi Chemical Ind | Relief structures prepared from photosensitive compositions |
| US3801638A (en) * | 1971-03-12 | 1974-04-02 | Gaf Corp | Triacrylyldiethylenetriamine,method of producing the same,and photopolymerization process and system utilizing the same |
| BE793732A (fr) * | 1972-01-10 | 1973-05-02 | Grace W R & Co | Composition contenant un polyene et un polythiol |
| NL177718C (nl) * | 1973-02-22 | 1985-11-01 | Siemens Ag | Werkwijze ter vervaardiging van reliefstructuren uit warmte-bestendige polymeren. |
| US3847767A (en) * | 1973-03-13 | 1974-11-12 | Grace W R & Co | Method of producing a screen printable photocurable solder resist |
-
1974
- 1974-08-02 DE DE19742437348 patent/DE2437348B2/de active Granted
-
1975
- 1975-06-12 AT AT450775A patent/AT359288B/de not_active IP Right Cessation
- 1975-07-24 US US05/598,829 patent/US4040831A/en not_active Expired - Lifetime
- 1975-07-24 BE BE158565A patent/BE831681R/xx not_active IP Right Cessation
- 1975-07-25 IT IT25727/75A patent/IT1049569B/it active
- 1975-07-30 FR FR7523799A patent/FR2280925A2/fr active Granted
- 1975-08-01 GB GB32364/75A patent/GB1512973A/en not_active Expired
- 1975-08-01 NL NLAANVRAGE7509204,A patent/NL180144C/xx not_active IP Right Cessation
- 1975-08-01 JP JP9412075A patent/JPS5541422B2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2914619A1 (de) * | 1978-04-14 | 1979-10-25 | Toray Industries | Lichtempfindliches material |
| EP0025506A1 (de) * | 1979-08-21 | 1981-03-25 | Siemens Aktiengesellschaft | Polyoxazol-Vorstufen, deren Herstellung und Verwendung |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2280925B2 (env) | 1983-03-11 |
| US4040831A (en) | 1977-08-09 |
| ATA450775A (de) | 1980-03-15 |
| GB1512973A (en) | 1978-06-01 |
| IT1049569B (it) | 1981-02-10 |
| DE2437348A1 (de) | 1976-02-19 |
| AT359288B (de) | 1980-10-27 |
| JPS5140922A (env) | 1976-04-06 |
| FR2280925A2 (fr) | 1976-02-27 |
| NL7509204A (nl) | 1976-02-04 |
| NL180144B (nl) | 1986-08-01 |
| BE831681R (fr) | 1975-11-17 |
| JPS5541422B2 (env) | 1980-10-24 |
| NL180144C (nl) | 1987-01-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C3 | Grant after two publication steps (3rd publication) | ||
| E77 | Valid patent as to the heymanns-index 1977 |