AT359288B - Verfahren zur herstellung von reliefstrukturen - Google Patents

Verfahren zur herstellung von reliefstrukturen

Info

Publication number
AT359288B
AT359288B AT450775A AT450775A AT359288B AT 359288 B AT359288 B AT 359288B AT 450775 A AT450775 A AT 450775A AT 450775 A AT450775 A AT 450775A AT 359288 B AT359288 B AT 359288B
Authority
AT
Austria
Prior art keywords
relief structures
producing relief
producing
structures
relief
Prior art date
Application number
AT450775A
Other languages
English (en)
Other versions
ATA450775A (de
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of ATA450775A publication Critical patent/ATA450775A/de
Application granted granted Critical
Publication of AT359288B publication Critical patent/AT359288B/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
AT450775A 1974-08-02 1975-06-12 Verfahren zur herstellung von reliefstrukturen AT359288B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19742437348 DE2437348B2 (de) 1974-08-02 1974-08-02 Verfahren zur herstellung von reliefstrukturen

Publications (2)

Publication Number Publication Date
ATA450775A ATA450775A (de) 1980-03-15
AT359288B true AT359288B (de) 1980-10-27

Family

ID=5922319

Family Applications (1)

Application Number Title Priority Date Filing Date
AT450775A AT359288B (de) 1974-08-02 1975-06-12 Verfahren zur herstellung von reliefstrukturen

Country Status (9)

Country Link
US (1) US4040831A (de)
JP (1) JPS5541422B2 (de)
AT (1) AT359288B (de)
BE (1) BE831681R (de)
DE (1) DE2437348B2 (de)
FR (1) FR2280925A2 (de)
GB (1) GB1512973A (de)
IT (1) IT1049569B (de)
NL (1) NL180144C (de)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5952822B2 (ja) * 1978-04-14 1984-12-21 東レ株式会社 耐熱性感光材料
DE2967162D1 (en) * 1978-09-29 1984-09-13 Hitachi Ltd Light-sensitive polymer composition
DE2919841A1 (de) * 1979-05-16 1980-11-20 Siemens Ag Verfahren zur phototechnischen herstellung von reliefstrukturen
DE2933828A1 (de) * 1979-08-21 1981-03-12 Siemens AG, 1000 Berlin und 8000 München Polyoxazol-vorstufen sowie deren herstellung.
US4369247A (en) * 1980-09-03 1983-01-18 E. I. Du Pont De Nemours And Company Process of producing relief structures using polyamide ester resins
US4329419A (en) * 1980-09-03 1982-05-11 E. I. Du Pont De Nemours And Company Polymeric heat resistant photopolymerizable composition for semiconductors and capacitors
US4410612A (en) * 1980-09-03 1983-10-18 E. I. Du Pont De Nemours And Company Electrical device formed from polymeric heat resistant photopolymerizable composition
US4414312A (en) * 1980-09-03 1983-11-08 E. I. Du Pont De Nemours & Co. Photopolymerizable polyamide ester resin compositions containing an oxygen scavenger
JPS58223149A (ja) * 1982-06-22 1983-12-24 Toray Ind Inc 感光性ポリイミド用現像液
US4579809A (en) * 1982-10-22 1986-04-01 Ciba-Geigy Corporation Positive image formation
US4548891A (en) * 1983-02-11 1985-10-22 Ciba Geigy Corporation Photopolymerizable compositions containing prepolymers with olefin double bonds and titanium metallocene photoinitiators
DE3463576D1 (en) * 1983-03-03 1987-06-11 Toray Industries Radiation sensitive polymer composition
DE3411660A1 (de) * 1984-03-29 1985-10-03 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von polyimid- und polyisoindolochinazolindion-vorstufen
DE3513779A1 (de) * 1985-04-17 1986-10-23 Merck Patent Gmbh, 6100 Darmstadt Stabilisierte loesungen strahlungsvernetzbarer polymervorstufen hochwaermebestaendiger polymere
US4741988A (en) * 1985-05-08 1988-05-03 U.S. Philips Corp. Patterned polyimide film, a photosensitive polyamide acid derivative and an electrophoretic image-display cell
EP0291779B1 (de) * 1987-05-18 1994-07-27 Siemens Aktiengesellschaft Wärmebeständige Positivresists und Verfahren zur Herstellung wärmebeständiger Reliefstrukturen
DE3717933A1 (de) * 1987-05-27 1988-12-08 Hoechst Ag Photopolymerisierbares gemisch, dieses enthaltendes aufzeichnungsmaterial und verfahren zur herstellung von hochwaermebestaendigen reliefstrukturen
US5270431A (en) * 1987-07-23 1993-12-14 Basf Aktiengesellschaft Preparation of oligomeric or polymeric radiation-reactive intermediates for solvent-structured layers
DE3808927A1 (de) * 1988-03-17 1989-10-05 Ciba Geigy Ag Negativ-fotoresists von polyimid-typ mit 1,2-disulfonen
DE3837612A1 (de) * 1988-11-05 1990-05-23 Ciba Geigy Ag Positiv-fotoresists von polyimid-typ
US5006488A (en) * 1989-10-06 1991-04-09 International Business Machines Corporation High temperature lift-off process
DE4217688A1 (de) * 1992-05-29 1993-12-02 Basf Lacke & Farben Durch Einwirkung von Strahlung vernetzendes Gemisch und dessen Verwendung zur Herstellung hochtemperaturbeständiger Reliefstrukturen
DE4218718A1 (de) * 1992-06-06 1993-12-09 Basf Lacke & Farben Verfahren zur Herstellung strukturierter Schichten wärmebeständiger Polykondensate
US5756260A (en) * 1993-02-16 1998-05-26 Sumitomo Bakelite Company Limited Photosensitive polyimide resin composition containing a stabilizer and method for formation of relief pattern using same
US5777068A (en) * 1994-09-13 1998-07-07 Nippon Zeon Co., Ltd. Photosensitive polyimide resin composition
JP3170174B2 (ja) 1995-04-18 2001-05-28 日本ゼオン株式会社 ポリイミド系樹脂組成物
US5886136A (en) * 1995-09-12 1999-03-23 Nippon Zeon Co., Ltd. Pattern forming process
US5648451A (en) * 1995-10-10 1997-07-15 Sumitomo Bakelite Company Limited Process for producing photosensitive resin
US5856065A (en) * 1996-03-27 1999-01-05 Olin Microelectronic Chemicals, Inc. Negative working photoresist composition based on polyimide primers
EP1012672B1 (de) * 1997-09-11 2003-08-13 Arch Specialty Chemicals, Inc. Eine negativ arbeitende fotoresistzusammensetzung auf basis von polyimid-vorläufern
US6160081A (en) * 1997-10-31 2000-12-12 Nippon Zeon Co., Ltd. Photosensitive polyimide resin composition
JP4529252B2 (ja) 1999-09-28 2010-08-25 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、パターンの製造法及び電子部品
US6511789B2 (en) 2000-06-26 2003-01-28 Arch Specialty Chemicals, Inc. Photosensitive polyimide precursor compositions
US6582879B2 (en) 2001-03-27 2003-06-24 Korea Research Institute Of Chemical Technology Reactive photo acid-generating agent and heat-resistant photoresist composition with polyamide precursor
CN1324402C (zh) * 2001-10-30 2007-07-04 钟渊化学工业株式会社 感光性树脂组合物、使用该组合物的感光性薄膜及层压体
EP1609024B1 (de) * 2003-03-11 2015-09-30 Fujifilm Electronic Materials USA, Inc. Lichtempfindliche harzzusammensetzungen
TWI407255B (zh) * 2005-09-22 2013-09-01 Hitachi Chem Dupont Microsys 負片型感光性樹脂組成物、圖案形成方法以及電子零件
CN101405655B (zh) * 2006-03-16 2013-02-06 旭硝子株式会社 负型感光性含氟芳香族类树脂组合物
WO2007148384A1 (ja) * 2006-06-20 2007-12-27 Hitachi Chemical Dupont Microsystems Ltd. ネガ型感光性樹脂組成物、パターンの製造方法及び電子部品
WO2008111470A1 (ja) * 2007-03-12 2008-09-18 Hitachi Chemical Dupont Microsystems, Ltd. 感光性樹脂組成物、該樹脂組成物を用いたパターン硬化膜の製造方法及び電子部品
JP5316417B2 (ja) * 2007-10-29 2013-10-16 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品
JP6028731B2 (ja) 2011-07-26 2016-11-16 Jnc株式会社 光硬化性インクジェットインクおよび電子回路基板
TWI636075B (zh) 2013-05-17 2018-09-21 富士軟片電子材料美國股份有限公司 新穎聚合物及含有該聚合物之熱固性組成物
EP3478777B1 (de) 2017-09-11 2020-11-18 FUJIFILM Electronic Materials U.S.A., Inc. Zusammensetzung zur formung dielektrischer filme
JP6926939B2 (ja) * 2017-10-23 2021-08-25 東京エレクトロン株式会社 半導体装置の製造方法
WO2021067547A1 (en) 2019-10-04 2021-04-08 Fujifilm Electronic Materials U.S.A., Inc. Planarizing process and composition
US20240150524A1 (en) 2021-02-16 2024-05-09 Solvay Specialty Polymers Italy S.P.A. Polyimides having low dielectric loss
JP2024507156A (ja) 2021-02-16 2024-02-16 ソルベイ スペシャルティ ポリマーズ イタリー エス．ピー．エー． 低い誘電損失を有するポリイミド

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3475176A (en) * 1966-09-06 1969-10-28 Eastman Kodak Co Azide sensitized photosensitive prepolymer compositions
US3650746A (en) * 1969-06-16 1972-03-21 Grace W R & Co Dual image formation on separate supports of photocurable composition
US3858510A (en) * 1971-03-11 1975-01-07 Asahi Chemical Ind Relief structures prepared from photosensitive compositions
US3801638A (en) * 1971-03-12 1974-04-02 Gaf Corp Triacrylyldiethylenetriamine,method of producing the same,and photopolymerization process and system utilizing the same
BE793732A (fr) * 1972-01-10 1973-05-02 Grace W R & Co Composition contenant un polyene et un polythiol
NL177718C (nl) * 1973-02-22 1985-11-01 Siemens Ag Werkwijze ter vervaardiging van reliefstructuren uit warmte-bestendige polymeren.
US3847767A (en) * 1973-03-13 1974-11-12 Grace W R & Co Method of producing a screen printable photocurable solder resist

Also Published As

Publication number Publication date
NL180144C (nl) 1987-01-02
ATA450775A (de) 1980-03-15
FR2280925B2 (de) 1983-03-11
DE2437348B2 (de) 1976-10-07
JPS5541422B2 (de) 1980-10-24
FR2280925A2 (fr) 1976-02-27
BE831681R (fr) 1975-11-17
NL180144B (nl) 1986-08-01
GB1512973A (en) 1978-06-01
JPS5140922A (de) 1976-04-06
IT1049569B (it) 1981-02-10
NL7509204A (nl) 1976-02-04
US4040831A (en) 1977-08-09
DE2437348A1 (de) 1976-02-19

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Legal Events

Date Code Title Description
ELA Expired due to lapse of time
EFA Change in the company name