DE2400863B2 - Verfahren zur Kontaktierung der Elektroden eines scheibenförmigen Halbleiterelementes - Google Patents

Verfahren zur Kontaktierung der Elektroden eines scheibenförmigen Halbleiterelementes

Info

Publication number
DE2400863B2
DE2400863B2 DE2400863A DE2400863A DE2400863B2 DE 2400863 B2 DE2400863 B2 DE 2400863B2 DE 2400863 A DE2400863 A DE 2400863A DE 2400863 A DE2400863 A DE 2400863A DE 2400863 B2 DE2400863 B2 DE 2400863B2
Authority
DE
Germany
Prior art keywords
semiconductor element
sheet metal
contacting
electrodes
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE2400863A
Other languages
German (de)
English (en)
Other versions
DE2400863A1 (de
Inventor
Altan 6148 Heppenheim Akyurek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Germany
Original Assignee
BBC Brown Boveri AG Germany
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Germany filed Critical BBC Brown Boveri AG Germany
Priority to DE2400863A priority Critical patent/DE2400863B2/de
Priority to CH1462474A priority patent/CH570702A5/xx
Priority to FR7500378A priority patent/FR2257147A1/fr
Publication of DE2400863A1 publication Critical patent/DE2400863A1/de
Publication of DE2400863B2 publication Critical patent/DE2400863B2/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3185—Partial encapsulation or coating the coating covering also the sidewalls of the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01076—Osmium [Os]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H01L2924/13033—TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Thyristors (AREA)
DE2400863A 1974-01-09 1974-01-09 Verfahren zur Kontaktierung der Elektroden eines scheibenförmigen Halbleiterelementes Withdrawn DE2400863B2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE2400863A DE2400863B2 (de) 1974-01-09 1974-01-09 Verfahren zur Kontaktierung der Elektroden eines scheibenförmigen Halbleiterelementes
CH1462474A CH570702A5 (enExample) 1974-01-09 1974-10-31
FR7500378A FR2257147A1 (en) 1974-01-09 1975-01-07 Semiconductor component contacting with comb-shaped connector - uses lead coated support of thermally and electrically conductive material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2400863A DE2400863B2 (de) 1974-01-09 1974-01-09 Verfahren zur Kontaktierung der Elektroden eines scheibenförmigen Halbleiterelementes

Publications (2)

Publication Number Publication Date
DE2400863A1 DE2400863A1 (de) 1975-07-17
DE2400863B2 true DE2400863B2 (de) 1980-04-24

Family

ID=5904412

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2400863A Withdrawn DE2400863B2 (de) 1974-01-09 1974-01-09 Verfahren zur Kontaktierung der Elektroden eines scheibenförmigen Halbleiterelementes

Country Status (3)

Country Link
CH (1) CH570702A5 (enExample)
DE (1) DE2400863B2 (enExample)
FR (1) FR2257147A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3137570A1 (de) * 1980-09-25 1983-03-31 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum direkten verbinden von kupferteilen mit oxidkeramiksubstraten
DE102006050291B4 (de) * 2005-10-25 2015-04-02 Infineon Technologies Ag Elektronische Baugruppe und Verfahren, um diese zu bestücken

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2801287C3 (de) * 1978-01-13 1981-03-26 Brown, Boveri & Cie Ag, 6800 Mannheim Lackdosiervorrichtung

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3137570A1 (de) * 1980-09-25 1983-03-31 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum direkten verbinden von kupferteilen mit oxidkeramiksubstraten
DE102006050291B4 (de) * 2005-10-25 2015-04-02 Infineon Technologies Ag Elektronische Baugruppe und Verfahren, um diese zu bestücken

Also Published As

Publication number Publication date
CH570702A5 (enExample) 1975-12-15
FR2257147B1 (enExample) 1978-07-13
DE2400863A1 (de) 1975-07-17
FR2257147A1 (en) 1975-08-01

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Legal Events

Date Code Title Description
8230 Patent withdrawn