FR2257147A1 - Semiconductor component contacting with comb-shaped connector - uses lead coated support of thermally and electrically conductive material - Google Patents
Semiconductor component contacting with comb-shaped connector - uses lead coated support of thermally and electrically conductive materialInfo
- Publication number
- FR2257147A1 FR2257147A1 FR7500378A FR7500378A FR2257147A1 FR 2257147 A1 FR2257147 A1 FR 2257147A1 FR 7500378 A FR7500378 A FR 7500378A FR 7500378 A FR7500378 A FR 7500378A FR 2257147 A1 FR2257147 A1 FR 2257147A1
- Authority
- FR
- France
- Prior art keywords
- comb
- thermally
- conductive material
- electrically conductive
- semiconductor component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3185—Partial encapsulation or coating the coating covering also the sidewalls of the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01076—Osmium [Os]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
- H01L2924/13033—TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Thyristors (AREA)
Abstract
Disc shaped semiconductor elements as component parts in semiconductor devices have their electrodes contacted by a comb with contact tines. The process is based by mutually aligning and fixing by thermo-compression, the semiconductor element, a support for the element main surface with a precoating of lead of thermally and electrically conductive material, and a comb of cooling fins. The other main surface of the semiconductor element is provided with a double comb of two comb elements of different sheet metal thickness. The comb tines and its contact fins are contacted to the semiconductor element electrodes and the device with fixed connecting terminal and cooling fins is severed from the comb system.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2400863A DE2400863B2 (en) | 1974-01-09 | 1974-01-09 | Method for contacting the electrodes of a disk-shaped semiconductor element |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2257147A1 true FR2257147A1 (en) | 1975-08-01 |
FR2257147B1 FR2257147B1 (en) | 1978-07-13 |
Family
ID=5904412
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7500378A Granted FR2257147A1 (en) | 1974-01-09 | 1975-01-07 | Semiconductor component contacting with comb-shaped connector - uses lead coated support of thermally and electrically conductive material |
Country Status (3)
Country | Link |
---|---|
CH (1) | CH570702A5 (en) |
DE (1) | DE2400863B2 (en) |
FR (1) | FR2257147A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2801287C3 (en) * | 1978-01-13 | 1981-03-26 | Brown, Boveri & Cie Ag, 6800 Mannheim | Paint dosing device |
DE3137570A1 (en) * | 1980-09-25 | 1983-03-31 | Brown, Boveri & Cie Ag, 6800 Mannheim | Method of directly bonding copper parts to oxide-ceramic substrates |
US7443014B2 (en) * | 2005-10-25 | 2008-10-28 | Infineon Technologies Ag | Electronic module and method of assembling the same |
-
1974
- 1974-01-09 DE DE2400863A patent/DE2400863B2/en not_active Withdrawn
- 1974-10-31 CH CH1462474A patent/CH570702A5/xx not_active IP Right Cessation
-
1975
- 1975-01-07 FR FR7500378A patent/FR2257147A1/en active Granted
Also Published As
Publication number | Publication date |
---|---|
FR2257147B1 (en) | 1978-07-13 |
DE2400863B2 (en) | 1980-04-24 |
DE2400863A1 (en) | 1975-07-17 |
CH570702A5 (en) | 1975-12-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |