FR2257147B1 - - Google Patents

Info

Publication number
FR2257147B1
FR2257147B1 FR7500378A FR7500378A FR2257147B1 FR 2257147 B1 FR2257147 B1 FR 2257147B1 FR 7500378 A FR7500378 A FR 7500378A FR 7500378 A FR7500378 A FR 7500378A FR 2257147 B1 FR2257147 B1 FR 2257147B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7500378A
Other languages
French (fr)
Other versions
FR2257147A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
Original Assignee
BBC Brown Boveri AG Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Switzerland filed Critical BBC Brown Boveri AG Switzerland
Publication of FR2257147A1 publication Critical patent/FR2257147A1/fr
Application granted granted Critical
Publication of FR2257147B1 publication Critical patent/FR2257147B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/141—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being on at least the sidewalls of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
FR7500378A 1974-01-09 1975-01-07 Semiconductor component contacting with comb-shaped connector - uses lead coated support of thermally and electrically conductive material Granted FR2257147A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2400863A DE2400863B2 (de) 1974-01-09 1974-01-09 Verfahren zur Kontaktierung der Elektroden eines scheibenförmigen Halbleiterelementes

Publications (2)

Publication Number Publication Date
FR2257147A1 FR2257147A1 (en) 1975-08-01
FR2257147B1 true FR2257147B1 (enExample) 1978-07-13

Family

ID=5904412

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7500378A Granted FR2257147A1 (en) 1974-01-09 1975-01-07 Semiconductor component contacting with comb-shaped connector - uses lead coated support of thermally and electrically conductive material

Country Status (3)

Country Link
CH (1) CH570702A5 (enExample)
DE (1) DE2400863B2 (enExample)
FR (1) FR2257147A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2801287C3 (de) * 1978-01-13 1981-03-26 Brown, Boveri & Cie Ag, 6800 Mannheim Lackdosiervorrichtung
DE3137570A1 (de) * 1980-09-25 1983-03-31 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum direkten verbinden von kupferteilen mit oxidkeramiksubstraten
US7443014B2 (en) * 2005-10-25 2008-10-28 Infineon Technologies Ag Electronic module and method of assembling the same

Also Published As

Publication number Publication date
FR2257147A1 (en) 1975-08-01
CH570702A5 (enExample) 1975-12-15
DE2400863B2 (de) 1980-04-24
DE2400863A1 (de) 1975-07-17

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Legal Events

Date Code Title Description
ST Notification of lapse