DE2204884A1 - Bad zur chemischen Abscheidung von Kadmium und Kadmium/Kupferlegierungen - Google Patents

Bad zur chemischen Abscheidung von Kadmium und Kadmium/Kupferlegierungen

Info

Publication number
DE2204884A1
DE2204884A1 DE19722204884 DE2204884A DE2204884A1 DE 2204884 A1 DE2204884 A1 DE 2204884A1 DE 19722204884 DE19722204884 DE 19722204884 DE 2204884 A DE2204884 A DE 2204884A DE 2204884 A1 DE2204884 A1 DE 2204884A1
Authority
DE
Germany
Prior art keywords
bath
cadmium
copper
bath according
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19722204884
Other languages
German (de)
English (en)
Inventor
Charles Raymond; Gulla Michael; Newton; Dutkewych Oleh Borys Medfield; Mass. Shipley (V.St.A.). P
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Publication of DE2204884A1 publication Critical patent/DE2204884A1/de
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
DE19722204884 1971-03-12 1972-02-02 Bad zur chemischen Abscheidung von Kadmium und Kadmium/Kupferlegierungen Pending DE2204884A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12384071A 1971-03-12 1971-03-12

Publications (1)

Publication Number Publication Date
DE2204884A1 true DE2204884A1 (de) 1972-09-28

Family

ID=22411207

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19722204884 Pending DE2204884A1 (de) 1971-03-12 1972-02-02 Bad zur chemischen Abscheidung von Kadmium und Kadmium/Kupferlegierungen

Country Status (5)

Country Link
US (1) US3677776A (enExample)
JP (1) JPS4844133A (enExample)
DE (1) DE2204884A1 (enExample)
FR (1) FR2128350B1 (enExample)
GB (1) GB1343747A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040226407A1 (en) * 2003-05-14 2004-11-18 David Ericson Method and apparatus for converting metal ion in solution to the metal state

Also Published As

Publication number Publication date
JPS4844133A (enExample) 1973-06-25
FR2128350A1 (enExample) 1972-10-20
US3677776A (en) 1972-07-18
FR2128350B1 (enExample) 1975-04-11
GB1343747A (en) 1974-01-16

Similar Documents

Publication Publication Date Title
DE69224914T2 (de) Stromloses goldbeschichtungsbad
DE2049061B2 (de) Alkalisches wäßriges Bad und dessen Verwendung zur stromlosen Verkupferung
DE2457829A1 (de) Verfahren und loesungen fuer die stromlose metallauftragung
DE3000526A1 (de) Bad zur stromlosen abscheidung von palladium, autokatalytisches palladium- abscheidungsverfahren und palladium-legierung
DE1966198C3 (de) Wäßriges Bad zur chemischen Abscheidung duktiler KupferOberzüge
DE2248693B2 (de) Alkalisches Bad zur stromlosen Abscheidung von metallischem Silber auf einer Oberfläche und Verfahren zur Herstellung der Versilberungslösung
DE2559059C3 (de) Stabilisiertes Bad für die stromlose Metallabscheidung
DE2627941C2 (de) Aktivierungslösung zum stromlosen Verkupfern auf der Basis eines Silbersalzes
DE1247804B (de) Alkalisches Bad zum chemischen Abscheiden von festhaftenden Palladiumueberzuegen
DE69706173T2 (de) Verfahren zur reduktion von kupferoxid
EP0152601B1 (de) Wässriges alkalisches Bad zur Chemischen Abscheidung von Kupfer oder Nickel
DE2204884A1 (de) Bad zur chemischen Abscheidung von Kadmium und Kadmium/Kupferlegierungen
DE2057757C3 (de) Badlösung zum stromlosen Abscheiden von Metallen
DE69506344T2 (de) Goldlösung für stromloses Plattieren
DE3238921C2 (de) Bad zur stromlosen Abscheidung von Kupfer auf einem Substrat und Verfahren zur stromlosen Abscheidung
DE2635397C3 (de) Stromlos arbeitende Verkupferungsbäder
DE69427680T2 (de) Chemisches Palladium-Ätzmittel
DE1521043A1 (de) Verfahren zur Herstellung von Gold-Palladiumueberzuegen und Elektrolytloesung dafuer
DE1521512B1 (de) Alkalisches Bad zur stromlosen Kupferabscheidung
EP1763594B1 (de) Verfahren zur verbesserung der lötbarkeit von nickelüberzügen
DE69501528T2 (de) Nichtelektrolytische Goldplattierlösung
DE3737778C2 (de) Lösung für stromlose Verkupferung und Verfahren zur stromlosen Verkupferung
DE2557125C3 (de) Lösungen zum Aktivieren von Oberflächen
DE1966580C3 (de) Wäßriges Bad zur stromlosen Abscheidung duktiler KupferUberzüge
DE2434638C3 (de) Verfahren zur Herstellung einer Lösung zur Sensibilisierung von Oberflächen