DE69706173T2 - Verfahren zur reduktion von kupferoxid - Google Patents

Verfahren zur reduktion von kupferoxid

Info

Publication number
DE69706173T2
DE69706173T2 DE69706173T DE69706173T DE69706173T2 DE 69706173 T2 DE69706173 T2 DE 69706173T2 DE 69706173 T DE69706173 T DE 69706173T DE 69706173 T DE69706173 T DE 69706173T DE 69706173 T2 DE69706173 T2 DE 69706173T2
Authority
DE
Germany
Prior art keywords
copper oxide
reducing copper
reducing
oxide
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69706173T
Other languages
English (en)
Other versions
DE69706173D1 (de
Inventor
A Corella
M Neigh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF SE
Original Assignee
MSA Safety Inc
Mine Safety Appliances Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MSA Safety Inc, Mine Safety Appliances Co filed Critical MSA Safety Inc
Publication of DE69706173D1 publication Critical patent/DE69706173D1/de
Application granted granted Critical
Publication of DE69706173T2 publication Critical patent/DE69706173T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G3/00—Compounds of copper
    • C01G3/02—Oxides; Hydroxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C23C22/63—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/82—After-treatment
    • C23C22/83—Chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/60—Optical properties, e.g. expressed in CIELAB-values
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemical Treatment Of Metals (AREA)
DE69706173T 1996-06-27 1997-06-16 Verfahren zur reduktion von kupferoxid Expired - Lifetime DE69706173T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08673201 US5750087B1 (en) 1996-06-27 1996-06-27 Process for the reduction of copper oxide
PCT/US1997/010530 WO1997049841A1 (en) 1996-06-27 1997-06-16 Process for the reduction of copper oxide

Publications (2)

Publication Number Publication Date
DE69706173D1 DE69706173D1 (de) 2001-09-20
DE69706173T2 true DE69706173T2 (de) 2001-11-29

Family

ID=24701694

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69706173T Expired - Lifetime DE69706173T2 (de) 1996-06-27 1997-06-16 Verfahren zur reduktion von kupferoxid

Country Status (7)

Country Link
US (2) US5750087B1 (de)
EP (1) EP0907763B1 (de)
JP (1) JP4212649B2 (de)
KR (1) KR100357427B1 (de)
AU (1) AU3399997A (de)
DE (1) DE69706173T2 (de)
WO (1) WO1997049841A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5753309A (en) * 1995-12-19 1998-05-19 Surface Tek Specialty Products, Inc. Composition and method for reducing copper oxide to metallic copper
ATE256085T1 (de) * 1997-07-10 2003-12-15 Morton Int Inc Verfahren zur reduktion von kupferoxid zu metallischem kupfer
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
KR100369489B1 (ko) * 1998-02-20 2003-04-10 모르톤 인터내쇼날 인코포레이티드 구리산화물을구리금속으로환원시키기위한조성물및방법
US6794288B1 (en) 2003-05-05 2004-09-21 Blue29 Corporation Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activation
KR101730983B1 (ko) 2010-07-06 2017-04-27 나믹스 코포레이션 인쇄회로기판에서 사용하기 위한 유기 기판에의 접착을 향상시키는 구리 표면의 처리 방법
CN106879193A (zh) 2010-07-06 2017-06-20 埃托特克德国有限公司 处理金属表面的方法
CN102351237A (zh) * 2011-07-05 2012-02-15 宁波大学 一种纳米氧化铜的制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61176192A (ja) * 1985-01-31 1986-08-07 株式会社日立製作所 銅と樹脂との接着方法
US5059243A (en) * 1989-04-28 1991-10-22 International Business Machines Corporation Tetra aza ligand systems as complexing agents for electroless deposition of copper
JPH069309B2 (ja) * 1989-09-22 1994-02-02 株式会社日立製作所 プリント回路板、その製造方法および製造装置
JPH0496293A (ja) * 1990-08-03 1992-03-27 Risho Kogyo Co Ltd 多層印刷回路用基板の製造法
IT1256851B (it) * 1992-01-21 1995-12-27 Procedimento per promuovere l'aderenza fra diversi strati nella fabbricazione di circuiti stampati multistrato. e composizioni per l'attuazione di tale procedimento.

Also Published As

Publication number Publication date
US5750087A (en) 1998-05-12
KR20000016711A (ko) 2000-03-25
AU3399997A (en) 1998-01-14
JP4212649B2 (ja) 2009-01-21
EP0907763B1 (de) 2001-08-16
DE69706173D1 (de) 2001-09-20
KR100357427B1 (ko) 2003-01-15
WO1997049841A1 (en) 1997-12-31
US20010003579A1 (en) 2001-06-14
JP2000513410A (ja) 2000-10-10
US5750087B1 (en) 1999-12-14
EP0907763A1 (de) 1999-04-14

Similar Documents

Publication Publication Date Title
DE59703453D1 (de) Verfahren zur reduktion von stickoxiden
DE69709061T2 (de) Verfahren zur umsetzung von ethylbenzol
DE69939070D1 (de) Verfahren zur quantifizierung von menschlicher wachsamkeit
DE69727395D1 (de) Verfahren zur olefinisomerisierung
DE69705552D1 (de) Verfahren zur Plasmaverarbeitung
DE69535022D1 (de) Verfahren zur verbesserung von destillat
DE69513987D1 (de) Verfahren zur transesterifikation
DE69725000D1 (de) Verfahren zur druckformung von gegenständen
DE69715424T2 (de) Verfahren zur halogenierung von isoolefin-para-alkylstyrol-copolymeren
DE59900006D1 (de) Verfahren zur Isolierung von gekrümmten Flächen
DE69719722D1 (de) Verfahren zur identifizierung von beweglichen objekten
ATA124894A (de) Verfahren zur direktreduktion von eisenoxidhältigem material
DE59902987D1 (de) Verfahren zur verringerung von verlusten beim kommutierungsvorgang
DE69529343T2 (de) Verfahren zur isolierung von mesophasepech
DE69835231D1 (de) Verfahren zur herstellung von aluminiumoxid
DE69430338D1 (de) Verfahren zur Spectrometrie
DE69709695T2 (de) Verfahren zur seitenzusammensetzung
DE59709197D1 (de) Verfahren zur stromregelung
DE69706173D1 (de) Verfahren zur reduktion von kupferoxid
ATA96197A (de) Verfahren zur reinigung von schadstoffbelasteten gasen
DE59507436D1 (de) Verfahren zur direktreduktion von eisenoxidhältigem material
DE69803178T2 (de) Verfahren zur reduktion von 1-substituierte-3-hydroxymethyl-4-(4-fluorophenyl) tetrahydropyridine
DE69809209T2 (de) Verfahren zur rückgewinnung von fluorwasserstoff
ATE206392T1 (de) Verfahren zur alkylierug von gehinderten sulfonamiden
DE69526841T2 (de) Verfahren zur Wiedergabe

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: BASF AG, 67063 LUDWIGSHAFEN, DE

8327 Change in the person/name/address of the patent owner

Owner name: BASF SE, 67063 LUDWIGSHAFEN, DE