IT1256851B - Procedimento per promuovere l'aderenza fra diversi strati nella fabbricazione di circuiti stampati multistrato. e composizioni per l'attuazione di tale procedimento. - Google Patents

Procedimento per promuovere l'aderenza fra diversi strati nella fabbricazione di circuiti stampati multistrato. e composizioni per l'attuazione di tale procedimento.

Info

Publication number
IT1256851B
IT1256851B ITTO920036A ITTO920036A IT1256851B IT 1256851 B IT1256851 B IT 1256851B IT TO920036 A ITTO920036 A IT TO920036A IT TO920036 A ITTO920036 A IT TO920036A IT 1256851 B IT1256851 B IT 1256851B
Authority
IT
Italy
Prior art keywords
procedure
multilayer printed
printed circuits
compound
manufacture
Prior art date
Application number
ITTO920036A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to ITTO920036A priority Critical patent/IT1256851B/it
Publication of ITTO920036A0 publication Critical patent/ITTO920036A0/it
Priority to EP93200073A priority patent/EP0552830B1/fr
Priority to DE69302104T priority patent/DE69302104T2/de
Publication of ITTO920036A1 publication Critical patent/ITTO920036A1/it
Application granted granted Critical
Publication of IT1256851B publication Critical patent/IT1256851B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C23C22/63—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/82—After-treatment
    • C23C22/83—Chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

Un procedimento ed una composizione per il trattamento delle superfici di rame, allo scopo di promuovere l'aderenza fra i diversi strati, nella fabbricazione di circuiti stampati multistrato rigidi, flessibili o flessorigidi, per mezzo della formazione di uno strato di ossido sulle superfici di rame, e di un successivo trattamento di riduzione dell'ossido di rame in una soluzione che contiene nella sua composizione dimetilaminoborano ed una base forte (quale un idrossido di sodio o di potassio), in cui la soluzione di riduzione contiene inoltre un composto avente funzione stabilizzante e rallentante, scelto nel gruppo che comprende, isolatamente od in miscela, un alchilbenzensolfonato alcalino caratterizzato dalla formula generale C6H3.R.R'.SO3.X, un composto della tiourea o analogo caratterizzato dalla formula generale C.Y.N2.R1.R2.R3.R4, od un composto della tiourea con acidi organici od inorganici. Preferibilmente detto composto è costituito da sodio xilensolfonato oppure da tiourea. L'invenzione concerne altresì i procedimenti per la fabbricazione di circuiti stampati multistrato includenti il suddetto trattamento, e le soluzioni destinate a permettere l'esecuzione di questi procedimenti.
ITTO920036A 1992-01-21 1992-01-21 Procedimento per promuovere l'aderenza fra diversi strati nella fabbricazione di circuiti stampati multistrato. e composizioni per l'attuazione di tale procedimento. IT1256851B (it)

Priority Applications (3)

Application Number Priority Date Filing Date Title
ITTO920036A IT1256851B (it) 1992-01-21 1992-01-21 Procedimento per promuovere l'aderenza fra diversi strati nella fabbricazione di circuiti stampati multistrato. e composizioni per l'attuazione di tale procedimento.
EP93200073A EP0552830B1 (fr) 1992-01-21 1993-01-13 Procédé pour promouvoir l'adhérence entre différentes couches dans la fabrication des circuits imprimés feuilletés, et compositions pour la mise-en-oeuvre de ce procédé
DE69302104T DE69302104T2 (de) 1992-01-21 1993-01-13 Verfahren zur Verbesserung der Adhäsion zwischen verschiedenen Schichten in der Herstellung laminierter Leiterplatten und Zusammensetzungen zur Durchführung des Verfahrens

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITTO920036A IT1256851B (it) 1992-01-21 1992-01-21 Procedimento per promuovere l'aderenza fra diversi strati nella fabbricazione di circuiti stampati multistrato. e composizioni per l'attuazione di tale procedimento.

Publications (3)

Publication Number Publication Date
ITTO920036A0 ITTO920036A0 (it) 1992-01-21
ITTO920036A1 ITTO920036A1 (it) 1993-07-21
IT1256851B true IT1256851B (it) 1995-12-27

Family

ID=11409914

Family Applications (1)

Application Number Title Priority Date Filing Date
ITTO920036A IT1256851B (it) 1992-01-21 1992-01-21 Procedimento per promuovere l'aderenza fra diversi strati nella fabbricazione di circuiti stampati multistrato. e composizioni per l'attuazione di tale procedimento.

Country Status (3)

Country Link
EP (1) EP0552830B1 (it)
DE (1) DE69302104T2 (it)
IT (1) IT1256851B (it)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5900186A (en) * 1995-12-19 1999-05-04 Morton International, Inc. Composition and method for reducing copper oxide to metallic copper
US5750087B1 (en) * 1996-06-27 1999-12-14 Mine Safety Appliances Co Process for the reduction of copper oxide
KR100375589B1 (ko) * 1997-07-10 2003-06-09 모르톤 인터내쇼날 인코포레이티드 구리산화물을구리금속으로환원시키기위한조성물및방법
KR100369489B1 (ko) * 1998-02-20 2003-04-10 모르톤 인터내쇼날 인코포레이티드 구리산화물을구리금속으로환원시키기위한조성물및방법
US9345149B2 (en) 2010-07-06 2016-05-17 Esionic Corp. Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1287885B (it) * 1964-05-27
DE3144157A1 (de) * 1981-11-06 1983-05-19 Standard Elektrik Lorenz Ag, 7000 Stuttgart Desoxidationsmittel
JPS61176192A (ja) * 1985-01-31 1986-08-07 株式会社日立製作所 銅と樹脂との接着方法
JPH0713304B2 (ja) * 1987-12-14 1995-02-15 日立化成工業株式会社 銅の表面処理法

Also Published As

Publication number Publication date
ITTO920036A0 (it) 1992-01-21
ITTO920036A1 (it) 1993-07-21
DE69302104T2 (de) 1996-10-24
DE69302104D1 (de) 1996-05-15
EP0552830A1 (fr) 1993-07-28
EP0552830B1 (fr) 1996-04-10

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19990125