ITTO920036A1 - Procedimento per promuovere l'aderenza fra diversi strati nella fabbricazione di circuiti stampati multistrato. e composizioni per l'attuazione di tale procedimento. - Google Patents
Procedimento per promuovere l'aderenza fra diversi strati nella fabbricazione di circuiti stampati multistrato. e composizioni per l'attuazione di tale procedimento.Info
- Publication number
- ITTO920036A1 ITTO920036A1 IT000036A ITTO920036A ITTO920036A1 IT TO920036 A1 ITTO920036 A1 IT TO920036A1 IT 000036 A IT000036 A IT 000036A IT TO920036 A ITTO920036 A IT TO920036A IT TO920036 A1 ITTO920036 A1 IT TO920036A1
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- adherence
- promote
- compositions
- implementation
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
- C23C22/63—Treatment of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/82—After-treatment
- C23C22/83—Chemical after-treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1157—Using means for chemical reduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITTO920036A IT1256851B (it) | 1992-01-21 | 1992-01-21 | Procedimento per promuovere l'aderenza fra diversi strati nella fabbricazione di circuiti stampati multistrato. e composizioni per l'attuazione di tale procedimento. |
EP93200073A EP0552830B1 (fr) | 1992-01-21 | 1993-01-13 | Procédé pour promouvoir l'adhérence entre différentes couches dans la fabrication des circuits imprimés feuilletés, et compositions pour la mise-en-oeuvre de ce procédé |
DE69302104T DE69302104T2 (de) | 1992-01-21 | 1993-01-13 | Verfahren zur Verbesserung der Adhäsion zwischen verschiedenen Schichten in der Herstellung laminierter Leiterplatten und Zusammensetzungen zur Durchführung des Verfahrens |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITTO920036A IT1256851B (it) | 1992-01-21 | 1992-01-21 | Procedimento per promuovere l'aderenza fra diversi strati nella fabbricazione di circuiti stampati multistrato. e composizioni per l'attuazione di tale procedimento. |
Publications (3)
Publication Number | Publication Date |
---|---|
ITTO920036A0 ITTO920036A0 (it) | 1992-01-21 |
ITTO920036A1 true ITTO920036A1 (it) | 1993-07-21 |
IT1256851B IT1256851B (it) | 1995-12-27 |
Family
ID=11409914
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITTO920036A IT1256851B (it) | 1992-01-21 | 1992-01-21 | Procedimento per promuovere l'aderenza fra diversi strati nella fabbricazione di circuiti stampati multistrato. e composizioni per l'attuazione di tale procedimento. |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0552830B1 (it) |
DE (1) | DE69302104T2 (it) |
IT (1) | IT1256851B (it) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5900186A (en) * | 1995-12-19 | 1999-05-04 | Morton International, Inc. | Composition and method for reducing copper oxide to metallic copper |
US5750087B1 (en) * | 1996-06-27 | 1999-12-14 | Mine Safety Appliances Co | Process for the reduction of copper oxide |
KR100375589B1 (ko) * | 1997-07-10 | 2003-06-09 | 모르톤 인터내쇼날 인코포레이티드 | 구리산화물을구리금속으로환원시키기위한조성물및방법 |
JP3718722B2 (ja) * | 1998-02-20 | 2005-11-24 | モートン インターナショナル,インコーポレイティド | 銅酸化物を金属銅に還元するための組成物および方法 |
KR101730983B1 (ko) | 2010-07-06 | 2017-04-27 | 나믹스 코포레이션 | 인쇄회로기판에서 사용하기 위한 유기 기판에의 접착을 향상시키는 구리 표면의 처리 방법 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1287885B (it) * | 1964-05-27 | |||
DE3144157A1 (de) * | 1981-11-06 | 1983-05-19 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | Desoxidationsmittel |
JPS61176192A (ja) * | 1985-01-31 | 1986-08-07 | 株式会社日立製作所 | 銅と樹脂との接着方法 |
JPH0713304B2 (ja) * | 1987-12-14 | 1995-02-15 | 日立化成工業株式会社 | 銅の表面処理法 |
-
1992
- 1992-01-21 IT ITTO920036A patent/IT1256851B/it active IP Right Grant
-
1993
- 1993-01-13 EP EP93200073A patent/EP0552830B1/fr not_active Expired - Lifetime
- 1993-01-13 DE DE69302104T patent/DE69302104T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0552830A1 (fr) | 1993-07-28 |
DE69302104T2 (de) | 1996-10-24 |
DE69302104D1 (de) | 1996-05-15 |
IT1256851B (it) | 1995-12-27 |
EP0552830B1 (fr) | 1996-04-10 |
ITTO920036A0 (it) | 1992-01-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted | ||
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19990125 |