DE2107162C3 - Wärmehärtbare, fließfähige Beschichtungsmasse - Google Patents
Wärmehärtbare, fließfähige BeschichtungsmasseInfo
- Publication number
- DE2107162C3 DE2107162C3 DE2107162A DE2107162A DE2107162C3 DE 2107162 C3 DE2107162 C3 DE 2107162C3 DE 2107162 A DE2107162 A DE 2107162A DE 2107162 A DE2107162 A DE 2107162A DE 2107162 C3 DE2107162 C3 DE 2107162C3
- Authority
- DE
- Germany
- Prior art keywords
- coating
- epoxy
- particles
- phenolic resin
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920001187 thermosetting polymer Polymers 0.000 title claims 5
- 239000011248 coating agent Substances 0.000 title claims 3
- 238000000576 coating method Methods 0.000 title claims 3
- 150000001875 compounds Chemical class 0.000 title claims 2
- 230000009969 flowable effect Effects 0.000 title 1
- 239000002245 particle Substances 0.000 claims 9
- 239000000203 mixture Substances 0.000 claims 7
- 229920001568 phenolic resin Polymers 0.000 claims 7
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 6
- 239000005011 phenolic resin Substances 0.000 claims 5
- 239000000463 material Substances 0.000 claims 4
- 229920000877 Melamine resin Polymers 0.000 claims 3
- 239000003822 epoxy resin Substances 0.000 claims 3
- 229920000647 polyepoxide Polymers 0.000 claims 3
- 239000004640 Melamine resin Substances 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- 229920001807 Urea-formaldehyde Polymers 0.000 claims 2
- 239000008199 coating composition Substances 0.000 claims 2
- 239000000314 lubricant Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 230000007704 transition Effects 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 230000001680 brushing effect Effects 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 238000006555 catalytic reaction Methods 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N formaldehyde Substances O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 239000002923 metal particle Substances 0.000 claims 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 claims 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 claims 1
- 238000005192 partition Methods 0.000 claims 1
- 239000002243 precursor Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 238000007761 roller coating Methods 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 239000004634 thermosetting polymer Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06573—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder
- H01C17/06586—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder composed of organic material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/36—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes condensation products of phenols with aldehydes or ketones
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
- Laminated Bodies (AREA)
- Non-Adjustable Resistors (AREA)
- Adjustable Resistors (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19712166511 DE2166511C3 (de) | 1970-03-10 | 1971-02-15 | Elektrisches Widerstandselement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US1834370A | 1970-03-10 | 1970-03-10 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE2107162A1 DE2107162A1 (de) | 1971-09-23 |
| DE2107162B2 DE2107162B2 (de) | 1975-01-23 |
| DE2107162C3 true DE2107162C3 (de) | 1975-09-04 |
Family
ID=21787449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2107162A Expired DE2107162C3 (de) | 1970-03-10 | 1971-02-15 | Wärmehärtbare, fließfähige Beschichtungsmasse |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US3686139A (cg-RX-API-DMAC7.html) |
| JP (1) | JPS5120537B1 (cg-RX-API-DMAC7.html) |
| CA (1) | CA970956A (cg-RX-API-DMAC7.html) |
| CH (1) | CH585253A5 (cg-RX-API-DMAC7.html) |
| DE (1) | DE2107162C3 (cg-RX-API-DMAC7.html) |
| FR (1) | FR2081812B1 (cg-RX-API-DMAC7.html) |
| GB (1) | GB1351636A (cg-RX-API-DMAC7.html) |
| NL (1) | NL7102993A (cg-RX-API-DMAC7.html) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4298516A (en) * | 1971-08-23 | 1981-11-03 | Owens-Illinois, Inc. | Composition of matter |
| CA1028440A (en) * | 1973-02-26 | 1978-03-21 | Uop Inc. | Polymer compositions with treated filler |
| GB1470501A (en) * | 1973-03-20 | 1977-04-14 | Raychem Ltd | Polymer compositions for electrical use |
| US3908040A (en) * | 1974-01-07 | 1975-09-23 | Us Air Force | Method of encapsulation |
| US3983075A (en) * | 1974-06-21 | 1976-09-28 | Kennecott Copper Corporation | Copper filled conductive epoxy |
| US4125685A (en) * | 1977-06-30 | 1978-11-14 | Polaroid Corporation | Electrical cells and batteries and methods of making the same |
| DE2812497C3 (de) * | 1978-03-22 | 1982-03-11 | Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt | Gedruckte Schaltung |
| US4238528A (en) * | 1978-06-26 | 1980-12-09 | International Business Machines Corporation | Polyimide coating process and material |
| CA1141528A (en) * | 1978-08-04 | 1983-02-22 | Western Electric Company, Incorporated | Conductive adhesive system including a conductivity enhancer |
| US4331970A (en) * | 1978-09-18 | 1982-05-25 | General Electric Company | Use of dispersed solids as fillers in polymeric materials to provide material for semiconductor junction passivation |
| US4545926A (en) * | 1980-04-21 | 1985-10-08 | Raychem Corporation | Conductive polymer compositions and devices |
| FI62448C (fi) * | 1981-04-22 | 1982-12-10 | Lohja Ab Oy | Elektroluminensstruktur |
| US4396666A (en) * | 1981-11-02 | 1983-08-02 | Cts Corporation | Solderable conductive employing an organic binder |
| PL132666B1 (en) * | 1981-12-19 | 1985-03-30 | Os Bad Rozwojowy Stosowania I | Sliding compound and method of making the same |
| JPS59181001A (ja) * | 1983-03-30 | 1984-10-15 | 株式会社村田製作所 | カ−ボン抵抗ペ−スト |
| KR850004607A (ko) * | 1983-12-01 | 1985-07-25 | 프랑수와 뷧슨 | 저항체 조성물 |
| US4536451A (en) * | 1983-12-27 | 1985-08-20 | International Business Machines Corporation | Rigid magnetic recording media coating composition |
| US4600602A (en) * | 1984-07-18 | 1986-07-15 | Rohm And Haas Company | Low resistance resistor compositions |
| CH672857A5 (cg-RX-API-DMAC7.html) * | 1986-07-26 | 1989-12-29 | Kurasawa Optical Ind | |
| DE3916921C1 (cg-RX-API-DMAC7.html) * | 1989-05-24 | 1990-10-11 | Preh-Werke Gmbh & Co Kg, 8740 Bad Neustadt, De | |
| DE3942799A1 (de) * | 1989-12-23 | 1991-06-27 | Bosch Gmbh Robert | Verfahren zum herstellen einer abriebfesten schicht |
| US5378407A (en) * | 1992-06-05 | 1995-01-03 | Raychem Corporation | Conductive polymer composition |
| WO1995025603A1 (en) * | 1994-03-23 | 1995-09-28 | Board Of Regents, The University Of Texas System | Boiling enhancement coating |
| DE102004044115B4 (de) * | 2004-09-06 | 2010-04-08 | Ab Elektronik Sachsen Gmbh | Schleifkontaktsystem für einen verstellbaren elektrischen Widerstand und Verfahren zu dessen Herstellung |
| US8829769B1 (en) | 2012-11-09 | 2014-09-09 | Dantam K. Rao | Coated keybar to protect electric machines |
| CN113948236B (zh) * | 2021-12-21 | 2022-03-29 | 西安宏星电子浆料科技股份有限公司 | 一种耐磨损高精度油位传感器用厚膜银钯导体浆料 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2825702A (en) * | 1953-09-03 | 1958-03-04 | Electrofilm Inc | Heating elements in film form |
| GB1108967A (en) * | 1965-08-23 | 1968-04-10 | Matsushita Electric Industrial Co Ltd | Carbon film resistor composition |
-
1970
- 1970-03-10 US US18343A patent/US3686139A/en not_active Expired - Lifetime
-
1971
- 1971-01-12 CA CA102,563A patent/CA970956A/en not_active Expired
- 1971-02-12 JP JP46006448A patent/JPS5120537B1/ja active Pending
- 1971-02-15 DE DE2107162A patent/DE2107162C3/de not_active Expired
- 1971-02-23 CH CH261671A patent/CH585253A5/xx not_active IP Right Cessation
- 1971-02-23 FR FR7106169A patent/FR2081812B1/fr not_active Expired
- 1971-03-05 NL NL7102993A patent/NL7102993A/xx unknown
- 1971-04-19 GB GB2363271*A patent/GB1351636A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2107162A1 (de) | 1971-09-23 |
| US3686139A (en) | 1972-08-22 |
| DE2107162B2 (de) | 1975-01-23 |
| FR2081812B1 (cg-RX-API-DMAC7.html) | 1975-07-04 |
| GB1351636A (en) | 1974-05-01 |
| CA970956A (en) | 1975-07-15 |
| CH585253A5 (cg-RX-API-DMAC7.html) | 1977-02-28 |
| NL7102993A (cg-RX-API-DMAC7.html) | 1971-09-14 |
| FR2081812A1 (cg-RX-API-DMAC7.html) | 1971-12-10 |
| JPS5120537B1 (cg-RX-API-DMAC7.html) | 1976-06-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C3 | Grant after two publication steps (3rd publication) | ||
| E77 | Valid patent as to the heymanns-index 1977 | ||
| EHJ | Ceased/non-payment of the annual fee |