CA1141528A - Conductive adhesive system including a conductivity enhancer - Google Patents

Conductive adhesive system including a conductivity enhancer

Info

Publication number
CA1141528A
CA1141528A CA000332609A CA332609A CA1141528A CA 1141528 A CA1141528 A CA 1141528A CA 000332609 A CA000332609 A CA 000332609A CA 332609 A CA332609 A CA 332609A CA 1141528 A CA1141528 A CA 1141528A
Authority
CA
Canada
Prior art keywords
conductivity
weight
epoxy
conductive adhesive
adhesive system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000332609A
Other languages
French (fr)
Inventor
Andrew J. Lovinger
Louis H. Sharpe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Application granted granted Critical
Publication of CA1141528A publication Critical patent/CA1141528A/en
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4827—Materials
    • H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01067—Holmium [Ho]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)

Abstract

Conductive Adhesive system including A Conductivity Enhancer"
ABSTRACT
An electric conductive adhesive system includes a hydroxy terminated ether or ester thereof which serves as a conductivity enhancer. Conductivity levels attained exceed those of prior art systems.

Description

- 1141~28 Conductive Adhesive System Including _Conductivity Enhancer This invention relates to electrically conductive epoxy adhesive systems and to electrical devices and methods including the system. More particularly, the present invention relates to an electrically conductive epoxy adhesive system including a conductivity enhancer.
In recent years, the use of metal filled thermostat polymers as electrically conductive adhesives has been extensive and has resulted in partial replacement of the traditional eutectic bonding and thermocompression techniques, particularly in the adhesion of miniature devices such as light emitting diodes and integrated circuits.
Typically, these thermoset polymers comprise a mixture of an epoxy resin and a conductive particulate component such as metal powder, silver flake, copper and the like in combination with suitable curinq agents, diluents and the like. At an early stage in the development of these adhesive systems, workers in the art determined that in order to maximize conductivity within the system, it was necessary to promote dispersion of the conductive component within the epoxy matrix. This end was normally attained by coating the particles of the conductive component with a thin film of an organic material. Typical cf materials used for this purpose i~4152~3 are fatty acids and compounds thereof, and it is found that commercially available conductive fillers, such as silver flake, typically have such coatings. These films have been found to be highly effective in promoting dispersion of the conductive component in the liquid epoxy resin system and they often tend to render the dispersion insulating before it is subjected to elevated temperature cure. Accordingly, it is essential that in the subsequent processing sequence, these films be stripped in order to attain the desired conductivity.
This is normally effected by the heat associated with an elevated temperature curing cycle. The specific temperature levels are dependent upon the formulation employed. Although these prior art conductive adhesive systems have proven satisfactory, investigatory efforts have continued with a view toward the development of systems evidencing enhanced conductivity and yielding conductivity levels comparable to those of prior art systems at lower curing temperatures.
According to the present invention there is provided a method for bonding one electrical assembly or element to another or to a support member, comprising the steps of applying an uncured epoxy material comprising a conductive particulate component to at least one surface, applying the surfaces to be bonded together and curing the epoxy material, wherein the epoxy material contains 0.1~ to 10~ by weight, based on the weight of the epoxy resin, of a conductivity enhancer selected from the group represented by L ] 2 n n being in the range of 2 to 10.
In the preferred embodiment of the invention, the above objects are a-ttained by the use of a novel conductivity enhancer. Compounds found to be particularly suitable for the described purpose are the hydroxy-terminated ethers, especially polyethylene-glycols, 1~

HOC~12 (C1120C~12 ) n ~120~1~ allcl the like, with n being in the range 2 to 10. The upper limit of n is dictated by practical considerations relating to solubility.
Epoxy resins employed in the adhesive systems described are preferably selected from epoxy-novolac resins, bisphenol A-epichlorohydrin resins, cycloaliphatic epoxies and the like. The selection of a particular epoxy resin is not critical, the only requirement being that it be compatible with the ethers chosen.
In preparing the adhesive system, the epoxy resin is initially mixed with a reactive viscosity reducer and a curing agent, each of which is well known in the art. Then, the conductivity enhancer described herein is added to the resin system in an amount preferably ranging from 0.1 -10 percent, by weight, based upon the weight of the resin.
These limits are dictated by practical considerations. Thus, the use of conductivity enhancer in excess of the maximum adversely affects the mechanical and thermal properties of the system whereas less than the noted minimum tends to yield an undesirable result. Then, the conductivity component, typically in the form of metal powder or flakes rangirg in particle size from 0.5-50 microns, is added to the epoxy resin in an amount such that the conductivity component comprises from 25-85~ by weight, based upon the ~5 total weight of the composition.
By "epoxy resin" we mean the epoxy without additives, and by "epoxy material" we mean the epoxy resin plus additives such as conductive particulate components, diluents, curing agents and the like.
One example of the present invention is set forth below.
_ample 1 An epoxy resin adhesive system was prepared comprising the following components:
(a) 31~, by weight, o~ an epoxy novolac resin having an average of 3.6 epoxy groups per molecule, a viscvsity ranging from 20,000 to 50,000 cps at 50 C and an epoxy equivalent weight within the range of 176-181, 114~5Z8 (b) 44%, by weight, resorcinol diglycidyl ether, having a viscosity ranging from 300-500 cps at 25 C and an epoxy equivalent weight of approximately 127, (c) 12.5%, by weight, tetraglycidyl ether of tetraphenyl ethane, (d) 12.5~, by weight, butanediol diglycidyl ether, (e) 0.~275 moles per 100 grams of resin of l-dimethylcarbamoyl-4-phenylimidazole, and (f) 1.4%, by weight, of a hydroxy terminated ether, HOC~2(cH2OcH2)n--3c 2 To this mixture, silver flake having a surface area ranging from 0.75 to 1.35m2/g containing a maximum of 0.02%
chloride and a maximum particle dimension ranging from about 0.5 to about 5 ~m was added. Electrical resistivity was then measured using a stripe specimen. This involved the use of a ~icroscope slide to which two copper pads spaced 25mm apart were bonded with an adhesive. Pressure sensitive tape was laid lengthwise over the pads from end to end of the slide. Two razor cuts, 2.5mm apart, were then made lengthwise in the tape over the pads from end to end and -the section of the tape so cut was peeled away. The conductive adhesive was forced into the opening using the edge of a microscope slide so that it was level with the top surface of the remaining tape which was then peeled away.
There remained a stripe of adhesive bridging the copper pads which, after curing at 175 C for 30 minutes, was 2.5mm wide and approximately 0.038mm thick. The resistance was computed from the voltage drop across the stripe at a current of 100 milliamperes using a Keithley ~160B Digital Multime-ter and a Keithley~ 227 constant current source. I~he resistivity was as follows:
Resistivity, p(ohm-cm) (average of 2 specimens) initial 1.80 x 10 ~

~141528 The foregoing procedure was repeated with the exception that 2.4%, by weight, and 6.2%, by weight, of hydroxy terminated ether were added. The resistivities were 1.43 x 10 4 ohm-cm and 1.22 x 10 4 ohm-cm, respectively.
For comparative purposes, the foregoing procedure was repeated without the presence of the hydroxy terminated ether. The resistivity was 3.15 x 10 4 ohm-cm.
It is to be understood that the described conductivity enhancers may be used as a conductivity re-juvenant for conductive adhesives, which, as known, by virtue of prolonged storage in thQ uncured state have lost some of their conductivity attributes.

,~:

Claims (3)

Claims:
1. A method for bonding one electrical assembly or element to another or to a support member, comprising the steps of applying an uncured epoxy material comprising a conductive particulate component to at least one surface, applying the surfaces to be bonded together and curing the epoxy material, wherein the epoxy material contains 0.1%
to 10% by weight, based on the weight of the epoxy resin, of a conductivity enhancer selected from the group represented by n being in the range of 2 to 10.
2. A method according to claim 1, wherein the average size of the particulate conductive component is between 0.5 µm and 50 µm.
3. An electrical assembly or element bonded to another or a support member by the method according to claim 1 or 2.
CA000332609A 1978-08-04 1979-07-26 Conductive adhesive system including a conductivity enhancer Expired CA1141528A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US93115978A 1978-08-04 1978-08-04
US931,159 1978-08-04

Publications (1)

Publication Number Publication Date
CA1141528A true CA1141528A (en) 1983-02-22

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ID=25460307

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000332609A Expired CA1141528A (en) 1978-08-04 1979-07-26 Conductive adhesive system including a conductivity enhancer

Country Status (8)

Country Link
JP (1) JPS5524397A (en)
BE (1) BE878072A (en)
CA (1) CA1141528A (en)
DE (1) DE2931634A1 (en)
FR (1) FR2432543A1 (en)
GB (1) GB2028828B (en)
IT (1) IT1122392B (en)
NL (1) NL7905932A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56114302A (en) * 1980-02-04 1981-09-08 Rte Corp Arrester block assembly
JPS57111034A (en) * 1980-12-10 1982-07-10 Hitachi Ltd Semiconductor device and its manufacture
JPS57185316A (en) * 1981-05-11 1982-11-15 Sumitomo Metal Mining Co Ltd Electrically conductive resin paste
JP2833111B2 (en) * 1989-03-09 1998-12-09 日立化成工業株式会社 Circuit connection method and adhesive film used therefor
JPH07123179B2 (en) * 1990-10-05 1995-12-25 信越ポリマー株式会社 Circuit board connection structure with anisotropic conductive adhesive

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE460345A (en) * 1939-07-27
FR1538385A (en) * 1967-06-22 1968-09-06 Nii R I Latexnykh Izdely Method of making an electrical contact
US3686139A (en) * 1970-03-10 1972-08-22 Globe Union Inc Resistive coating compositions and resistor elements produced therefrom

Also Published As

Publication number Publication date
DE2931634A1 (en) 1980-02-28
FR2432543A1 (en) 1980-02-29
FR2432543B1 (en) 1983-10-28
IT1122392B (en) 1986-04-23
NL7905932A (en) 1980-02-06
BE878072A (en) 1979-12-03
IT7924852A0 (en) 1979-08-01
GB2028828A (en) 1980-03-12
JPS5524397A (en) 1980-02-21
GB2028828B (en) 1982-09-22

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