DE2039255A1 - Ohmsche Kontakte auf planaren Halbleiterbauelementen und Verfahren zu ihrer Herstellung - Google Patents

Ohmsche Kontakte auf planaren Halbleiterbauelementen und Verfahren zu ihrer Herstellung

Info

Publication number
DE2039255A1
DE2039255A1 DE19702039255 DE2039255A DE2039255A1 DE 2039255 A1 DE2039255 A1 DE 2039255A1 DE 19702039255 DE19702039255 DE 19702039255 DE 2039255 A DE2039255 A DE 2039255A DE 2039255 A1 DE2039255 A1 DE 2039255A1
Authority
DE
Germany
Prior art keywords
zone
contacted
zones
intermediate layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19702039255
Other languages
German (de)
English (en)
Inventor
Sandhu Jagtar Jingh
Alan Platt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE2039255A1 publication Critical patent/DE2039255A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE19702039255 1969-08-27 1970-08-07 Ohmsche Kontakte auf planaren Halbleiterbauelementen und Verfahren zu ihrer Herstellung Pending DE2039255A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US85337569A 1969-08-27 1969-08-27

Publications (1)

Publication Number Publication Date
DE2039255A1 true DE2039255A1 (de) 1971-03-04

Family

ID=25315871

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19702039255 Pending DE2039255A1 (de) 1969-08-27 1970-08-07 Ohmsche Kontakte auf planaren Halbleiterbauelementen und Verfahren zu ihrer Herstellung

Country Status (7)

Country Link
JP (1) JPS4921461B1 (fr)
BE (1) BE755371A (fr)
CA (1) CA939829A (fr)
DE (1) DE2039255A1 (fr)
FR (1) FR2059695B1 (fr)
GB (1) GB1313386A (fr)
NL (1) NL7012464A (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3753774A (en) * 1971-04-05 1973-08-21 Rca Corp Method for making an intermetallic contact to a semiconductor device
JPS508865U (fr) * 1973-05-19 1975-01-29

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1030540A (en) * 1964-01-02 1966-05-25 Gen Electric Improvements in and relating to semi-conductor diodes
GB1170185A (en) * 1967-07-28 1969-11-12 Hitachi Ltd Electrode Structure of a Semiconductor Device.
ES364975A1 (es) * 1968-03-22 1971-02-16 Rca Corp Un dispositivo semiconductor.

Also Published As

Publication number Publication date
BE755371A (fr) 1971-02-01
JPS4921461B1 (fr) 1974-06-01
FR2059695A1 (fr) 1971-06-04
GB1313386A (en) 1973-04-11
FR2059695B1 (fr) 1973-12-21
CA939829A (en) 1974-01-08
NL7012464A (fr) 1971-03-02

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