DE2027105C3 - Verfahren zur Herstellung eines Halbleiterbauelements - Google Patents

Verfahren zur Herstellung eines Halbleiterbauelements

Info

Publication number
DE2027105C3
DE2027105C3 DE2027105A DE2027105A DE2027105C3 DE 2027105 C3 DE2027105 C3 DE 2027105C3 DE 2027105 A DE2027105 A DE 2027105A DE 2027105 A DE2027105 A DE 2027105A DE 2027105 C3 DE2027105 C3 DE 2027105C3
Authority
DE
Germany
Prior art keywords
semiconductor component
protective layer
ester
imide
lacquer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2027105A
Other languages
German (de)
English (en)
Other versions
DE2027105A1 (de
DE2027105B2 (de
Inventor
Peter 7300 Esslingen Breuer
Wolfgang Dipl.-Phys. 7250 Leonberg Leibfried
Wolfgang Dipl.-Phys. 7120 Bietigheim Schynoll
Dietrich 7016 Gerlingen Wulff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE2027105A priority Critical patent/DE2027105C3/de
Priority to CH668071A priority patent/CH520401A/de
Priority to GB1396571*[A priority patent/GB1303382A/en
Priority to FR7117994A priority patent/FR2093995B3/fr
Priority to NL7107559A priority patent/NL7107559A/xx
Priority to BE768009A priority patent/BE768009A/xx
Publication of DE2027105A1 publication Critical patent/DE2027105A1/de
Publication of DE2027105B2 publication Critical patent/DE2027105B2/de
Application granted granted Critical
Publication of DE2027105C3 publication Critical patent/DE2027105C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Paints Or Removers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
DE2027105A 1970-06-03 1970-06-03 Verfahren zur Herstellung eines Halbleiterbauelements Expired DE2027105C3 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE2027105A DE2027105C3 (de) 1970-06-03 1970-06-03 Verfahren zur Herstellung eines Halbleiterbauelements
CH668071A CH520401A (de) 1970-06-03 1971-05-05 Halbleiterbauelement und Verfahren zu seiner Herstellung
GB1396571*[A GB1303382A (https=) 1970-06-03 1971-05-10
FR7117994A FR2093995B3 (https=) 1970-06-03 1971-05-18
NL7107559A NL7107559A (https=) 1970-06-03 1971-06-02
BE768009A BE768009A (fr) 1970-06-03 1971-06-02 Element semi-conducteur et procede pour sa fabrication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2027105A DE2027105C3 (de) 1970-06-03 1970-06-03 Verfahren zur Herstellung eines Halbleiterbauelements

Publications (3)

Publication Number Publication Date
DE2027105A1 DE2027105A1 (de) 1971-12-16
DE2027105B2 DE2027105B2 (de) 1980-06-26
DE2027105C3 true DE2027105C3 (de) 1981-03-26

Family

ID=5772836

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2027105A Expired DE2027105C3 (de) 1970-06-03 1970-06-03 Verfahren zur Herstellung eines Halbleiterbauelements

Country Status (6)

Country Link
BE (1) BE768009A (https=)
CH (1) CH520401A (https=)
DE (1) DE2027105C3 (https=)
FR (1) FR2093995B3 (https=)
GB (1) GB1303382A (https=)
NL (1) NL7107559A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754043B2 (https=) * 1973-05-21 1982-11-16
DE2700463A1 (de) * 1977-01-07 1978-07-13 Siemens Ag Verfahren zum passivieren von halbleiterelementen
JPS59113648A (ja) * 1982-12-20 1984-06-30 Hitachi Ltd 樹脂モ−ルド型半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3379356A (en) * 1964-09-25 1968-04-23 Int Standard Electric Corp Arrangement for an insulating panel soldering device according to the flowsolder process
US3426098A (en) * 1965-05-20 1969-02-04 Schenectady Chemical Polyester-polyimide wire enamel
US3411122A (en) * 1966-01-13 1968-11-12 Ibm Electrical resistance element and method of fabricating
DE6751565U (de) * 1968-08-01 1969-02-06 Licentia Gmbh Anordnung zur isolierung von gleichrichtern
US3615913A (en) * 1968-11-08 1971-10-26 Westinghouse Electric Corp Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating

Also Published As

Publication number Publication date
NL7107559A (https=) 1971-12-07
GB1303382A (https=) 1973-01-17
BE768009A (fr) 1971-11-03
CH520401A (de) 1972-03-15
FR2093995A7 (https=) 1972-02-04
DE2027105A1 (de) 1971-12-16
DE2027105B2 (de) 1980-06-26
FR2093995B3 (https=) 1973-10-19

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee