FR2093995A7 - - Google Patents
Info
- Publication number
- FR2093995A7 FR2093995A7 FR7117994A FR7117994A FR2093995A7 FR 2093995 A7 FR2093995 A7 FR 2093995A7 FR 7117994 A FR7117994 A FR 7117994A FR 7117994 A FR7117994 A FR 7117994A FR 2093995 A7 FR2093995 A7 FR 2093995A7
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/77—Auxiliary members characterised by their shape
- H10W40/778—Auxiliary members characterised by their shape in encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2027105A DE2027105C3 (de) | 1970-06-03 | 1970-06-03 | Verfahren zur Herstellung eines Halbleiterbauelements |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2093995A7 true FR2093995A7 (https=) | 1972-02-04 |
| FR2093995B3 FR2093995B3 (https=) | 1973-10-19 |
Family
ID=5772836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7117994A Expired FR2093995B3 (https=) | 1970-06-03 | 1971-05-18 |
Country Status (6)
| Country | Link |
|---|---|
| BE (1) | BE768009A (https=) |
| CH (1) | CH520401A (https=) |
| DE (1) | DE2027105C3 (https=) |
| FR (1) | FR2093995B3 (https=) |
| GB (1) | GB1303382A (https=) |
| NL (1) | NL7107559A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS508469A (https=) * | 1973-05-21 | 1975-01-28 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2700463A1 (de) * | 1977-01-07 | 1978-07-13 | Siemens Ag | Verfahren zum passivieren von halbleiterelementen |
| JPS59113648A (ja) * | 1982-12-20 | 1984-06-30 | Hitachi Ltd | 樹脂モ−ルド型半導体装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3379356A (en) * | 1964-09-25 | 1968-04-23 | Int Standard Electric Corp | Arrangement for an insulating panel soldering device according to the flowsolder process |
| US3426098A (en) * | 1965-05-20 | 1969-02-04 | Schenectady Chemical | Polyester-polyimide wire enamel |
| US3411122A (en) * | 1966-01-13 | 1968-11-12 | Ibm | Electrical resistance element and method of fabricating |
| DE6751565U (de) * | 1968-08-01 | 1969-02-06 | Licentia Gmbh | Anordnung zur isolierung von gleichrichtern |
| US3615913A (en) * | 1968-11-08 | 1971-10-26 | Westinghouse Electric Corp | Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating |
-
1970
- 1970-06-03 DE DE2027105A patent/DE2027105C3/de not_active Expired
-
1971
- 1971-05-05 CH CH668071A patent/CH520401A/de not_active IP Right Cessation
- 1971-05-10 GB GB1396571*[A patent/GB1303382A/en not_active Expired
- 1971-05-18 FR FR7117994A patent/FR2093995B3/fr not_active Expired
- 1971-06-02 BE BE768009A patent/BE768009A/xx unknown
- 1971-06-02 NL NL7107559A patent/NL7107559A/xx not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS508469A (https=) * | 1973-05-21 | 1975-01-28 |
Also Published As
| Publication number | Publication date |
|---|---|
| NL7107559A (https=) | 1971-12-07 |
| GB1303382A (https=) | 1973-01-17 |
| BE768009A (fr) | 1971-11-03 |
| CH520401A (de) | 1972-03-15 |
| DE2027105A1 (de) | 1971-12-16 |
| DE2027105C3 (de) | 1981-03-26 |
| DE2027105B2 (de) | 1980-06-26 |
| FR2093995B3 (https=) | 1973-10-19 |