DE202009001817U1 - Substratträger zur Halterung einer Vielzahl von Solarzellenwafern - Google Patents

Substratträger zur Halterung einer Vielzahl von Solarzellenwafern Download PDF

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Publication number
DE202009001817U1
DE202009001817U1 DE202009001817U DE202009001817U DE202009001817U1 DE 202009001817 U1 DE202009001817 U1 DE 202009001817U1 DE 202009001817 U DE202009001817 U DE 202009001817U DE 202009001817 U DE202009001817 U DE 202009001817U DE 202009001817 U1 DE202009001817 U1 DE 202009001817U1
Authority
DE
Germany
Prior art keywords
substrate carrier
webs
solar cell
frame structure
openings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE202009001817U
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German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meyer Burger Germany GmbH
Original Assignee
Roth and Rau AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Roth and Rau AG filed Critical Roth and Rau AG
Priority to DE202009001817U priority Critical patent/DE202009001817U1/de
Publication of DE202009001817U1 publication Critical patent/DE202009001817U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H01L21/67336—Trays for chips characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67363—Closed carriers specially adapted for containing substrates other than wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Electromagnetism (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
DE202009001817U 2009-01-31 2009-02-12 Substratträger zur Halterung einer Vielzahl von Solarzellenwafern Expired - Lifetime DE202009001817U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE202009001817U DE202009001817U1 (de) 2009-01-31 2009-02-12 Substratträger zur Halterung einer Vielzahl von Solarzellenwafern

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009006779.5 2009-01-31
DE102009006779 2009-01-31
DE202009001817U DE202009001817U1 (de) 2009-01-31 2009-02-12 Substratträger zur Halterung einer Vielzahl von Solarzellenwafern

Publications (1)

Publication Number Publication Date
DE202009001817U1 true DE202009001817U1 (de) 2009-06-04

Family

ID=40719730

Family Applications (1)

Application Number Title Priority Date Filing Date
DE202009001817U Expired - Lifetime DE202009001817U1 (de) 2009-01-31 2009-02-12 Substratträger zur Halterung einer Vielzahl von Solarzellenwafern

Country Status (4)

Country Link
CN (1) CN102859678A (zh)
DE (1) DE202009001817U1 (zh)
TW (1) TW201036101A (zh)
WO (1) WO2010085949A2 (zh)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011017566A1 (de) 2010-04-22 2011-12-01 Von Ardenne Anlagentechnik Gmbh Substratbehandlungsanlage und Substrathalter dafür
DE102010052689A1 (de) * 2010-11-26 2012-05-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Substrathalter für die Oberflächenbehandlung von Substraten und Verwendung des Substrathalters
WO2012136586A1 (de) 2011-04-06 2012-10-11 Roth & Rau Ag Substratträger
DE102013217441A1 (de) 2013-09-02 2015-03-05 Singulus Technologies Ag Substratträger
US9228256B2 (en) 2009-12-11 2016-01-05 Kgt Graphit Technologie Gmbh Substrate support
WO2016162071A1 (en) * 2015-04-09 2016-10-13 Applied Materials, Inc. Carrier system for substrates to be processed
DE102015110854A1 (de) * 2015-07-06 2017-01-12 Von Ardenne Gmbh Verfahren, Substrathaltevorrichtung und Prozessieranordnung
CN107210252A (zh) * 2014-11-26 2017-09-26 冯·阿登纳有限公司 基板保持装置、基板运送装置、处理布置和用于处理基板的方法
DE102016111234A1 (de) * 2016-06-20 2017-12-21 Heraeus Noblelight Gmbh Vorrichtung für die thermische Behandlung eines Substrats sowie Trägerhorde und Substrat-Trägerelement dafür
DE102018101439A1 (de) * 2018-01-23 2019-07-25 RF360 Europe GmbH Substratträger für einen Reflow-Ofen und Verwendung eines Substratträgers
WO2020001730A1 (en) * 2018-06-25 2020-01-02 Applied Materials, Inc. Carrier for a substrate and method for carrying a substrate
DE102021003330B3 (de) 2021-06-28 2022-09-01 Singulus Technologies Aktiengesellschaft Substratträger

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9214576B2 (en) 2010-06-09 2015-12-15 Solarcity Corporation Transparent conducting oxide for photovoltaic devices
JP5901110B2 (ja) * 2010-10-06 2016-04-06 三木ポリマー株式会社 面実装電子部品の搬送用トレー
US9800053B2 (en) 2010-10-08 2017-10-24 Tesla, Inc. Solar panels with integrated cell-level MPPT devices
US9054256B2 (en) 2011-06-02 2015-06-09 Solarcity Corporation Tunneling-junction solar cell with copper grid for concentrated photovoltaic application
CN102412108B (zh) * 2011-10-31 2013-11-27 无锡绿波新能源设备有限公司 高吸附拼接式碳纤维u型槽
WO2014055781A1 (en) 2012-10-04 2014-04-10 Silevo, Inc. Photovoltaic devices with electroplated metal grids
US9865754B2 (en) 2012-10-10 2018-01-09 Tesla, Inc. Hole collectors for silicon photovoltaic cells
US9281436B2 (en) 2012-12-28 2016-03-08 Solarcity Corporation Radio-frequency sputtering system with rotary target for fabricating solar cells
US10074755B2 (en) 2013-01-11 2018-09-11 Tesla, Inc. High efficiency solar panel
US9219174B2 (en) 2013-01-11 2015-12-22 Solarcity Corporation Module fabrication of solar cells with low resistivity electrodes
US9624595B2 (en) 2013-05-24 2017-04-18 Solarcity Corporation Electroplating apparatus with improved throughput
US10309012B2 (en) 2014-07-03 2019-06-04 Tesla, Inc. Wafer carrier for reducing contamination from carbon particles and outgassing
US9899546B2 (en) 2014-12-05 2018-02-20 Tesla, Inc. Photovoltaic cells with electrodes adapted to house conductive paste
CN104726839B (zh) * 2015-03-27 2017-06-16 京东方科技集团股份有限公司 基板固定装置
CN108138314A (zh) * 2015-09-21 2018-06-08 应用材料公司 基板载体、以及溅射沉积设备和其使用方法
US9761744B2 (en) 2015-10-22 2017-09-12 Tesla, Inc. System and method for manufacturing photovoltaic structures with a metal seed layer
US9842956B2 (en) 2015-12-21 2017-12-12 Tesla, Inc. System and method for mass-production of high-efficiency photovoltaic structures
US11190128B2 (en) 2018-02-27 2021-11-30 Tesla, Inc. Parallel-connected solar roof tile modules
CN110190018A (zh) * 2019-07-01 2019-08-30 深圳市石金科技股份有限公司 一种拼接式的硅片承载框
CN111739971B (zh) * 2020-08-03 2021-02-19 苏州迈正科技有限公司 镀膜设备、方法、系统及太阳能电池、组件、发电系统
CN113328010A (zh) * 2021-05-28 2021-08-31 安徽华晟新能源科技有限公司 一种太阳能电池的制备方法
CN114774888B (zh) * 2021-09-30 2024-02-23 苏州迈为科技股份有限公司 Pecvd镀膜载板及镀膜设备

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5012924A (en) * 1990-03-19 1991-05-07 R. H. Murphy Company, Inc. Carriers for integrated circuits and the like
TW353854B (en) * 1994-03-14 1999-03-01 Minnesota Mining & Mfg Component tray with removable insert
US5731230A (en) * 1995-03-28 1998-03-24 Micron Technology, Inc. Method for processing and/or shipping integrated circuit devices
US6036023A (en) * 1997-07-10 2000-03-14 Teradyne, Inc. Heat-transfer enhancing features for semiconductor carriers and devices
US6227372B1 (en) 1998-04-30 2001-05-08 Peak International, Inc. Component carrier tray for high-temperature applications
MY130407A (en) * 2000-12-01 2007-06-29 Texchem Pack M Sdn Bhd Tray for storing semiconductor chips
EP1556209A4 (en) * 2002-10-09 2009-07-01 Entegris Inc HIGH-FIXED HIGH-TEMPERATURE MATERIALS FOR DEVICE PROCESSING SYSTEMS
US20060006095A1 (en) 2004-07-08 2006-01-12 White Robert J Jr Universal storage tray for electronic components
JP2007042908A (ja) * 2005-08-04 2007-02-15 Sumitomo Electric Ind Ltd ウェハ保持体およびそれを搭載したウェハプローバ

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9228256B2 (en) 2009-12-11 2016-01-05 Kgt Graphit Technologie Gmbh Substrate support
DE102011017566A1 (de) 2010-04-22 2011-12-01 Von Ardenne Anlagentechnik Gmbh Substratbehandlungsanlage und Substrathalter dafür
DE102010052689A1 (de) * 2010-11-26 2012-05-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Substrathalter für die Oberflächenbehandlung von Substraten und Verwendung des Substrathalters
WO2012136586A1 (de) 2011-04-06 2012-10-11 Roth & Rau Ag Substratträger
DE102011006833A1 (de) 2011-04-06 2012-10-11 Roth & Rau Ag Substratträger
DE102013217441A1 (de) 2013-09-02 2015-03-05 Singulus Technologies Ag Substratträger
DE102013217441B4 (de) * 2013-09-02 2019-11-28 Singulus Technologies Ag Substratträger
DE112015004190B4 (de) 2014-11-26 2024-05-29 VON ARDENNE Asset GmbH & Co. KG Substrathaltevorrichtung, Substrattransportvorrichtung, Prozessieranordnung und Verfahren zum Prozessieren eines Substrats
US10770324B2 (en) 2014-11-26 2020-09-08 VON ARDENNE Asset GmbH & Co. KG Substrate holding device, substrate transport device, processing arrangement and method for processing a substrate
CN107210252A (zh) * 2014-11-26 2017-09-26 冯·阿登纳有限公司 基板保持装置、基板运送装置、处理布置和用于处理基板的方法
CN107210252B (zh) * 2014-11-26 2021-05-25 冯·阿登纳资产股份有限公司 基板保持装置、基板运送装置、处理布置和用于处理基板的方法
WO2016162071A1 (en) * 2015-04-09 2016-10-13 Applied Materials, Inc. Carrier system for substrates to be processed
JP2018512740A (ja) * 2015-04-09 2018-05-17 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 処理される基板のためのキャリアシステム
CN107438897A (zh) * 2015-04-09 2017-12-05 应用材料公司 用于待处理的基板的载体系统
DE102015110854A1 (de) * 2015-07-06 2017-01-12 Von Ardenne Gmbh Verfahren, Substrathaltevorrichtung und Prozessieranordnung
DE102016111234A1 (de) * 2016-06-20 2017-12-21 Heraeus Noblelight Gmbh Vorrichtung für die thermische Behandlung eines Substrats sowie Trägerhorde und Substrat-Trägerelement dafür
DE102016111234B4 (de) * 2016-06-20 2018-01-25 Heraeus Noblelight Gmbh Vorrichtung für die thermische Behandlung eines Substrats sowie Trägerhorde und Substrat-Trägerelement dafür
DE102018101439B4 (de) 2018-01-23 2020-01-09 RF360 Europe GmbH Substratträger für einen Reflow-Ofen und Verwendung eines Substratträgers
DE102018101439A1 (de) * 2018-01-23 2019-07-25 RF360 Europe GmbH Substratträger für einen Reflow-Ofen und Verwendung eines Substratträgers
WO2020001730A1 (en) * 2018-06-25 2020-01-02 Applied Materials, Inc. Carrier for a substrate and method for carrying a substrate
DE102021003330B3 (de) 2021-06-28 2022-09-01 Singulus Technologies Aktiengesellschaft Substratträger
WO2023274596A1 (de) * 2021-06-28 2023-01-05 Singulus Technologies Ag Substratträger

Also Published As

Publication number Publication date
TW201036101A (en) 2010-10-01
WO2010085949A3 (de) 2013-03-21
CN102859678A (zh) 2013-01-02
WO2010085949A2 (de) 2010-08-05

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