JP5901110B2 - 面実装電子部品の搬送用トレー - Google Patents
面実装電子部品の搬送用トレー Download PDFInfo
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- JP5901110B2 JP5901110B2 JP2010226418A JP2010226418A JP5901110B2 JP 5901110 B2 JP5901110 B2 JP 5901110B2 JP 2010226418 A JP2010226418 A JP 2010226418A JP 2010226418 A JP2010226418 A JP 2010226418A JP 5901110 B2 JP5901110 B2 JP 5901110B2
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 18
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 10
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- 229920000877 Melamine resin Polymers 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- -1 alumina Chemical compound 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007600 charging Methods 0.000 description 2
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- 230000007613 environmental effect Effects 0.000 description 2
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- 150000002500 ions Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
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- 238000012545 processing Methods 0.000 description 2
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- 238000000638 solvent extraction Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000737 Duralumin Inorganic materials 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229920010524 Syndiotactic polystyrene Polymers 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000003679 aging effect Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
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- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005524 ceramic coating Methods 0.000 description 1
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- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
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- 230000000694 effects Effects 0.000 description 1
- 238000007786 electrostatic charging Methods 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
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- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
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- 239000012535 impurity Substances 0.000 description 1
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- 230000010354 integration Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- XYJRXVWERLGGKC-UHFFFAOYSA-D pentacalcium;hydroxide;triphosphate Chemical compound [OH-].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O XYJRXVWERLGGKC-UHFFFAOYSA-D 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
そこで本発明は、優れた耐熱性を備えながらも、比較的安価に製造することのできる面実装電子部品の搬送用トレーを提供することを第二の課題とする。
そこで本発明はソリ変形の発生の問題をなくし、特にベーキング工程等で高温環境下に置かれた場合でも、そり変形が生じない面実装電子部品の搬送用トレーを提供することを第3の課題とする。
そこで本発明は電気抵抗が小さく、静電気を帯電しないようにした面実装電子部品の搬送用トレーを提供することを第4の課題とする。
導電性は、表面抵抗が107Ω/□以下の導電性(静電気散逸性)であることが望ましいが、本発明においては表面抵抗が108〜12Ω/□の帯電防止レベルの電気抵抗であっても良い。また耐熱性は100℃以上、望ましくは120℃以上でも外観の変化(ふくれ、ひび割れ、変形、変色など)がなく、連続使用が可能であるものを使用する。
10 仕切り部
20 プレート部
25 表面処理領域(表面処理)
30 金型
50 搬送用トレー
Claims (2)
- 半導体デバイスを含む面実装電子部品をその製造工程または検査工程に搬送するために使用される面実装電子部品の搬送用トレーであって、
導電性および100℃以上の耐熱性の少なくとも何れかの特性を具備する金属またはセラミックからなるプレート部と、
当該プレート部の少なくとも一方の面上にリブ状に設けられ、各面実装電子部品を収容する複数の空間を区画する樹脂製の仕切り部とからなり、
前記プレート部は、少なくとも仕切り部が形成される側の面が平坦に形成されると共に、当該プレート部と仕切り部とが一体化されており、
当該プレート部と仕切り部との一体化は、プレート部における少なくとも仕切り部が設置される領域にエッチング処理により溝を形成するか、又は25nm以上の直径で開口する穴を複数形成すると共に、前記仕切り部をインサート成型し、当該仕切り部が前記溝又は穴内に食い込んで結着した状態に接合してなることを特徴とする、面実装電子部品の搬送用トレー。
- 前記プレート部はアルミニウムで形成されると共に、5μm以下の酸化アルミ被覆層が設けられており、当該酸化アルミ被覆層に、前記溝又は穴が形成されており、
前記仕切り部材は、導電性樹脂で形成されている、請求項1に記載の面実装電子部品の搬送用トレー。
Priority Applications (1)
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JP2010226418A JP5901110B2 (ja) | 2010-10-06 | 2010-10-06 | 面実装電子部品の搬送用トレー |
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JP2010226418A JP5901110B2 (ja) | 2010-10-06 | 2010-10-06 | 面実装電子部品の搬送用トレー |
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JP2012080028A JP2012080028A (ja) | 2012-04-19 |
JP5901110B2 true JP5901110B2 (ja) | 2016-04-06 |
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JP2010226418A Active JP5901110B2 (ja) | 2010-10-06 | 2010-10-06 | 面実装電子部品の搬送用トレー |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6424719B2 (ja) * | 2015-04-06 | 2018-11-21 | 三菱電機株式会社 | 半導体試験治具、半導体装置の試験方法 |
CN107922109B (zh) * | 2015-08-11 | 2020-04-24 | 东芝存储器株式会社 | 磁屏蔽托盘、磁屏蔽包覆件及屏蔽外部磁场的磁性存储器产品 |
CN108231657B (zh) * | 2017-12-22 | 2023-08-18 | 广东中图半导体科技股份有限公司 | 一种图形化蓝宝石衬底刻蚀用的托盘装置及装载方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0624481A (ja) * | 1992-06-29 | 1994-02-01 | Sony Corp | 電子部品収納用トレイ |
JP3315168B2 (ja) * | 1992-10-30 | 2002-08-19 | 新日本石油化学株式会社 | 電子部品用パレット |
JP2003226395A (ja) * | 2002-01-31 | 2003-08-12 | Toyo Jushi Kk | 電子部品用トレー |
US7364778B2 (en) * | 2002-06-24 | 2008-04-29 | Denki Kagaku Kogyo Kabushiki Kaisha | Container for an electronic component |
JP2006147664A (ja) * | 2004-11-16 | 2006-06-08 | Hitachi Ltd | 電子装置用モールド部品、および電子装置 |
JP5250868B2 (ja) * | 2008-08-04 | 2013-07-31 | セイコーNpc株式会社 | チップ収納トレイ |
DE202009001817U1 (de) * | 2009-01-31 | 2009-06-04 | Roth & Rau Ag | Substratträger zur Halterung einer Vielzahl von Solarzellenwafern |
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- 2010-10-06 JP JP2010226418A patent/JP5901110B2/ja active Active
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