JP2012080028A - 面実装電子部品の搬送用トレー - Google Patents
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Abstract
【解決手段】 半導体デバイスを含む面実装電子部品をその製造工程または検査工程に搬送するために使用される面実装電子部品の搬送用トレーであって、導電性および〔100〕℃以上の耐熱性の少なくとも何れかの特性を具備する材料からなるプレート部と、当該プレート部の少なくとも一方の面上にリブ状に設けられ、各面実装電子部品を収容する複数の空間を区画する樹脂製の仕切り部とからなり、当該プレート部と仕切り部とが一体化されている面実装電子部品の搬送用トレーとする。
【選択図】図3
Description
そこで本発明は、優れた耐熱性を備えながらも、比較的安価に製造することのできる面実装電子部品の搬送用トレーを提供することを第二の課題とする。
そこで本発明はソリ変形の発生の問題をなくし、特にベーキング工程等で高温環境下に置かれた場合でも、そり変形が生じない面実装電子部品の搬送用トレーを提供することを第3の課題とする。
そこで本発明は電気抵抗が小さく、静電気を帯電しないようにした面実装電子部品の搬送用トレーを提供することを第4の課題とする。
導電性は、表面抵抗が107Ω/□以下の導電性(静電気散逸性)であることが望ましいが、本発明においては表面抵抗が108〜12Ω/□の帯電防止レベルの電気抵抗であっても良い。また耐熱性は100℃以上、望ましくは120℃以上でも外観の変化(ふくれ、ひび割れ、変形、変色など)がなく、連続使用が可能であるものを使用する。
10 仕切り部
20 プレート部
25 表面処理領域(表面処理)
30 金型
50 搬送用トレー
Claims (3)
- 半導体デバイスを含む面実装電子部品をその製造工程または検査工程に搬送するために使用される面実装電子部品の搬送用トレーであって、
導電性および100℃以上の耐熱性の少なくとも何れかの特性を具備する材料からなるプレート部と、
当該プレート部の少なくとも一方の面上にリブ状に設けられ、各面実装電子部品を収容する複数の空間を区画する樹脂製の仕切り部とからなり、
当該プレート部と仕切り部とが一体化されていることを特徴とする、面実装電子部品の搬送用トレー。 - 前記当該プレート部と仕切り部との一体化は、
プレート部における少なくとも仕切り部が設置される領域に微細な凹凸を形成すると共に、前記仕切り部をインサート成型してなる、請求項1に記載の面実装電子部品の搬送用トレー。 - 前記プレート部は金属またはセラミックで形成されると共に、少なくとも仕切り部が形成される側の面は平坦に形成されており、当該仕切り部が設置される領域にはエッチング処理により溝が形成されているか、又は25nm以上の直径で開口する穴が無数に形成されており、
前記仕切り部は、当該溝又は孔内に食い込んで結着した状態に接合されている、請求項1又は2に記載の面実装電子部品の搬送用トレー。
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JP2012080028A true JP2012080028A (ja) | 2012-04-19 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016197689A (ja) * | 2015-04-06 | 2016-11-24 | 三菱電機株式会社 | 半導体試験治具、半導体装置の試験方法 |
WO2017025815A1 (en) * | 2015-08-11 | 2017-02-16 | Kabushiki Kaisha Toshiba | Magnetic shield tray, magnetic shield wrapper and magnetic memory product shielded from external magnetic field |
CN108231657A (zh) * | 2017-12-22 | 2018-06-29 | 东莞市中图半导体科技有限公司 | 一种图形化蓝宝石衬底刻蚀用的托盘装置及装载方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0624481A (ja) * | 1992-06-29 | 1994-02-01 | Sony Corp | 電子部品収納用トレイ |
JPH06144481A (ja) * | 1992-10-30 | 1994-05-24 | Nippon Petrochem Co Ltd | 電子部品用パレット |
JP2003226395A (ja) * | 2002-01-31 | 2003-08-12 | Toyo Jushi Kk | 電子部品用トレー |
US20030235041A1 (en) * | 2002-06-24 | 2003-12-25 | Denki Kagaku Kogyo Kabushiki Kaisha | Container for an electronic component |
JP2006147664A (ja) * | 2004-11-16 | 2006-06-08 | Hitachi Ltd | 電子装置用モールド部品、および電子装置 |
JP2010040681A (ja) * | 2008-08-04 | 2010-02-18 | Seiko Npc Corp | チップ収納トレイ |
WO2010085949A2 (de) * | 2009-01-31 | 2010-08-05 | Roth & Rau Ag | Substratträger zur halterung von substraten |
-
2010
- 2010-10-06 JP JP2010226418A patent/JP5901110B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0624481A (ja) * | 1992-06-29 | 1994-02-01 | Sony Corp | 電子部品収納用トレイ |
JPH06144481A (ja) * | 1992-10-30 | 1994-05-24 | Nippon Petrochem Co Ltd | 電子部品用パレット |
JP2003226395A (ja) * | 2002-01-31 | 2003-08-12 | Toyo Jushi Kk | 電子部品用トレー |
US20030235041A1 (en) * | 2002-06-24 | 2003-12-25 | Denki Kagaku Kogyo Kabushiki Kaisha | Container for an electronic component |
JP2006147664A (ja) * | 2004-11-16 | 2006-06-08 | Hitachi Ltd | 電子装置用モールド部品、および電子装置 |
JP2010040681A (ja) * | 2008-08-04 | 2010-02-18 | Seiko Npc Corp | チップ収納トレイ |
WO2010085949A2 (de) * | 2009-01-31 | 2010-08-05 | Roth & Rau Ag | Substratträger zur halterung von substraten |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016197689A (ja) * | 2015-04-06 | 2016-11-24 | 三菱電機株式会社 | 半導体試験治具、半導体装置の試験方法 |
WO2017025815A1 (en) * | 2015-08-11 | 2017-02-16 | Kabushiki Kaisha Toshiba | Magnetic shield tray, magnetic shield wrapper and magnetic memory product shielded from external magnetic field |
CN107922109A (zh) * | 2015-08-11 | 2018-04-17 | 东芝存储器株式会社 | 磁屏蔽托盘、磁屏蔽包覆件及屏蔽外部磁场的磁性存储器产品 |
CN108231657A (zh) * | 2017-12-22 | 2018-06-29 | 东莞市中图半导体科技有限公司 | 一种图形化蓝宝石衬底刻蚀用的托盘装置及装载方法 |
CN108231657B (zh) * | 2017-12-22 | 2023-08-18 | 广东中图半导体科技股份有限公司 | 一种图形化蓝宝石衬底刻蚀用的托盘装置及装载方法 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |