1333924 九、發明說明： 本申請案係根據2 0 0 3年1 1月7曰提出之美國專利第 6 0 / 5 1 8，1 8 8號申請案主張優先權，並在此併入該案内容以 供參考。 【發明所屬之技術領域】 本發明係關於容納矽晶圓或記憶體碟片等之裝置，以用 於運送、儲存及製程中。更精確言之，本發明係關於一種 具有防靜電功能的基板容器。 【先前技術】 基板載具係在製程之前、中、後被利用來固持、運送及 儲存基板。例如此類基板係在製造半導體元件時所使用之 晶圓、磁性儲存碟片基板及液晶顯示器面板用基板等。在 該等轉變成為最終製品之前，這些精密而貴重之基板係受 到重複之處理、儲存及運送。眾所周知，半導體晶圓極易 受到環境之影響而損壞，而這些影響係諸如塵埃、靜電放 電、震動及氣體圍阻（gaseous containment)。 灰塵及來自周遭大氣之微粒等形式的污染物在附著至 基板，將對其造成無法復原之損害。由於積體電路之尺寸 不斷地縮小，可對積體電路造成污染之粒子的尺寸亦變得 更小，因此，如何將污染物降至最低係變得至為重要。半 導體產業採用複雜之方法，例如無塵室，就是為了防止這 樣的事情發生。在半導體產業中以能接受的污染作為單一 最大產量損失之理由。 微粒形式之污染物可因磨損而產生，例如晶圓或碟片、 5 312XP/發明說明書(補件)/94-02/93133978 1333924 載具蓋子或殼體、儲存架、其他載具或處理設備對 造成之摩擦或破損。因此，載具最需要之特性即為 型材料在磨損、摩擦或刮損時的抗粒子產生性。美 第5，7 8 0 , 1 2 7號揭示適用於晶圓載具材料之塑膠的 性。該專利係併入於此以供參考。 如上所述，可知有必要在製程中的每一步驟以保 板。晶圓載具的目的之一即在於提供如此之保護。 具之一例為前開口莢式容器（Front Opening Unifi system，F 0 U P )，例如由安堤格里斯公司所製造之 晶圓載具。F0UP設有一防護蓋，以保護晶圓在製造' 運送及儲存的過程中，不會接觸到大氣中的塵埃微 受到化學污染。 晶圓載具的第二個目的係在運送過程中，能夠牢 持晶圓片。載具係大致建構成將晶圓或碟片軸向配 槽中，並由從晶圓或碟片之圓周邊緣上或邊緣附近 撐。習知技術中，晶圓或碟片習慣上係可轉動在載 向向上或側邊。美國專利第6, 428,729號揭示一種 具，其係建構成一具有晶圓支撐架的製程加強載具 (process enhancement carrier)。該專利係併入 供參考。 此外，由於晶圓片之製程般地係已自動化，因此 要將碟片相對於製程設備而精密地定位，以使機器 夠移除及插入晶圓。習知的晶圓載具，如同其使用 成零件者，會因為組成塑膠零件之公差的累積，而 312XP/發明說明書(補件)/94-02/93133978 於載具 塑膠成 國專利 各種特 護基 晶圓載 e d Pod F300 輸送、 粒且不 固地夾 置於狹 將其支 具之徑 晶圓載 於此以 ，有必 手臂能 多數組 使臨界 6 1333924 的尺寸發生非預期的改變。為了能夠克服在製造晶圓載 具，使其在晶圓平面與外部製程設備界面間具有可接受公 差時所遭遇的困難，習知技術中係採用單體晶圓載具。 載具外殼所使用的材料必須使其能夠在其產品生命週 期内維持其尺寸的穩定性，即便是重複的製程及運送會在 載具上產生應力。尺寸之穩定性係在防止晶圓或碟片的損 壞或將晶圓或碟片在載具内之移動最小化時所必要者。用 以固持晶圓及碟片之狭槽的公差一般係相當小，且在將晶 圓或碟片移入、移出載具或在其内移動時，任何載具的變 形皆可直接對極易脆之晶圓造成損害，或者增加磨損並因 此產生微粒。尺寸之穩定性在載具承受方某方向之負載時 亦非常重要，例如在運貨過程中載具被堆疊之情形，或者 載具整合於製程設備的情形。載具之材料亦必須能在儲存 或清潔時所遭遇的溫度提升之情況下，以維持其尺寸之穩 定性。 在處理半導體晶圓時，靜電一直是個受關切的課題。半 導體產業所使用之習知的載具會產生靜電荷並使其殘留。 當殘留有靜電荷的塑膠零件接觸到電子元件或製程設備 時，其將會在靜電放電（ESD)之破壞現象中放電。因此， 需要一種具有分散靜電之特性的載具，以消除ESD並避免 吸引微粒。目前之晶圓載具係已使用習知的靜電分散材料 來製造，例如碳填充聚醚醚銅（PEEK)及碳填聚碳酸酯（PC)。 密閉容器内之晶圓之觀看係極需要且此亦為終端使用 者所要求。透明塑膠，例如聚碳酸酯，已被採用來達成此 7 312XP/發明說明書(補件)/94-02/93133978 1333924 一目的，因為其成本較低。然而，其並不具有所需之靜電 分散特性或抗磨損性。 載具一般係由塑膠射出成型所形成，塑膠材料例如聚碳 酸酯（PC)、丙烯脯（ABS)、聚丙烯（PP)、聚乙烯（PE)、 有側鏈的聚四氟乙烯（PFA)及聚醚醚銅（PEEK)。須了解 是載具之某一功能的理想材料通常並不是同一載具之不同 功能的理想材料。例如，P E E K係一種對於晶圓接觸部分具 有抗磨損特性的理想材料，然而，相對於其他塑膠材料而 言卻難以模塑且成本學貴。 填料亦可被加入射出成型之塑膠中而作為靜電分散之 用。此種填料包括碳粉或碳纖維、金屬纖維、鍍有金屬之 石墨以及有機（胺基）添加物。美國專利第6，4 2 8 , 7 2 9號 教示複合基板載具，特別是以至少兩種不同熔融加工型塑 膠材料所形成之晶圓載具，其中將兩種塑膠材料有計劃地 配置而對效能最佳化。 在此需要強調的是在設計晶圓載具時，用於建構載具之 材料的成本與其模塑的容易性係重要的考量之一。 【發明内容】 本發明揭示一種基板載具，其包括一容器部分，容器部 分具有一内部空腔，可在加工、運送與支撐時作為基板之 保護容納部。此容器部分具有一獨特手段以防止載具產生 靜電，並結合數種材料以提供最佳效能特性。在一較佳實 施例中，晶圓係支撐在側邊支撐列上，其係從容器部分的 壁上延伸且藉由例如包覆成型（overmolding)之一體成型 8 312XP/發明說明書(補件)/94-02/93133978 1333924 而成。密閉容器内的晶圓可藉由基本上為整個殼體的透明 部分或藉由在容器内包覆成型所形成之視窗來協助觀視。 如導電材料所構成之路徑係使用包覆成型之製程所製造， 包覆成型之製程可擴及視窗或外殼的透明部分、側晶圓支 撐列和莢式外殼。此導電材料可自透明部分突出而形成實 體的屏障，以防止或最小化由把手或物件實際接觸到透明 部分。 在較佳實施例中的一優點與特性為一系列間隔之傳導 路徑係形成於晶圓容器外殼.的外部。此一系列之路徑可被 配置成一陣列，其包括可有效地覆蓋特定透明部分的網 格，特別是易於與具有靜電荷物體接觸的部分或是可藉由 該接觸而產生電荷的部分。 【實施方式】 參照圖1，元件符號20表示一容器模組或晶圓FOUP， 其具有容器部分25及門28(圖6)，容器部分25具有手 提鞍座27，而門28可密封該容器25且藉由閂鎖機構29 而固定於其上。 如圖1所示，元件符號20表示FOUP之外殼，係主要包 含莢式外殼3 0，其具有前部3 5、後部4 0、頂壁4 2、側壁 45、46及底部50»莢式外殼係支撐於導電接地底盤55上， 底部5 0係與接地底盤5 5接觸。在一較佳實施例中，導電 底盤5 5係電性接地且被設計成具有3個構成如溝槽5 6的 介面結構，溝槽56包含運動學上之耗合57，如圖4所示。 側壁4 5、4 6係連續的且厚實的。圖1及圊2顯示容器的開 9 312XP/發明說明書(補件)/94-02/93133978 1333924 放内部6 5。側壁4 5、4 6之整體係為一對晶圓側列7 Ο，其 各包含複數個放置架75且界定一晶圓收容區80，各放置 架具有晶圓接合部分85。在一較佳實施例中，頂壁42設 有導引肋1 1 0，以適於可滑動地收容一機器手臂凸緣11 5， 而藉由空中吊重傳送（overhead hoist transfer， ΟΗΤ) (未圖示）手段將莢式外殼夾持並吊起。 在一較佳實施例中，莢式外殼3 0較佳地係由聚碳酸酯 或聚醚醯亞胺等之射出成型而成。一般而言，若莢式外殼 係由一不透明材料所製成，則在莢式外殼3 0上欲模塑有一 觀視窗1 2 0。觀視窗1 2 0較佳地係包含由大致透明或半透 明的材料製成。一般而言，各側壁4 5、4 6上可設有大致透 明的視窗，以允許從外側觀視不透明之莢式外殼3 0内的晶 圓。 在另一較佳實施例中，側列7 0係以射出成型而與莢式 外殼形成一體，以使莢式外殼能與側列組成一個單體。側 列7 0可具有導電脈部1 2 5，其係由例如碳填充P E E K之靜 電分散材料（static dissipative material， SDM)包覆 成型而成，如圖2所示。如圖2所示，脈部係形成一將頂 壁42連接至底部50及導電接地底盤55之導電路徑。在圖 5所示之另一實施例中，導電脈可與導電襯墊1 3 5電性耦 合，導電襯墊135模塑於側壁45' 46之位置140' 141處 且自側壁4 5、4 6突出，而位置1 4 0、1 4 1形成於側壁的負 載分散手提鞍部2 7之裝附點。導電路徑係被配置成一陣 列，其可包括一具有由外殼之透明材料所隔開之重複路徑 10 312XP/發明說明書(補件)/94-02/93133978 1333924 的網格。導電路徑之間隔一般係為1 / 2英吋至I又1 / 2英 吋之間。手提鞍部2 7係與機器手臂凸緣1 1 5形成弧形，而 作用為將來自機器手臂凸緣1 1 5的負載分散至側壁4 5、 4 6。手提鞍部與導電襯墊1 3 5間的内部連結可有效地提供 一導電路徑，以將操作期間可能累積於機器手臂凸緣1 1 5 上的靜電荷接地。 “導電（傳導）”在此係指元件或紋理或材料至少可分 散靜電且可將一般上下文之晶圓容器所會產生的靜電荷放 電。一般而言，靜電分散之材料具有一表面電阻在每平方 單位1 0 5至1 0 12歐姆之範圍。電阻小於此值的材料則適於 提供接地的導電路徑。 在另一實施例中，視窗1 2 0與側列7 0可具有一包覆成 型導電肋陣列170，其具有導電肋190如圖4所示。導電 肋陣列1 7 0理想地係藉由將碳填充P E E K或類似可提供靜電 分散功能之材料包覆成型所形成'然而，由於肋陣列橫跨 於側壁4 5、4 6上相當大面積的範圍，因此，藉由使用最少 量之昂貴的SDM材料，例如PEEK，而提供一將主列蓋莢式 外殼3 0上延伸範圍之靜電荷接地的手段。此外，在較佳實 施例中，肋陣列可提供一實體屏障，以接觸視窗或載具的 其他重要部分。此處所述之陣列可與向外地面向之透明表 面齊平、嵌入該表面下或突出於向外地面向之透明表面 外。突出方式配置提供了該實體屏障。 參照圖6，在另一實施例中，一導電網格網路1 8 0係包 覆成型涵蓋於大致整個透明之莢式外殼3 0上。該陣列或網 11 312XP/發明說明書(補件)/94-02/93133978 1333924 格包括導電材料1 8 5，且可採用以提供莢式外殼任何所 部分的電荷一路徑予以接地。將所了解的是，該陣列或 格的網狀組織可為非均勻者，且在莢式外殼較易累積靜 荷的區域則具有較細緻的網孔或更密的網孔分布。該陣 或網格可包括任意地暴露於外殼外之重複系列的傳導線 網格1 8 0例如可為直線環繞或非直線環繞或曲線環繞或 曲線環繞的莢式外殼3 0，且可先成型並接著放回以射出 型而在其上形成一 PEEK網格170»在此製程中，理想之 型溫度係保持在聚碳酸酯之玻璃轉換溫度以下，其大約 1 4 9 °C以防止聚碳酸酯之基底部分變形。圖7及圖8分別 示肋及視窗處之側壁橫剖面的導電材料1 8 5。 在特殊之應用中，可適合的使第一射出成型部分（即 網格部分）的體積小於第二包覆成型部分（即，莢式外殼 在其他應用中，第一材料係包含例如導電網格，且可被 置於允許材料硬化之塑模的重要部分，例如晶圓接觸區 及視窗區域，而第二部分，例如包含莢式外殼之材料之 碳酸酯，則在不改變塑模下包覆成型於第一材料上。 在其他特殊應用中，第二材料不必允許要固化，兩種 料可在同時皆為熔態時結合。此共射出成型雖然可能無 提供定位第一部分與第二部分間介面時的精度，然而其 湞除額外成型的需要及允許，使第一部分固化之步驟， 塑模中移除該部分，將第一部分放置於第二塑模。 上述實施例應被視為例示性而非限制本發明之範圍 者，在不離開本發明之精神或主要特徵下，可將其修改 312XP/發明說明書(補件)/94-02/93133978 需 網 電 列 e 非 成 成 為 顯 5 )° 配 域 聚 材 法 可 從 成 12 1333924 其他特殊形式。 【圖式簡單說明】 圖1為本發明之晶圓載具之容器部分的立體圖。 圖2為晶圓支撐列的立體圊。 圖3為晶圓載具的部分視圖，顯示晶圓載具之側壁上的 傳導翼。 圖4為本發明之晶圓載具之容器部分的立體圖。 圖5為具有把手之晶圓支撐架的細部傳導連接視圖。 圖6為本發明之晶圓載具的立體圖。 圖7為本發明之視窗部分的橫剖面圖，其具有一列自其 突出的肋部。 圖8為本發明之視窗部分的橫剖面圖，其具有格狀之模 塑於其中的導電材料。 【主要元件符號說明】 2 0 晶圓FOUP (外殼、容器模組） 25 容器部分 27 手提鞍座 28 門 29 Η鎖機構 3 0 莢式外殼 35 前部 40 後部 4 2 頂壁 45 側壁 13 312ΧΡ/發明說明書(補件)/94-02/93133978 1333924 46 側 壁 5 0 底 部 55 底 盤 5 6 溝 槽 57 運 動 學 上 之 耦合 65 内 部 70 晶 圓 側 列 75 放 置 架 8 0 晶 圓 收 容 區 85 晶 圓 接 合 部 分 110 導 引 肋 115 機 器 手 臂 凸 緣 120 觀 視 窗 12 5 導 電 脈 部 135 導 電 襯 塾 14 0 位 置 14 1 位 置 170 導 電 肋 陣 列 180 網 格 185 導 電 材 料 190 導 電 肋 312XP/發明說明書(補件)/94-02/931339781333924 IX. INSTRUCTIONS: This application claims priority based on U.S. Patent No. 6,0/8,8,8,8, filed on January 1, 2003, and is incorporated herein by reference. The content is for reference. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for accommodating a wafer or a memory disk or the like for use in transportation, storage, and processing. More specifically, the present invention relates to a substrate container having an antistatic function. [Prior Art] The substrate carrier is utilized to hold, transport, and store the substrate before, during, and after the process. For example, such a substrate is a wafer used for manufacturing a semiconductor element, a magnetic storage disk substrate, a substrate for a liquid crystal display panel, or the like. These delicate and expensive substrates are subject to repeated processing, storage and shipping before they are converted into final products. It is well known that semiconductor wafers are highly susceptible to environmental damage such as dust, electrostatic discharge, vibration, and gaseous containment. Contaminants in the form of dust and particles from the surrounding atmosphere are attached to the substrate, causing irreparable damage. As the size of the integrated circuit continues to shrink, the size of the particles that can contaminate the integrated circuit becomes smaller, so how to minimize the pollutants becomes important. The semiconductor industry uses sophisticated methods, such as clean rooms, to prevent this from happening. Acceptable pollution in the semiconductor industry is the reason for a single maximum production loss. Particulate contaminants in particulate form can be caused by wear, such as wafers or discs, 5 312XP / invention manual (supplement) /94-02/93133978 1333924 carrier cover or housing, storage rack, other vehicles or processing equipment The friction or damage caused. Therefore, the most desirable property of the carrier is the resistance to particle generation of the material during wear, friction or scratching. Beauty Nos. 5, 7 8 0 , 1 2 7 reveals the properties of plastics suitable for wafer carrier materials. This patent is incorporated herein by reference. As described above, it is known that it is necessary to protect the board at every step in the process. One of the purposes of wafer carriers is to provide such protection. One example is a Front Opening Unifi system (F 0 U P ), such as a wafer carrier manufactured by Antegris. The F0UP is equipped with a protective cover to protect the wafer from chemical contamination during the manufacturing and shipping process without exposure to dust in the atmosphere. The second purpose of the wafer carrier is to hold the wafer during transport. The carrier is constructed substantially in the axial alignment of the wafer or disc and is supported by or near the circumferential edge of the wafer or disc. In the prior art, wafers or discs are conventionally rotatably mounted on the upward or side. U.S. Patent No. 6,428,729 discloses an apparatus which is constructed to form a process enhancement carrier having a wafer support. This patent is incorporated by reference. In addition, since the wafer process is automated, the disc is precisely positioned relative to the process equipment to allow the machine to be removed and inserted into the wafer. Conventional wafer carriers, as they are used as parts, will accumulate tolerances for the composition of plastic parts, and 312XP/invention manual (supplement)/94-02/93133978 The round-loaded ed Pod F300 is transported, granules, and not fixedly placed in a narrow position. The wafers of its support are carried here. There are multiple arrays of arms that can cause unexpected changes in the size of the critical 6 1333924. In order to overcome the difficulties encountered in fabricating wafer carriers with acceptable tolerances between the wafer plane and the external process equipment interface, conventional wafer carriers are used in the prior art. The material used in the vehicle housing must be such that it maintains dimensional stability throughout its product life cycle, even if repeated processes and shipping can cause stress on the carrier. The dimensional stability is necessary to prevent damage to the wafer or disc or to minimize movement of the wafer or disc within the carrier. The tolerances used to hold the slots of the wafer and the disc are generally quite small, and any deformation of the carrier can be directly fragile when the wafer or disc is moved into and out of the carrier or moved within it. The wafer causes damage or increases wear and therefore particles. The dimensional stability is also important in the load of the carrier in one direction, such as when the carrier is stacked during shipment, or when the carrier is integrated into the process equipment. The material of the vehicle must also be able to maintain its dimensional stability during the temperature increase encountered during storage or cleaning. Static electricity has always been a subject of concern when dealing with semiconductor wafers. Conventional carriers used in the semiconductor industry generate static charges and cause them to remain. When an electrostatically charged plastic part comes into contact with an electronic component or process equipment, it will discharge in the event of electrostatic discharge (ESD) damage. Therefore, there is a need for a carrier having the property of dissipating static electricity to eliminate ESD and avoid attracting particles. Current wafer carriers have been fabricated using conventional electrostatically dispersed materials such as carbon filled polyetheretherketone (PEEK) and carbon filled polycarbonate (PC). The viewing of wafers in a closed container is highly desirable and is also required by the end user. Transparent plastics, such as polycarbonate, have been used to achieve this 7 312 XP/Invention Manual (supplement) / 94-02/93133978 1333924 because of its lower cost. However, it does not have the required electrostatic dispersion characteristics or abrasion resistance. The carrier is generally formed by plastic injection molding, such as polycarbonate (PC), acrylonitrile (ABS), polypropylene (PP), polyethylene (PE), and side chains of polytetrafluoroethylene (PFA). And polyetheretherketone (PEEK). It is important to understand that the ideal material for a particular function of the vehicle is not ideal for the different functions of the same vehicle. For example, P E E K is an ideal material with anti-wear properties for wafer contact portions, however, it is difficult to mold and cost-effective compared to other plastic materials. Fillers can also be added to the injection molded plastic for electrostatic dispersion. Such fillers include carbon powder or carbon fiber, metal fibers, metal-plated graphite, and organic (amino) additives. U.S. Patent No. 6, 4 2 8 , 7 2 9 teaches a composite substrate carrier, particularly a wafer carrier formed from at least two different melt-processed plastic materials, wherein two plastic materials are planned to be disposed Optimized performance. It is important to emphasize here that the cost of constructing the carrier material and the ease with which it is molded are one of the important considerations when designing the wafer carrier. SUMMARY OF THE INVENTION The present invention discloses a substrate carrier that includes a container portion having an internal cavity that serves as a protective housing for the substrate during processing, transport, and support. This container portion has a unique means to prevent the carrier from generating static electricity and to combine several materials to provide optimum performance characteristics. In a preferred embodiment, the wafer is supported on a side support row extending from the wall of the container portion and formed by, for example, overmolding. 8 312XP / Invention Specification (Replenishment) /94-02/93133978 1333924 Made. The wafer in the closed container can be viewed by substantially a transparent portion of the entire housing or by a window formed by overmolding the container. For example, the path formed by the conductive material is manufactured by an overmolding process, and the overmolding process can be extended to the transparent portion of the window or the outer casing, the side wafer support column, and the pod outer casing. This electrically conductive material can protrude from the transparent portion to form a solid barrier to prevent or minimize the actual contact of the handle or article to the transparent portion. An advantage and feature in the preferred embodiment is that a series of spaced conductive paths are formed on the exterior of the wafer container housing. The series of paths can be configured in an array comprising a mesh that effectively covers a particular transparent portion, particularly a portion that is susceptible to contact with an electrostatically charged object or a portion that can generate a charge by the contact. [Embodiment] Referring to Figure 1, component symbol 20 designates a container module or wafer FOUP having a container portion 25 and a door 28 (Fig. 6). The container portion 25 has a portable saddle 27, and the door 28 seals the container. 25 is fixed thereto by a latch mechanism 29. As shown in FIG. 1, the symbol 20 indicates the outer casing of the FOUP, and mainly includes a pod casing 30 having a front portion 35, a rear portion 40, a top wall 4, side walls 45, 46, and a bottom 50» pod housing. It is supported on the conductive grounding chassis 55, and the bottom 50 is in contact with the grounding chassis 55. In a preferred embodiment, the conductive chassis is electrically grounded and designed to have three interface structures, such as trenches 56, which contain kinematically 57, as shown in FIG. . The side walls 4 5, 4 6 are continuous and thick. Figures 1 and 2 show the opening of the container 9 312XP / invention manual (supplement) /94-02/93133978 1333924 put the internal 6 5 . The sidewalls 4 5, 46 are integrally formed as a pair of wafer side columns 7 Ο each comprising a plurality of placement shelves 75 and defining a wafer containment region 80, each shelf having a wafer bond portion 85. In a preferred embodiment, the top wall 42 is provided with a guiding rib 110 for slidably receiving a robot arm flange 11 5 by overhead hoist transfer (ΟΗΤ) ( Not shown) means that the pod housing is clamped and lifted. In a preferred embodiment, the pod housing 30 is preferably formed by injection molding of polycarbonate or polyether quinone. In general, if the pod housing is made of an opaque material, a viewing window 120 is molded on the pod housing 30. The viewing window 120 preferably comprises a substantially transparent or translucent material. In general, each of the side walls 45, 46 may be provided with a substantially transparent window to allow viewing of the crystals within the opaque pod housing 30 from the outside. In another preferred embodiment, the side rows 70 are integrally formed with the pod housing by injection molding so that the pod housing can form a single unit with the side rows. The side column 70 may have a conductive vein portion 1 2 5 which is overmolded by a static dissipative material (SDM) such as carbon filled P E E K as shown in FIG. As shown in Figure 2, the veins form a conductive path connecting the top wall 42 to the bottom 50 and the conductive ground chassis 55. In another embodiment shown in FIG. 5, the conductive traces can be electrically coupled to the conductive pads 135, and the conductive pads 135 are molded at the locations 140' 141 of the sidewalls 45' 46 and from the sidewalls 4 5, 4 6 protrudes, and the position 1 4 0, 1 4 1 is formed on the side wall of the load-distributing portable saddle portion 27 of the attachment point. The conductive paths are arranged in an array which may comprise a grid having a repeating path 10 312 XP / invention specification (supplement) / 94-02/93133978 1333924 separated by a transparent material of the outer casing. The spacing of the conductive paths is typically between 1 / 2 inch and 1 and 1 / 2 inch. The portable saddle 2 7 is curved with the robot arm flange 1 15 and functions to distribute the load from the robot arm flange 1 15 to the side walls 45, 46. The internal connection between the portable saddle and the conductive pad 135 effectively provides a conductive path to ground the static charge that may accumulate on the arm flange 1 15 during operation. By "conducting (conducting)" is meant herein that the element or texture or material dissipates at least static electricity and discharges the static charge that would otherwise be generated by the wafer container of the general context. In general, the electrostatically dispersed material has a surface resistance in the range of from 1 0 5 to 10 12 ohms per square unit. Materials with a resistance less than this value are suitable for providing a conductive path to ground. In another embodiment, the window 120 and the side column 70 may have a sheath-shaped conductive rib array 170 having conductive ribs 190 as shown in FIG. The array of conductive ribs 170 is desirably formed by overmolding carbon-filled PEEK or a similar material that provides electrostatic dispersion. However, due to the relatively large area of the rib array across the sidewalls 45, 46 Thus, by using a minimum amount of expensive SDM material, such as PEEK, a means of grounding the static charge over the extended range of the main column pod housing 30 is provided. Moreover, in a preferred embodiment, the rib array can provide a physical barrier to contact the window or other important portion of the carrier. The arrays described herein may be flush with the outwardly facing transparent surface, embedded under the surface, or protruded beyond the transparent surface facing outwardly. The physical mode barrier is provided by the prominent mode configuration. Referring to Figure 6, in another embodiment, a conductive mesh network 180 is overmolded to cover substantially the entire transparent pod housing 30. The array or mesh 11 312XP/invention specification (supplement)/94-02/93133978 1333924 includes a conductive material 185 and can be grounded to provide any portion of the charge path of the pod housing. It will be appreciated that the array or lattice network may be non-uniform and have a finer mesh or denser mesh distribution in areas where the pod housing is more susceptible to accumulation of static charge. The array or grid may comprise a repeating series of conductive line grids arbitrarily exposed outside the outer casing, such as a pod-shaped outer casing 30 that may be linearly or non-linearly wrapped or curved or curved, and may be formed first And then returning to form a PEEK grid 170 on the injection type. In this process, the ideal temperature is maintained below the glass transition temperature of the polycarbonate, which is about 149 ° C to prevent polycarbonate. The base portion of the ester is deformed. Figures 7 and 8 show conductive material 185 of the cross-section of the sidewalls of the rib and the window, respectively. In a particular application, it may be desirable to have the first injection molded portion (ie, the mesh portion) have a smaller volume than the second overmold portion (ie, the pod housing in other applications, the first material system comprising, for example, a conductive mesh And can be placed in a significant part of the mold that allows the material to harden, such as the wafer contact area and the window area, while the second part, such as the carbonate containing the material of the pod housing, is coated without changing the mold. Formed on the first material. In other special applications, the second material does not have to be allowed to cure, and the two materials can be combined while being in a molten state. This common injection molding may not provide positioning between the first part and the second part. The accuracy of the interface, however, eliminates the need for additional molding and allows for the first portion to be cured, the portion of the mold removed, and the first portion placed in the second mold. The above embodiment should be considered exemplary Without limiting the scope of the invention, it is possible to modify the 312XP/invention specification (supplement)/94-02/93133978 without leaving the spirit or main features of the invention. Become significant 5) ° Method ligand domain from the polyethylene sheet to 121,333,924 in other specific forms. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a container portion of a wafer carrier of the present invention. Figure 2 is a perspective view of the wafer support column. Figure 3 is a partial view of the wafer carrier showing the conductive wings on the sidewalls of the wafer carrier. 4 is a perspective view of a container portion of a wafer carrier of the present invention. Figure 5 is a detailed conductive connection view of a wafer support with a handle. Figure 6 is a perspective view of a wafer carrier of the present invention. Figure 7 is a cross-sectional view of the window portion of the present invention having a row of ribs projecting therefrom. Figure 8 is a cross-sectional view of the window portion of the present invention having a grid of electrically conductive material molded therein. [Main component symbol description] 2 0 wafer FOUP (housing, container module) 25 container part 27 portable saddle 28 door 29 shackle mechanism 3 0 pod housing 35 front 40 rear 4 2 top wall 45 side wall 13 312 ΧΡ / Disclosure of Invention (Supplement) /94-02/93133978 1333924 46 Sidewall 50 Lower Bottom 55 Chassis 5 6 Groove 57 Kinematic Coupling 65 Internal 70 Wafer Side Column 75 Placement Frame 8 0 Wafer Housing Area 85 Wafer Bonding Portion 110 Guide Rib 115 Robot Arm Flange 120 View Window 12 5 Conductive Pulse 135 Conductive Lining 14 0 Position 14 1 Position 170 Conductor Rib Array 180 Grid 185 Conductive Material 190 Conductive Rib 312XP / Invention Specification (Supplement) / 94-02/93133978