CN110190018A - 一种拼接式的硅片承载框 - Google Patents
一种拼接式的硅片承载框 Download PDFInfo
- Publication number
- CN110190018A CN110190018A CN201910587534.1A CN201910587534A CN110190018A CN 110190018 A CN110190018 A CN 110190018A CN 201910587534 A CN201910587534 A CN 201910587534A CN 110190018 A CN110190018 A CN 110190018A
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- longitudinal
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 41
- 239000010703 silicon Substances 0.000 title claims abstract description 41
- 238000009434 installation Methods 0.000 claims abstract description 18
- 238000010030 laminating Methods 0.000 claims description 6
- 238000003860 storage Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 30
- 239000002131 composite material Substances 0.000 description 6
- 230000000712 assembly Effects 0.000 description 5
- 238000000429 assembly Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
- H01L21/67323—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910587534.1A CN110190018B (zh) | 2019-07-01 | 2019-07-01 | 一种拼接式的硅片承载框 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910587534.1A CN110190018B (zh) | 2019-07-01 | 2019-07-01 | 一种拼接式的硅片承载框 |
Publications (2)
Publication Number | Publication Date |
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CN110190018A true CN110190018A (zh) | 2019-08-30 |
CN110190018B CN110190018B (zh) | 2024-08-20 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201910587534.1A Active CN110190018B (zh) | 2019-07-01 | 2019-07-01 | 一种拼接式的硅片承载框 |
Country Status (1)
Country | Link |
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CN (1) | CN110190018B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111477576A (zh) * | 2020-06-02 | 2020-07-31 | 深圳市石金科技股份有限公司 | 一种改进型承载盘及承载装置 |
CN111477577A (zh) * | 2020-06-02 | 2020-07-31 | 深圳市石金科技股份有限公司 | 一种改进型硅片承载装置 |
CN112582498A (zh) * | 2019-09-30 | 2021-03-30 | 中国电子科技集团公司第四十八研究所 | 一种连续式生产晶体硅太阳能电池的方法 |
CN115257109A (zh) * | 2022-08-31 | 2022-11-01 | 绍兴市希比斯新材料有限公司 | 一种高强韧混合内衬聚乙烯板及其生产方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002217326A (ja) * | 2001-01-15 | 2002-08-02 | Shinon Denki Sangyo Kk | 半導体集積回路用基板の洗浄用治具 |
CN102859678A (zh) * | 2009-01-31 | 2013-01-02 | 霍赫劳股份有限公司 | 用于保持基板的基板载体 |
CN203644741U (zh) * | 2013-11-20 | 2014-06-11 | 晶澳太阳能有限公司 | 一种分体式多用硅片承载器 |
CN204391066U (zh) * | 2014-11-26 | 2015-06-10 | 晶澳太阳能有限公司 | 一种单片硅片承载装置 |
CN104937707A (zh) * | 2012-11-07 | 2015-09-23 | 周星工程股份有限公司 | 基板托盘及包括该基板托盘的基板处理设备 |
CN204857760U (zh) * | 2015-07-09 | 2015-12-09 | 钧石(中国)能源有限公司 | 一种制作太阳能电池片时用于硅片沉积的载板及加热装置 |
CN206134711U (zh) * | 2016-11-04 | 2017-04-26 | 尚德太阳能电力有限公司 | 单晶硅片制绒托架 |
CN209963033U (zh) * | 2019-07-01 | 2020-01-17 | 深圳市石金科技股份有限公司 | 一种拼接式的硅片承载框 |
-
2019
- 2019-07-01 CN CN201910587534.1A patent/CN110190018B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002217326A (ja) * | 2001-01-15 | 2002-08-02 | Shinon Denki Sangyo Kk | 半導体集積回路用基板の洗浄用治具 |
CN102859678A (zh) * | 2009-01-31 | 2013-01-02 | 霍赫劳股份有限公司 | 用于保持基板的基板载体 |
CN104937707A (zh) * | 2012-11-07 | 2015-09-23 | 周星工程股份有限公司 | 基板托盘及包括该基板托盘的基板处理设备 |
CN203644741U (zh) * | 2013-11-20 | 2014-06-11 | 晶澳太阳能有限公司 | 一种分体式多用硅片承载器 |
CN204391066U (zh) * | 2014-11-26 | 2015-06-10 | 晶澳太阳能有限公司 | 一种单片硅片承载装置 |
CN204857760U (zh) * | 2015-07-09 | 2015-12-09 | 钧石(中国)能源有限公司 | 一种制作太阳能电池片时用于硅片沉积的载板及加热装置 |
CN206134711U (zh) * | 2016-11-04 | 2017-04-26 | 尚德太阳能电力有限公司 | 单晶硅片制绒托架 |
CN209963033U (zh) * | 2019-07-01 | 2020-01-17 | 深圳市石金科技股份有限公司 | 一种拼接式的硅片承载框 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112582498A (zh) * | 2019-09-30 | 2021-03-30 | 中国电子科技集团公司第四十八研究所 | 一种连续式生产晶体硅太阳能电池的方法 |
CN111477576A (zh) * | 2020-06-02 | 2020-07-31 | 深圳市石金科技股份有限公司 | 一种改进型承载盘及承载装置 |
CN111477577A (zh) * | 2020-06-02 | 2020-07-31 | 深圳市石金科技股份有限公司 | 一种改进型硅片承载装置 |
CN115257109A (zh) * | 2022-08-31 | 2022-11-01 | 绍兴市希比斯新材料有限公司 | 一种高强韧混合内衬聚乙烯板及其生产方法 |
CN115257109B (zh) * | 2022-08-31 | 2024-04-16 | 绍兴市希比斯新材料有限公司 | 一种高强韧混合内衬聚乙烯板及其生产方法 |
Also Published As
Publication number | Publication date |
---|---|
CN110190018B (zh) | 2024-08-20 |
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Effective date of registration: 20200902 Address after: Room 6C, block 2, building 1, Dayi Plaza, Xixiang, Bao'an District, Shenzhen City, Guangdong Province Applicant after: Li Bixiang Address before: Baoan District Songgang street, Shenzhen city 518105 Guangdong province with rich industrial zone safety run road No. 2 Applicant before: SHENZHEN GOLD STONE TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20211220 Address after: A5, Dongjiu (Nantong) zhizaoyuan, 1199 Bihua Road, Tongzhou District, Nantong City, Jiangsu Province, 226300 Applicant after: Nantong Jiufang New Material Technology Co.,Ltd. Address before: 518102 6C, block 2, building 1, Dayi Plaza, Xixiang, Bao'an District, Shenzhen, Guangdong Province Applicant before: Li Bixiang |
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Country or region after: China Address after: A5, Dongjiu (Nantong) Smart Garden, No. 1199, Bihua Road, Nantong High tech Zone, Jiangsu 226300 Applicant after: Nantong Jiufang New Materials Co.,Ltd. Address before: A5, Dongjiu (Nantong) zhizaoyuan, 1199 Bihua Road, Tongzhou District, Nantong City, Jiangsu Province, 226300 Applicant before: Nantong Jiufang New Material Technology Co.,Ltd. Country or region before: China |
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