DE2008511A1 - Halbleiterbauelement - Google Patents

Halbleiterbauelement

Info

Publication number
DE2008511A1
DE2008511A1 DE19702008511 DE2008511A DE2008511A1 DE 2008511 A1 DE2008511 A1 DE 2008511A1 DE 19702008511 DE19702008511 DE 19702008511 DE 2008511 A DE2008511 A DE 2008511A DE 2008511 A1 DE2008511 A1 DE 2008511A1
Authority
DE
Germany
Prior art keywords
cooling plate
ring
semiconductor element
semiconductor component
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19702008511
Other languages
German (de)
English (en)
Inventor
Peter Wllhelmus Maria van de Nijmegen Water (Niederlande)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of DE2008511A1 publication Critical patent/DE2008511A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE19702008511 1969-03-01 1970-02-24 Halbleiterbauelement Pending DE2008511A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6903229A NL6903229A (enExample) 1969-03-01 1969-03-01

Publications (1)

Publication Number Publication Date
DE2008511A1 true DE2008511A1 (de) 1970-09-10

Family

ID=19806295

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19702008511 Pending DE2008511A1 (de) 1969-03-01 1970-02-24 Halbleiterbauelement

Country Status (9)

Country Link
US (1) US3629672A (enExample)
JP (1) JPS4919947B1 (enExample)
BE (1) BE746705A (enExample)
CH (1) CH504099A (enExample)
DE (1) DE2008511A1 (enExample)
FR (1) FR2033128A5 (enExample)
GB (1) GB1295687A (enExample)
NL (1) NL6903229A (enExample)
SE (1) SE349423B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2107786A1 (de) * 1971-02-18 1972-09-07 Philips Nv Halbleiterbauelement
DE19843479A1 (de) * 1998-09-22 2000-03-30 Siemens Ag Halbleiterbauelement

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4125740A (en) * 1973-09-26 1978-11-14 Sgs-Ates Componenti Elettronici S.P.A. Resin-encased microelectronic module
IT993429B (it) * 1973-09-26 1975-09-30 Sgs Ates Componenti Perfezionamento di una cassa per dispositivo a semiconduttori
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
US4270138A (en) * 1979-03-02 1981-05-26 General Electric Company Enhanced thermal transfer package for a semiconductor device
JPS57188858A (en) * 1981-05-18 1982-11-19 Matsushita Electronics Corp Plastic molded type semiconductor device
GB2157494B (en) * 1981-06-18 1986-10-08 Stanley Bracey A hermetic package for tab bonded silicon die
JPS59130449A (ja) * 1983-01-17 1984-07-27 Nec Corp 絶縁型半導体素子用リードフレーム
JPS59135753A (ja) * 1983-01-25 1984-08-04 Toshiba Corp 半導体装置とその製造方法
IT1212780B (it) * 1983-10-21 1989-11-30 Ates Componenti Elettron Contenitore in metallo e resina per dispositivo a semiconduttore adatto al fissaggio su un dissipatore non perfettamente piano e processo per la sua fabbricazione.
JP2708191B2 (ja) * 1988-09-20 1998-02-04 株式会社日立製作所 半導体装置
US5266834A (en) * 1989-03-13 1993-11-30 Hitachi Ltd. Semiconductor device and an electronic device with the semiconductor devices mounted thereon
USRE37707E1 (en) 1990-02-22 2002-05-21 Stmicroelectronics S.R.L. Leadframe with heat dissipator connected to S-shaped fingers
IT1239644B (it) * 1990-02-22 1993-11-11 Sgs Thomson Microelectronics Struttura di supporto degli adduttori perfezionata per contenitori di dispositivi integrati di potenza
US6236107B1 (en) * 1994-04-29 2001-05-22 Texas Instruments Incorporated Encapsulate resin LOC package and method of fabrication
WO2007074352A1 (en) * 2005-12-29 2007-07-05 Infineon Technologies Ag Electronic component and a method of fabricating an electronic component
USD571738S1 (en) * 2007-06-14 2008-06-24 Philips Lumileds Lighting Company, Llc LED package
US9252090B2 (en) * 2012-03-28 2016-02-02 Panasonic Intellectual Property Management Co., Ltd. Resin package
JP2015185835A (ja) * 2014-03-26 2015-10-22 株式会社デンソー 半導体装置及びその製造方法
JP6582678B2 (ja) * 2015-07-27 2019-10-02 三菱電機株式会社 半導体装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3348101A (en) * 1964-05-27 1967-10-17 Itt Cordwood module with heat sink fence
US3423516A (en) * 1966-07-13 1969-01-21 Motorola Inc Plastic encapsulated semiconductor assemblies
FR1519854A (fr) * 1967-02-23 1968-04-05 Radiotechnique Coprim Rtc Embase composite, notamment pour dispositif semi-conducteur

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2107786A1 (de) * 1971-02-18 1972-09-07 Philips Nv Halbleiterbauelement
DE19843479A1 (de) * 1998-09-22 2000-03-30 Siemens Ag Halbleiterbauelement

Also Published As

Publication number Publication date
US3629672A (en) 1971-12-21
FR2033128A5 (enExample) 1970-11-27
JPS4919947B1 (enExample) 1974-05-21
GB1295687A (enExample) 1972-11-08
CH504099A (de) 1971-02-28
SE349423B (enExample) 1972-09-25
BE746705A (fr) 1970-08-27
NL6903229A (enExample) 1970-09-03

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