JPS4919947B1 - - Google Patents
Info
- Publication number
- JPS4919947B1 JPS4919947B1 JP45015965A JP1596570A JPS4919947B1 JP S4919947 B1 JPS4919947 B1 JP S4919947B1 JP 45015965 A JP45015965 A JP 45015965A JP 1596570 A JP1596570 A JP 1596570A JP S4919947 B1 JPS4919947 B1 JP S4919947B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W74/114—
-
- H10W40/778—
-
- H10W72/5449—
-
- H10W74/10—
-
- H10W90/756—
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL6903229A NL6903229A (enExample) | 1969-03-01 | 1969-03-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4919947B1 true JPS4919947B1 (enExample) | 1974-05-21 |
Family
ID=19806295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP45015965A Pending JPS4919947B1 (enExample) | 1969-03-01 | 1970-02-26 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US3629672A (enExample) |
| JP (1) | JPS4919947B1 (enExample) |
| BE (1) | BE746705A (enExample) |
| CH (1) | CH504099A (enExample) |
| DE (1) | DE2008511A1 (enExample) |
| FR (1) | FR2033128A5 (enExample) |
| GB (1) | GB1295687A (enExample) |
| NL (1) | NL6903229A (enExample) |
| SE (1) | SE349423B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015185835A (ja) * | 2014-03-26 | 2015-10-22 | 株式会社デンソー | 半導体装置及びその製造方法 |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2107786C3 (de) * | 1971-02-18 | 1983-01-27 | N.V. Philips' Gloeilampenfabrieken, 5621 Eindhoven | Halbleiterbauelement |
| IT993429B (it) * | 1973-09-26 | 1975-09-30 | Sgs Ates Componenti | Perfezionamento di una cassa per dispositivo a semiconduttori |
| US4125740A (en) * | 1973-09-26 | 1978-11-14 | Sgs-Ates Componenti Elettronici S.P.A. | Resin-encased microelectronic module |
| US3930114A (en) * | 1975-03-17 | 1975-12-30 | Nat Semiconductor Corp | Integrated circuit package utilizing novel heat sink structure |
| US4270138A (en) * | 1979-03-02 | 1981-05-26 | General Electric Company | Enhanced thermal transfer package for a semiconductor device |
| JPS57188858A (en) * | 1981-05-18 | 1982-11-19 | Matsushita Electronics Corp | Plastic molded type semiconductor device |
| GB2157494B (en) * | 1981-06-18 | 1986-10-08 | Stanley Bracey | A hermetic package for tab bonded silicon die |
| JPS59130449A (ja) * | 1983-01-17 | 1984-07-27 | Nec Corp | 絶縁型半導体素子用リードフレーム |
| JPS59135753A (ja) * | 1983-01-25 | 1984-08-04 | Toshiba Corp | 半導体装置とその製造方法 |
| IT1212780B (it) * | 1983-10-21 | 1989-11-30 | Ates Componenti Elettron | Contenitore in metallo e resina per dispositivo a semiconduttore adatto al fissaggio su un dissipatore non perfettamente piano e processo per la sua fabbricazione. |
| JP2708191B2 (ja) * | 1988-09-20 | 1998-02-04 | 株式会社日立製作所 | 半導体装置 |
| US5266834A (en) * | 1989-03-13 | 1993-11-30 | Hitachi Ltd. | Semiconductor device and an electronic device with the semiconductor devices mounted thereon |
| IT1239644B (it) * | 1990-02-22 | 1993-11-11 | Sgs Thomson Microelectronics | Struttura di supporto degli adduttori perfezionata per contenitori di dispositivi integrati di potenza |
| USRE37707E1 (en) | 1990-02-22 | 2002-05-21 | Stmicroelectronics S.R.L. | Leadframe with heat dissipator connected to S-shaped fingers |
| US6236107B1 (en) * | 1994-04-29 | 2001-05-22 | Texas Instruments Incorporated | Encapsulate resin LOC package and method of fabrication |
| DE19843479A1 (de) * | 1998-09-22 | 2000-03-30 | Siemens Ag | Halbleiterbauelement |
| DE112005003802B4 (de) * | 2005-12-29 | 2013-12-12 | Infineon Technologies Ag | Verfahren zum Herstellen eines elektronischen Bauteils |
| USD571738S1 (en) * | 2007-06-14 | 2008-06-24 | Philips Lumileds Lighting Company, Llc | LED package |
| WO2013145532A1 (ja) * | 2012-03-28 | 2013-10-03 | パナソニック株式会社 | 樹脂パッケージ |
| JP6582678B2 (ja) * | 2015-07-27 | 2019-10-02 | 三菱電機株式会社 | 半導体装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3348101A (en) * | 1964-05-27 | 1967-10-17 | Itt | Cordwood module with heat sink fence |
| US3423516A (en) * | 1966-07-13 | 1969-01-21 | Motorola Inc | Plastic encapsulated semiconductor assemblies |
| FR1519854A (fr) * | 1967-02-23 | 1968-04-05 | Radiotechnique Coprim Rtc | Embase composite, notamment pour dispositif semi-conducteur |
-
1969
- 1969-03-01 NL NL6903229A patent/NL6903229A/xx unknown
-
1970
- 1970-02-24 DE DE19702008511 patent/DE2008511A1/de active Pending
- 1970-02-25 US US14041A patent/US3629672A/en not_active Expired - Lifetime
- 1970-02-26 GB GB1295687D patent/GB1295687A/en not_active Expired
- 1970-02-26 JP JP45015965A patent/JPS4919947B1/ja active Pending
- 1970-02-26 CH CH281970A patent/CH504099A/de not_active IP Right Cessation
- 1970-02-27 BE BE746705D patent/BE746705A/xx unknown
- 1970-02-27 FR FR7007120A patent/FR2033128A5/fr not_active Expired
- 1970-02-27 SE SE02609/70A patent/SE349423B/xx unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015185835A (ja) * | 2014-03-26 | 2015-10-22 | 株式会社デンソー | 半導体装置及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CH504099A (de) | 1971-02-28 |
| SE349423B (enExample) | 1972-09-25 |
| BE746705A (fr) | 1970-08-27 |
| GB1295687A (enExample) | 1972-11-08 |
| NL6903229A (enExample) | 1970-09-03 |
| FR2033128A5 (enExample) | 1970-11-27 |
| US3629672A (en) | 1971-12-21 |
| DE2008511A1 (de) | 1970-09-10 |