FR2033128A5 - - Google Patents

Info

Publication number
FR2033128A5
FR2033128A5 FR7007120A FR7007120A FR2033128A5 FR 2033128 A5 FR2033128 A5 FR 2033128A5 FR 7007120 A FR7007120 A FR 7007120A FR 7007120 A FR7007120 A FR 7007120A FR 2033128 A5 FR2033128 A5 FR 2033128A5
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7007120A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of FR2033128A5 publication Critical patent/FR2033128A5/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
FR7007120A 1969-03-01 1970-02-27 Expired FR2033128A5 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6903229A NL6903229A (fr) 1969-03-01 1969-03-01

Publications (1)

Publication Number Publication Date
FR2033128A5 true FR2033128A5 (fr) 1970-11-27

Family

ID=19806295

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7007120A Expired FR2033128A5 (fr) 1969-03-01 1970-02-27

Country Status (9)

Country Link
US (1) US3629672A (fr)
JP (1) JPS4919947B1 (fr)
BE (1) BE746705A (fr)
CH (1) CH504099A (fr)
DE (1) DE2008511A1 (fr)
FR (1) FR2033128A5 (fr)
GB (1) GB1295687A (fr)
NL (1) NL6903229A (fr)
SE (1) SE349423B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2559956A1 (fr) * 1983-10-21 1985-08-23 Ates Componenti Elettron Boitier en metal et resine pour dispositif a semi-conducteur, susceptible d'etre fixe sur un dissipateur non parfaitement plan, et son procede de fabrication

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2107786C3 (de) * 1971-02-18 1983-01-27 N.V. Philips' Gloeilampenfabrieken, 5621 Eindhoven Halbleiterbauelement
IT993429B (it) * 1973-09-26 1975-09-30 Sgs Ates Componenti Perfezionamento di una cassa per dispositivo a semiconduttori
US4125740A (en) * 1973-09-26 1978-11-14 Sgs-Ates Componenti Elettronici S.P.A. Resin-encased microelectronic module
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
US4270138A (en) * 1979-03-02 1981-05-26 General Electric Company Enhanced thermal transfer package for a semiconductor device
JPS57188858A (en) * 1981-05-18 1982-11-19 Matsushita Electronics Corp Plastic molded type semiconductor device
GB2157494B (en) * 1981-06-18 1986-10-08 Stanley Bracey A hermetic package for tab bonded silicon die
JPS59130449A (ja) * 1983-01-17 1984-07-27 Nec Corp 絶縁型半導体素子用リードフレーム
JPS59135753A (ja) * 1983-01-25 1984-08-04 Toshiba Corp 半導体装置とその製造方法
JP2708191B2 (ja) * 1988-09-20 1998-02-04 株式会社日立製作所 半導体装置
US5266834A (en) * 1989-03-13 1993-11-30 Hitachi Ltd. Semiconductor device and an electronic device with the semiconductor devices mounted thereon
USRE37707E1 (en) 1990-02-22 2002-05-21 Stmicroelectronics S.R.L. Leadframe with heat dissipator connected to S-shaped fingers
IT1239644B (it) * 1990-02-22 1993-11-11 Sgs Thomson Microelectronics Struttura di supporto degli adduttori perfezionata per contenitori di dispositivi integrati di potenza
US6236107B1 (en) * 1994-04-29 2001-05-22 Texas Instruments Incorporated Encapsulate resin LOC package and method of fabrication
DE19843479A1 (de) * 1998-09-22 2000-03-30 Siemens Ag Halbleiterbauelement
WO2007074352A1 (fr) * 2005-12-29 2007-07-05 Infineon Technologies Ag Composant électronique et procédé de fabrication d’un composant électronique
US9252090B2 (en) * 2012-03-28 2016-02-02 Panasonic Intellectual Property Management Co., Ltd. Resin package
JP2015185835A (ja) * 2014-03-26 2015-10-22 株式会社デンソー 半導体装置及びその製造方法
JP6582678B2 (ja) * 2015-07-27 2019-10-02 三菱電機株式会社 半導体装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3348101A (en) * 1964-05-27 1967-10-17 Itt Cordwood module with heat sink fence
US3423516A (en) * 1966-07-13 1969-01-21 Motorola Inc Plastic encapsulated semiconductor assemblies
FR1519854A (fr) * 1967-02-23 1968-04-05 Radiotechnique Coprim Rtc Embase composite, notamment pour dispositif semi-conducteur

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2559956A1 (fr) * 1983-10-21 1985-08-23 Ates Componenti Elettron Boitier en metal et resine pour dispositif a semi-conducteur, susceptible d'etre fixe sur un dissipateur non parfaitement plan, et son procede de fabrication

Also Published As

Publication number Publication date
CH504099A (de) 1971-02-28
NL6903229A (fr) 1970-09-03
US3629672A (en) 1971-12-21
DE2008511A1 (de) 1970-09-10
BE746705A (fr) 1970-08-27
SE349423B (fr) 1972-09-25
JPS4919947B1 (fr) 1974-05-21
GB1295687A (fr) 1972-11-08

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Legal Events

Date Code Title Description
ST Notification of lapse