GB1295687A - - Google Patents

Info

Publication number
GB1295687A
GB1295687A GB1295687DA GB1295687A GB 1295687 A GB1295687 A GB 1295687A GB 1295687D A GB1295687D A GB 1295687DA GB 1295687 A GB1295687 A GB 1295687A
Authority
GB
United Kingdom
Prior art keywords
plate
chamber
face
opening
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1295687A publication Critical patent/GB1295687A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
GB1295687D 1969-03-01 1970-02-26 Expired GB1295687A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6903229A NL6903229A (enExample) 1969-03-01 1969-03-01

Publications (1)

Publication Number Publication Date
GB1295687A true GB1295687A (enExample) 1972-11-08

Family

ID=19806295

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1295687D Expired GB1295687A (enExample) 1969-03-01 1970-02-26

Country Status (9)

Country Link
US (1) US3629672A (enExample)
JP (1) JPS4919947B1 (enExample)
BE (1) BE746705A (enExample)
CH (1) CH504099A (enExample)
DE (1) DE2008511A1 (enExample)
FR (1) FR2033128A5 (enExample)
GB (1) GB1295687A (enExample)
NL (1) NL6903229A (enExample)
SE (1) SE349423B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2157494A (en) * 1981-06-18 1985-10-23 Stanley Bracey A hermetic package for TAB bonded silicon die

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2107786C3 (de) * 1971-02-18 1983-01-27 N.V. Philips' Gloeilampenfabrieken, 5621 Eindhoven Halbleiterbauelement
US4125740A (en) * 1973-09-26 1978-11-14 Sgs-Ates Componenti Elettronici S.P.A. Resin-encased microelectronic module
IT993429B (it) * 1973-09-26 1975-09-30 Sgs Ates Componenti Perfezionamento di una cassa per dispositivo a semiconduttori
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
US4270138A (en) * 1979-03-02 1981-05-26 General Electric Company Enhanced thermal transfer package for a semiconductor device
JPS57188858A (en) * 1981-05-18 1982-11-19 Matsushita Electronics Corp Plastic molded type semiconductor device
JPS59130449A (ja) * 1983-01-17 1984-07-27 Nec Corp 絶縁型半導体素子用リードフレーム
JPS59135753A (ja) * 1983-01-25 1984-08-04 Toshiba Corp 半導体装置とその製造方法
IT1212780B (it) * 1983-10-21 1989-11-30 Ates Componenti Elettron Contenitore in metallo e resina per dispositivo a semiconduttore adatto al fissaggio su un dissipatore non perfettamente piano e processo per la sua fabbricazione.
JP2708191B2 (ja) * 1988-09-20 1998-02-04 株式会社日立製作所 半導体装置
US5266834A (en) * 1989-03-13 1993-11-30 Hitachi Ltd. Semiconductor device and an electronic device with the semiconductor devices mounted thereon
USRE37707E1 (en) 1990-02-22 2002-05-21 Stmicroelectronics S.R.L. Leadframe with heat dissipator connected to S-shaped fingers
IT1239644B (it) * 1990-02-22 1993-11-11 Sgs Thomson Microelectronics Struttura di supporto degli adduttori perfezionata per contenitori di dispositivi integrati di potenza
US6236107B1 (en) * 1994-04-29 2001-05-22 Texas Instruments Incorporated Encapsulate resin LOC package and method of fabrication
DE19843479A1 (de) * 1998-09-22 2000-03-30 Siemens Ag Halbleiterbauelement
WO2007074352A1 (en) * 2005-12-29 2007-07-05 Infineon Technologies Ag Electronic component and a method of fabricating an electronic component
USD571738S1 (en) * 2007-06-14 2008-06-24 Philips Lumileds Lighting Company, Llc LED package
US9252090B2 (en) * 2012-03-28 2016-02-02 Panasonic Intellectual Property Management Co., Ltd. Resin package
JP2015185835A (ja) * 2014-03-26 2015-10-22 株式会社デンソー 半導体装置及びその製造方法
JP6582678B2 (ja) * 2015-07-27 2019-10-02 三菱電機株式会社 半導体装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3348101A (en) * 1964-05-27 1967-10-17 Itt Cordwood module with heat sink fence
US3423516A (en) * 1966-07-13 1969-01-21 Motorola Inc Plastic encapsulated semiconductor assemblies
FR1519854A (fr) * 1967-02-23 1968-04-05 Radiotechnique Coprim Rtc Embase composite, notamment pour dispositif semi-conducteur

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2157494A (en) * 1981-06-18 1985-10-23 Stanley Bracey A hermetic package for TAB bonded silicon die

Also Published As

Publication number Publication date
US3629672A (en) 1971-12-21
FR2033128A5 (enExample) 1970-11-27
JPS4919947B1 (enExample) 1974-05-21
DE2008511A1 (de) 1970-09-10
CH504099A (de) 1971-02-28
SE349423B (enExample) 1972-09-25
BE746705A (fr) 1970-08-27
NL6903229A (enExample) 1970-09-03

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees