GB1070092A - Semi-conductor device and manufacture thereof - Google Patents
Semi-conductor device and manufacture thereofInfo
- Publication number
- GB1070092A GB1070092A GB163065A GB163065A GB1070092A GB 1070092 A GB1070092 A GB 1070092A GB 163065 A GB163065 A GB 163065A GB 163065 A GB163065 A GB 163065A GB 1070092 A GB1070092 A GB 1070092A
- Authority
- GB
- United Kingdom
- Prior art keywords
- semi
- ring
- base
- conductor
- evacuated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- 239000000919 ceramic Substances 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 238000007789 sealing Methods 0.000 abstract 2
- 229910000831 Steel Inorganic materials 0.000 abstract 1
- 230000006835 compression Effects 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 239000002274 desiccant Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000010959 steel Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Abstract
1,070,092. Semi-conductor devices. WESTINGHOUSE BRAKE & SIGNAL CO. Ltd. Dec. 21, 1965 [Jan. 14, 1965], No. 1630/65. Heading H1K. A semi-conductor device such as a siliconcontrolled rectifier comprises a semi-conductor element 2 mounted on a copper base 1 and a heavy current conducting member 7 urged into contact with the element 2 by a stack of springs 6 maintained in compression by a barrel member 5 screwed into a ring 4 secured to the base 1. The ring and barrel may be made of steel. The device is encapsulated in a housing comprising a ceramic cylinder 20 and metal sealing portions 21, 22, and is evacuated through bores 16, 17 in the base and ring which are subsequently sealed by a copper pin 18. Alternatively the device may be evacuated, at least in part, through the ceramic sealing sleeve 15 of the lead 3 which is connected under spring pressure to the gate electrode. A desiccant ring is provided.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB163065A GB1070092A (en) | 1965-01-14 | 1965-01-14 | Semi-conductor device and manufacture thereof |
FR43898A FR1461963A (en) | 1965-01-14 | 1965-12-28 | Asymmetric conductivity device and its manufacturing process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB163065A GB1070092A (en) | 1965-01-14 | 1965-01-14 | Semi-conductor device and manufacture thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1070092A true GB1070092A (en) | 1967-05-24 |
Family
ID=9725272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB163065A Expired GB1070092A (en) | 1965-01-14 | 1965-01-14 | Semi-conductor device and manufacture thereof |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR1461963A (en) |
GB (1) | GB1070092A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4063348A (en) * | 1975-02-27 | 1977-12-20 | The Bendix Corporation | Unique packaging method for use on large semiconductor devices |
US4068368A (en) * | 1975-10-14 | 1978-01-17 | The Bendix Corporation | Closure for semiconductor device and method of construction |
EP0199873A2 (en) * | 1985-04-29 | 1986-11-05 | The Nippert Company | Heat sink mounting and method of making the same |
-
1965
- 1965-01-14 GB GB163065A patent/GB1070092A/en not_active Expired
- 1965-12-28 FR FR43898A patent/FR1461963A/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4063348A (en) * | 1975-02-27 | 1977-12-20 | The Bendix Corporation | Unique packaging method for use on large semiconductor devices |
US4068368A (en) * | 1975-10-14 | 1978-01-17 | The Bendix Corporation | Closure for semiconductor device and method of construction |
EP0199873A2 (en) * | 1985-04-29 | 1986-11-05 | The Nippert Company | Heat sink mounting and method of making the same |
EP0199873A3 (en) * | 1985-04-29 | 1987-06-03 | The Nippert Company | Heat sink mounting and method of making the same |
Also Published As
Publication number | Publication date |
---|---|
FR1461963A (en) | 1966-12-09 |
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