DE19726852A1 - Magnetischer Speicher mit wahlfreiem Zugriff mit gestapelten Speicherzellen und Herstellungsverfahren desselben - Google Patents

Magnetischer Speicher mit wahlfreiem Zugriff mit gestapelten Speicherzellen und Herstellungsverfahren desselben

Info

Publication number
DE19726852A1
DE19726852A1 DE19726852A DE19726852A DE19726852A1 DE 19726852 A1 DE19726852 A1 DE 19726852A1 DE 19726852 A DE19726852 A DE 19726852A DE 19726852 A DE19726852 A DE 19726852A DE 19726852 A1 DE19726852 A1 DE 19726852A1
Authority
DE
Germany
Prior art keywords
magnetic
magnetic material
line
word
measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19726852A
Other languages
German (de)
English (en)
Inventor
Saied N Tehrani
Xiaodong T Zhu
Eugene Chen
Herbert Goronkin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Everspin Technologies Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of DE19726852A1 publication Critical patent/DE19726852A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/14Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B61/00Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Memories (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Hall/Mr Elements (AREA)
DE19726852A 1996-08-23 1997-06-24 Magnetischer Speicher mit wahlfreiem Zugriff mit gestapelten Speicherzellen und Herstellungsverfahren desselben Withdrawn DE19726852A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/702,781 US5920500A (en) 1996-08-23 1996-08-23 Magnetic random access memory having stacked memory cells and fabrication method therefor

Publications (1)

Publication Number Publication Date
DE19726852A1 true DE19726852A1 (de) 1998-02-26

Family

ID=24822572

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19726852A Withdrawn DE19726852A1 (de) 1996-08-23 1997-06-24 Magnetischer Speicher mit wahlfreiem Zugriff mit gestapelten Speicherzellen und Herstellungsverfahren desselben

Country Status (3)

Country Link
US (1) US5920500A (enExample)
JP (1) JPH10116490A (enExample)
DE (1) DE19726852A1 (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999018578A1 (de) * 1997-10-06 1999-04-15 Infineon Technologies Ag Speicherzellenanordnung
WO2000019440A3 (de) * 1998-09-30 2000-05-25 Siemens Ag Magnetoresistiver speicher mit niedriger stromdichte
WO2000019441A3 (de) * 1998-09-30 2000-05-25 Siemens Ag Magnetoresistiver speicher mit erhöhter störsicherheit
WO2000052701A1 (de) * 1999-02-26 2000-09-08 Infineon Technologies Ag Speicherzellenanordnung und verfahren zu deren herstellung
EP1253652A2 (en) 2001-03-29 2002-10-30 Kabushiki Kaisha Toshiba Semiconductor memory device including memory cell portion and peripheral circuit portion
US7072207B2 (en) 2001-12-21 2006-07-04 Renesas Technology Corp. Thin film magnetic memory device for writing data of a plurality of bits in parallel
US7158405B2 (en) 2001-07-06 2007-01-02 Infineon Technologies Ag Semiconductor memory device having a plurality of memory areas with memory elements
EP1172855A3 (de) * 2000-07-13 2008-09-24 Infineon Technologies AG Integrierter Halbleiterspeicher mit Speicherzellen in mehreren Speicherzellenfeldern und Verfahren zur Reparatur eines solchen Speichers

Families Citing this family (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW416057B (en) * 1997-09-17 2000-12-21 Siemens Ag Memory-cell device and its production method
US6072718A (en) * 1998-02-10 2000-06-06 International Business Machines Corporation Magnetic memory devices having multiple magnetic tunnel junctions therein
US6269027B1 (en) * 1998-04-14 2001-07-31 Honeywell, Inc. Non-volatile storage latch
EP0959475A3 (en) * 1998-05-18 2000-11-08 Canon Kabushiki Kaisha Magnetic thin film memory and recording and reproducing method and apparatus using such a memory
JP2000293982A (ja) * 1999-04-08 2000-10-20 Victor Co Of Japan Ltd 磁性メモリ
US6191973B1 (en) 1999-09-27 2001-02-20 Motorola Inc. Mram cam
JP2002217382A (ja) * 2001-01-18 2002-08-02 Sharp Corp 磁気メモリおよび磁気メモリの製造方法
US6269016B1 (en) 2000-06-19 2001-07-31 Motorola Inc. MRAM cam
DE10054520C1 (de) * 2000-11-03 2002-03-21 Infineon Technologies Ag Datenspeicher mit mehreren Bänken
US7242922B2 (en) * 2000-12-29 2007-07-10 Vesta Corporation Toll free calling account recharge system and method
US6358756B1 (en) 2001-02-07 2002-03-19 Micron Technology, Inc. Self-aligned, magnetoresistive random-access memory (MRAM) structure utilizing a spacer containment scheme
US6515341B2 (en) * 2001-02-26 2003-02-04 Motorola, Inc. Magnetoelectronics element having a stressed over-layer configured for alteration of the switching energy barrier
JP4488645B2 (ja) * 2001-04-20 2010-06-23 株式会社東芝 磁気記憶装置
US6545906B1 (en) 2001-10-16 2003-04-08 Motorola, Inc. Method of writing to scalable magnetoresistance random access memory element
US6821907B2 (en) 2002-03-06 2004-11-23 Applied Materials Inc Etching methods for a magnetic memory cell stack
US6893893B2 (en) 2002-03-19 2005-05-17 Applied Materials Inc Method of preventing short circuits in magnetic film stacks
US20030181056A1 (en) * 2002-03-22 2003-09-25 Applied Materials, Inc. Method of etching a magnetic material film stack using a hard mask
US6754124B2 (en) 2002-06-11 2004-06-22 Micron Technology, Inc. Hybrid MRAM array structure and operation
JP4042478B2 (ja) 2002-06-19 2008-02-06 ソニー株式会社 磁気抵抗効果素子及び磁気メモリ装置
US6891193B1 (en) * 2002-06-28 2005-05-10 Silicon Magnetic Systems MRAM field-inducing layer configuration
US7095646B2 (en) 2002-07-17 2006-08-22 Freescale Semiconductor, Inc. Multi-state magnetoresistance random access cell with improved memory storage density
US6906939B2 (en) * 2002-08-02 2005-06-14 Unity Semiconductor Corporation Re-writable memory with multiple memory layers
US7009909B2 (en) * 2002-08-02 2006-03-07 Unity Semiconductor Corporation Line drivers that use minimal metal layers
US6850429B2 (en) * 2002-08-02 2005-02-01 Unity Semiconductor Corporation Cross point memory array with memory plugs exhibiting a characteristic hysteresis
US6753561B1 (en) 2002-08-02 2004-06-22 Unity Semiconductor Corporation Cross point memory array using multiple thin films
US6831854B2 (en) * 2002-08-02 2004-12-14 Unity Semiconductor Corporation Cross point memory array using distinct voltages
US7057914B2 (en) * 2002-08-02 2006-06-06 Unity Semiconductor Corporation Cross point memory array with fast access time
US6836421B2 (en) * 2002-08-02 2004-12-28 Unity Semiconductor Corporation Line drivers that fit within a specified line pitch
US6970375B2 (en) * 2002-08-02 2005-11-29 Unity Semiconductor Corporation Providing a reference voltage to a cross point memory array
US6850455B2 (en) * 2002-08-02 2005-02-01 Unity Semiconductor Corporation Multiplexor having a reference voltage on unselected lines
US6798685B2 (en) * 2002-08-02 2004-09-28 Unity Semiconductor Corporation Multi-output multiplexor
US7079442B2 (en) * 2002-08-02 2006-07-18 Unity Semiconductor Corporation Layout of driver sets in a cross point memory array
US6917539B2 (en) * 2002-08-02 2005-07-12 Unity Semiconductor Corporation High-density NVRAM
US6834008B2 (en) * 2002-08-02 2004-12-21 Unity Semiconductor Corporation Cross point memory array using multiple modes of operation
US6984585B2 (en) * 2002-08-12 2006-01-10 Applied Materials Inc Method for removal of residue from a magneto-resistive random access memory (MRAM) film stack using a sacrificial mask layer
US20040026369A1 (en) * 2002-08-12 2004-02-12 Chentsau Ying Method of etching magnetic materials
US6759263B2 (en) 2002-08-29 2004-07-06 Chentsau Ying Method of patterning a layer of magnetic material
US6964928B2 (en) * 2002-08-29 2005-11-15 Chentsau Ying Method for removing residue from a magneto-resistive random access memory (MRAM) film stack using a dual mask
US6714441B1 (en) * 2002-09-17 2004-03-30 Micron Technology, Inc. Bridge-type magnetic random access memory (MRAM) latch
US6660568B1 (en) * 2002-11-07 2003-12-09 International Business Machines Corporation BiLevel metallization for embedded back end of the line structures
US6992919B2 (en) * 2002-12-20 2006-01-31 Integrated Magnetoelectronics Corporation All-metal three-dimensional circuits and memories
US7005852B2 (en) 2003-04-04 2006-02-28 Integrated Magnetoelectronics Corporation Displays with all-metal electronics
KR100542743B1 (ko) * 2003-04-22 2006-01-11 삼성전자주식회사 자기 랜덤 엑세스 메모리
US7027319B2 (en) * 2003-06-19 2006-04-11 Hewlett-Packard Development Company, L.P. Retrieving data stored in a magnetic integrated memory
US6956763B2 (en) 2003-06-27 2005-10-18 Freescale Semiconductor, Inc. MRAM element and methods for writing the MRAM element
US7183130B2 (en) * 2003-07-29 2007-02-27 International Business Machines Corporation Magnetic random access memory and method of fabricating thereof
US6967366B2 (en) 2003-08-25 2005-11-22 Freescale Semiconductor, Inc. Magnetoresistive random access memory with reduced switching field variation
JP2005129801A (ja) * 2003-10-24 2005-05-19 Sony Corp 磁気記憶素子及び磁気メモリ
WO2005047410A1 (en) * 2003-11-14 2005-05-26 Showa Denko K.K. Polishing composition and polishing method
TWI288046B (en) * 2003-11-14 2007-10-11 Showa Denko Kk Polishing composition and polishing method
US7339818B2 (en) * 2004-06-04 2008-03-04 Micron Technology, Inc. Spintronic devices with integrated transistors
US7075818B2 (en) * 2004-08-23 2006-07-11 Maglabs, Inc. Magnetic random access memory with stacked memory layers having access lines for writing and reading
US20060102197A1 (en) * 2004-11-16 2006-05-18 Kang-Lie Chiang Post-etch treatment to remove residues
US7129098B2 (en) 2004-11-24 2006-10-31 Freescale Semiconductor, Inc. Reduced power magnetoresistive random access memory elements
WO2006068328A1 (en) * 2004-12-22 2006-06-29 Showa Denko K.K. Polishing composition and polishing method
WO2006112519A1 (ja) * 2005-04-14 2006-10-26 Showa Denko K.K. 研磨組成物
KR101068483B1 (ko) * 2006-05-16 2011-09-28 쇼와 덴코 가부시키가이샤 연마조성물의 제조방법
TWI437083B (zh) 2006-07-28 2014-05-11 Showa Denko Kk 研磨組成物
JP2008117930A (ja) * 2006-11-02 2008-05-22 Sony Corp 記憶素子、メモリ
JP4380707B2 (ja) * 2007-01-19 2009-12-09 ソニー株式会社 記憶素子
US7911830B2 (en) * 2007-05-17 2011-03-22 Integrated Magnetoelectronics Scalable nonvolatile memory
JP2010135512A (ja) 2008-12-03 2010-06-17 Sony Corp 抵抗変化型メモリデバイス
JP2010134986A (ja) 2008-12-03 2010-06-17 Sony Corp 抵抗変化型メモリデバイス
JP2011008849A (ja) 2009-06-24 2011-01-13 Sony Corp メモリ及び書き込み制御方法
US10497713B2 (en) * 2010-11-18 2019-12-03 Monolithic 3D Inc. 3D semiconductor memory device and structure
KR101210125B1 (ko) 2010-12-14 2012-12-07 한양대학교 산학협력단 절연막 연마 슬러리 조성물 및 이를 사용한 반도체 소자 제조방법
US9741923B2 (en) 2015-09-25 2017-08-22 Integrated Magnetoelectronics Corporation SpinRAM

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4455626A (en) * 1983-03-21 1984-06-19 Honeywell Inc. Thin film memory with magnetoresistive read-out
US5398200A (en) * 1992-03-02 1995-03-14 Motorola, Inc. Vertically formed semiconductor random access memory device
US5347485A (en) * 1992-03-03 1994-09-13 Mitsubishi Denki Kabushiki Kaisha Magnetic thin film memory
US5617071A (en) * 1992-11-16 1997-04-01 Nonvolatile Electronics, Incorporated Magnetoresistive structure comprising ferromagnetic thin films and intermediate alloy layer having magnetic concentrator and shielding permeable masses
US5587943A (en) * 1995-02-13 1996-12-24 Integrated Microtransducer Electronics Corporation Nonvolatile magnetoresistive memory with fully closed flux operation

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6351408B1 (en) 1997-10-06 2002-02-26 Infineon Technologies Ag Memory cell configuration
WO1999018578A1 (de) * 1997-10-06 1999-04-15 Infineon Technologies Ag Speicherzellenanordnung
WO2000019440A3 (de) * 1998-09-30 2000-05-25 Siemens Ag Magnetoresistiver speicher mit niedriger stromdichte
WO2000019441A3 (de) * 1998-09-30 2000-05-25 Siemens Ag Magnetoresistiver speicher mit erhöhter störsicherheit
US6630703B2 (en) 1999-02-26 2003-10-07 Infineon Technologies Ag Magnetoresistive memory cell configuration and method for its production
WO2000052701A1 (de) * 1999-02-26 2000-09-08 Infineon Technologies Ag Speicherzellenanordnung und verfahren zu deren herstellung
KR100450468B1 (ko) * 1999-02-26 2004-09-30 인피니언 테크놀로지스 아게 기억 셀 장치 및 그의 제조 방법
EP1172855A3 (de) * 2000-07-13 2008-09-24 Infineon Technologies AG Integrierter Halbleiterspeicher mit Speicherzellen in mehreren Speicherzellenfeldern und Verfahren zur Reparatur eines solchen Speichers
EP1253652A2 (en) 2001-03-29 2002-10-30 Kabushiki Kaisha Toshiba Semiconductor memory device including memory cell portion and peripheral circuit portion
EP1253652A3 (en) * 2001-03-29 2007-06-20 Kabushiki Kaisha Toshiba Semiconductor memory device including memory cell portion and peripheral circuit portion
US7158405B2 (en) 2001-07-06 2007-01-02 Infineon Technologies Ag Semiconductor memory device having a plurality of memory areas with memory elements
US7072207B2 (en) 2001-12-21 2006-07-04 Renesas Technology Corp. Thin film magnetic memory device for writing data of a plurality of bits in parallel
US7272064B2 (en) 2001-12-21 2007-09-18 Renesas Technology Corp. Thin film magnetic memory device for writing data of a plurality of bits in parallel

Also Published As

Publication number Publication date
US5920500A (en) 1999-07-06
JPH10116490A (ja) 1998-05-06

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8127 New person/name/address of the applicant

Owner name: FREESCALE SEMICONDUCTOR, INC. (N.D.GES.D. STAATES

8127 New person/name/address of the applicant

Owner name: EVERSPIN TECHNOLOGIES,INC., CHANDLER, ARIZ., US

8139 Disposal/non-payment of the annual fee