DE19726852A1 - Magnetischer Speicher mit wahlfreiem Zugriff mit gestapelten Speicherzellen und Herstellungsverfahren desselben - Google Patents
Magnetischer Speicher mit wahlfreiem Zugriff mit gestapelten Speicherzellen und Herstellungsverfahren desselbenInfo
- Publication number
- DE19726852A1 DE19726852A1 DE19726852A DE19726852A DE19726852A1 DE 19726852 A1 DE19726852 A1 DE 19726852A1 DE 19726852 A DE19726852 A DE 19726852A DE 19726852 A DE19726852 A DE 19726852A DE 19726852 A1 DE19726852 A1 DE 19726852A1
- Authority
- DE
- Germany
- Prior art keywords
- magnetic
- magnetic material
- line
- word
- measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000696 magnetic material Substances 0.000 claims abstract description 28
- 239000004020 conductor Substances 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims description 50
- 230000004907 flux Effects 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 15
- 238000005259 measurement Methods 0.000 claims description 14
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 241001077885 Gesta Species 0.000 claims 2
- 239000010949 copper Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 239000013598 vector Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 210000003608 fece Anatomy 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Hall/Mr Elements (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/702,781 US5920500A (en) | 1996-08-23 | 1996-08-23 | Magnetic random access memory having stacked memory cells and fabrication method therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE19726852A1 true DE19726852A1 (de) | 1998-02-26 |
Family
ID=24822572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19726852A Withdrawn DE19726852A1 (de) | 1996-08-23 | 1997-06-24 | Magnetischer Speicher mit wahlfreiem Zugriff mit gestapelten Speicherzellen und Herstellungsverfahren desselben |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US5920500A (enExample) |
| JP (1) | JPH10116490A (enExample) |
| DE (1) | DE19726852A1 (enExample) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999018578A1 (de) * | 1997-10-06 | 1999-04-15 | Infineon Technologies Ag | Speicherzellenanordnung |
| WO2000019440A3 (de) * | 1998-09-30 | 2000-05-25 | Siemens Ag | Magnetoresistiver speicher mit niedriger stromdichte |
| WO2000019441A3 (de) * | 1998-09-30 | 2000-05-25 | Siemens Ag | Magnetoresistiver speicher mit erhöhter störsicherheit |
| WO2000052701A1 (de) * | 1999-02-26 | 2000-09-08 | Infineon Technologies Ag | Speicherzellenanordnung und verfahren zu deren herstellung |
| EP1253652A2 (en) | 2001-03-29 | 2002-10-30 | Kabushiki Kaisha Toshiba | Semiconductor memory device including memory cell portion and peripheral circuit portion |
| US7072207B2 (en) | 2001-12-21 | 2006-07-04 | Renesas Technology Corp. | Thin film magnetic memory device for writing data of a plurality of bits in parallel |
| US7158405B2 (en) | 2001-07-06 | 2007-01-02 | Infineon Technologies Ag | Semiconductor memory device having a plurality of memory areas with memory elements |
| EP1172855A3 (de) * | 2000-07-13 | 2008-09-24 | Infineon Technologies AG | Integrierter Halbleiterspeicher mit Speicherzellen in mehreren Speicherzellenfeldern und Verfahren zur Reparatur eines solchen Speichers |
Families Citing this family (67)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW416057B (en) * | 1997-09-17 | 2000-12-21 | Siemens Ag | Memory-cell device and its production method |
| US6072718A (en) * | 1998-02-10 | 2000-06-06 | International Business Machines Corporation | Magnetic memory devices having multiple magnetic tunnel junctions therein |
| US6269027B1 (en) * | 1998-04-14 | 2001-07-31 | Honeywell, Inc. | Non-volatile storage latch |
| EP0959475A3 (en) * | 1998-05-18 | 2000-11-08 | Canon Kabushiki Kaisha | Magnetic thin film memory and recording and reproducing method and apparatus using such a memory |
| JP2000293982A (ja) * | 1999-04-08 | 2000-10-20 | Victor Co Of Japan Ltd | 磁性メモリ |
| US6191973B1 (en) | 1999-09-27 | 2001-02-20 | Motorola Inc. | Mram cam |
| JP2002217382A (ja) * | 2001-01-18 | 2002-08-02 | Sharp Corp | 磁気メモリおよび磁気メモリの製造方法 |
| US6269016B1 (en) | 2000-06-19 | 2001-07-31 | Motorola Inc. | MRAM cam |
| DE10054520C1 (de) * | 2000-11-03 | 2002-03-21 | Infineon Technologies Ag | Datenspeicher mit mehreren Bänken |
| US7242922B2 (en) * | 2000-12-29 | 2007-07-10 | Vesta Corporation | Toll free calling account recharge system and method |
| US6358756B1 (en) | 2001-02-07 | 2002-03-19 | Micron Technology, Inc. | Self-aligned, magnetoresistive random-access memory (MRAM) structure utilizing a spacer containment scheme |
| US6515341B2 (en) * | 2001-02-26 | 2003-02-04 | Motorola, Inc. | Magnetoelectronics element having a stressed over-layer configured for alteration of the switching energy barrier |
| JP4488645B2 (ja) * | 2001-04-20 | 2010-06-23 | 株式会社東芝 | 磁気記憶装置 |
| US6545906B1 (en) | 2001-10-16 | 2003-04-08 | Motorola, Inc. | Method of writing to scalable magnetoresistance random access memory element |
| US6821907B2 (en) | 2002-03-06 | 2004-11-23 | Applied Materials Inc | Etching methods for a magnetic memory cell stack |
| US6893893B2 (en) | 2002-03-19 | 2005-05-17 | Applied Materials Inc | Method of preventing short circuits in magnetic film stacks |
| US20030181056A1 (en) * | 2002-03-22 | 2003-09-25 | Applied Materials, Inc. | Method of etching a magnetic material film stack using a hard mask |
| US6754124B2 (en) | 2002-06-11 | 2004-06-22 | Micron Technology, Inc. | Hybrid MRAM array structure and operation |
| JP4042478B2 (ja) | 2002-06-19 | 2008-02-06 | ソニー株式会社 | 磁気抵抗効果素子及び磁気メモリ装置 |
| US6891193B1 (en) * | 2002-06-28 | 2005-05-10 | Silicon Magnetic Systems | MRAM field-inducing layer configuration |
| US7095646B2 (en) | 2002-07-17 | 2006-08-22 | Freescale Semiconductor, Inc. | Multi-state magnetoresistance random access cell with improved memory storage density |
| US6906939B2 (en) * | 2002-08-02 | 2005-06-14 | Unity Semiconductor Corporation | Re-writable memory with multiple memory layers |
| US7009909B2 (en) * | 2002-08-02 | 2006-03-07 | Unity Semiconductor Corporation | Line drivers that use minimal metal layers |
| US6850429B2 (en) * | 2002-08-02 | 2005-02-01 | Unity Semiconductor Corporation | Cross point memory array with memory plugs exhibiting a characteristic hysteresis |
| US6753561B1 (en) | 2002-08-02 | 2004-06-22 | Unity Semiconductor Corporation | Cross point memory array using multiple thin films |
| US6831854B2 (en) * | 2002-08-02 | 2004-12-14 | Unity Semiconductor Corporation | Cross point memory array using distinct voltages |
| US7057914B2 (en) * | 2002-08-02 | 2006-06-06 | Unity Semiconductor Corporation | Cross point memory array with fast access time |
| US6836421B2 (en) * | 2002-08-02 | 2004-12-28 | Unity Semiconductor Corporation | Line drivers that fit within a specified line pitch |
| US6970375B2 (en) * | 2002-08-02 | 2005-11-29 | Unity Semiconductor Corporation | Providing a reference voltage to a cross point memory array |
| US6850455B2 (en) * | 2002-08-02 | 2005-02-01 | Unity Semiconductor Corporation | Multiplexor having a reference voltage on unselected lines |
| US6798685B2 (en) * | 2002-08-02 | 2004-09-28 | Unity Semiconductor Corporation | Multi-output multiplexor |
| US7079442B2 (en) * | 2002-08-02 | 2006-07-18 | Unity Semiconductor Corporation | Layout of driver sets in a cross point memory array |
| US6917539B2 (en) * | 2002-08-02 | 2005-07-12 | Unity Semiconductor Corporation | High-density NVRAM |
| US6834008B2 (en) * | 2002-08-02 | 2004-12-21 | Unity Semiconductor Corporation | Cross point memory array using multiple modes of operation |
| US6984585B2 (en) * | 2002-08-12 | 2006-01-10 | Applied Materials Inc | Method for removal of residue from a magneto-resistive random access memory (MRAM) film stack using a sacrificial mask layer |
| US20040026369A1 (en) * | 2002-08-12 | 2004-02-12 | Chentsau Ying | Method of etching magnetic materials |
| US6759263B2 (en) | 2002-08-29 | 2004-07-06 | Chentsau Ying | Method of patterning a layer of magnetic material |
| US6964928B2 (en) * | 2002-08-29 | 2005-11-15 | Chentsau Ying | Method for removing residue from a magneto-resistive random access memory (MRAM) film stack using a dual mask |
| US6714441B1 (en) * | 2002-09-17 | 2004-03-30 | Micron Technology, Inc. | Bridge-type magnetic random access memory (MRAM) latch |
| US6660568B1 (en) * | 2002-11-07 | 2003-12-09 | International Business Machines Corporation | BiLevel metallization for embedded back end of the line structures |
| US6992919B2 (en) * | 2002-12-20 | 2006-01-31 | Integrated Magnetoelectronics Corporation | All-metal three-dimensional circuits and memories |
| US7005852B2 (en) | 2003-04-04 | 2006-02-28 | Integrated Magnetoelectronics Corporation | Displays with all-metal electronics |
| KR100542743B1 (ko) * | 2003-04-22 | 2006-01-11 | 삼성전자주식회사 | 자기 랜덤 엑세스 메모리 |
| US7027319B2 (en) * | 2003-06-19 | 2006-04-11 | Hewlett-Packard Development Company, L.P. | Retrieving data stored in a magnetic integrated memory |
| US6956763B2 (en) | 2003-06-27 | 2005-10-18 | Freescale Semiconductor, Inc. | MRAM element and methods for writing the MRAM element |
| US7183130B2 (en) * | 2003-07-29 | 2007-02-27 | International Business Machines Corporation | Magnetic random access memory and method of fabricating thereof |
| US6967366B2 (en) | 2003-08-25 | 2005-11-22 | Freescale Semiconductor, Inc. | Magnetoresistive random access memory with reduced switching field variation |
| JP2005129801A (ja) * | 2003-10-24 | 2005-05-19 | Sony Corp | 磁気記憶素子及び磁気メモリ |
| WO2005047410A1 (en) * | 2003-11-14 | 2005-05-26 | Showa Denko K.K. | Polishing composition and polishing method |
| TWI288046B (en) * | 2003-11-14 | 2007-10-11 | Showa Denko Kk | Polishing composition and polishing method |
| US7339818B2 (en) * | 2004-06-04 | 2008-03-04 | Micron Technology, Inc. | Spintronic devices with integrated transistors |
| US7075818B2 (en) * | 2004-08-23 | 2006-07-11 | Maglabs, Inc. | Magnetic random access memory with stacked memory layers having access lines for writing and reading |
| US20060102197A1 (en) * | 2004-11-16 | 2006-05-18 | Kang-Lie Chiang | Post-etch treatment to remove residues |
| US7129098B2 (en) | 2004-11-24 | 2006-10-31 | Freescale Semiconductor, Inc. | Reduced power magnetoresistive random access memory elements |
| WO2006068328A1 (en) * | 2004-12-22 | 2006-06-29 | Showa Denko K.K. | Polishing composition and polishing method |
| WO2006112519A1 (ja) * | 2005-04-14 | 2006-10-26 | Showa Denko K.K. | 研磨組成物 |
| KR101068483B1 (ko) * | 2006-05-16 | 2011-09-28 | 쇼와 덴코 가부시키가이샤 | 연마조성물의 제조방법 |
| TWI437083B (zh) | 2006-07-28 | 2014-05-11 | Showa Denko Kk | 研磨組成物 |
| JP2008117930A (ja) * | 2006-11-02 | 2008-05-22 | Sony Corp | 記憶素子、メモリ |
| JP4380707B2 (ja) * | 2007-01-19 | 2009-12-09 | ソニー株式会社 | 記憶素子 |
| US7911830B2 (en) * | 2007-05-17 | 2011-03-22 | Integrated Magnetoelectronics | Scalable nonvolatile memory |
| JP2010135512A (ja) | 2008-12-03 | 2010-06-17 | Sony Corp | 抵抗変化型メモリデバイス |
| JP2010134986A (ja) | 2008-12-03 | 2010-06-17 | Sony Corp | 抵抗変化型メモリデバイス |
| JP2011008849A (ja) | 2009-06-24 | 2011-01-13 | Sony Corp | メモリ及び書き込み制御方法 |
| US10497713B2 (en) * | 2010-11-18 | 2019-12-03 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
| KR101210125B1 (ko) | 2010-12-14 | 2012-12-07 | 한양대학교 산학협력단 | 절연막 연마 슬러리 조성물 및 이를 사용한 반도체 소자 제조방법 |
| US9741923B2 (en) | 2015-09-25 | 2017-08-22 | Integrated Magnetoelectronics Corporation | SpinRAM |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4455626A (en) * | 1983-03-21 | 1984-06-19 | Honeywell Inc. | Thin film memory with magnetoresistive read-out |
| US5398200A (en) * | 1992-03-02 | 1995-03-14 | Motorola, Inc. | Vertically formed semiconductor random access memory device |
| US5347485A (en) * | 1992-03-03 | 1994-09-13 | Mitsubishi Denki Kabushiki Kaisha | Magnetic thin film memory |
| US5617071A (en) * | 1992-11-16 | 1997-04-01 | Nonvolatile Electronics, Incorporated | Magnetoresistive structure comprising ferromagnetic thin films and intermediate alloy layer having magnetic concentrator and shielding permeable masses |
| US5587943A (en) * | 1995-02-13 | 1996-12-24 | Integrated Microtransducer Electronics Corporation | Nonvolatile magnetoresistive memory with fully closed flux operation |
-
1996
- 1996-08-23 US US08/702,781 patent/US5920500A/en not_active Expired - Lifetime
-
1997
- 1997-06-24 DE DE19726852A patent/DE19726852A1/de not_active Withdrawn
- 1997-08-13 JP JP9231784A patent/JPH10116490A/ja active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6351408B1 (en) | 1997-10-06 | 2002-02-26 | Infineon Technologies Ag | Memory cell configuration |
| WO1999018578A1 (de) * | 1997-10-06 | 1999-04-15 | Infineon Technologies Ag | Speicherzellenanordnung |
| WO2000019440A3 (de) * | 1998-09-30 | 2000-05-25 | Siemens Ag | Magnetoresistiver speicher mit niedriger stromdichte |
| WO2000019441A3 (de) * | 1998-09-30 | 2000-05-25 | Siemens Ag | Magnetoresistiver speicher mit erhöhter störsicherheit |
| US6630703B2 (en) | 1999-02-26 | 2003-10-07 | Infineon Technologies Ag | Magnetoresistive memory cell configuration and method for its production |
| WO2000052701A1 (de) * | 1999-02-26 | 2000-09-08 | Infineon Technologies Ag | Speicherzellenanordnung und verfahren zu deren herstellung |
| KR100450468B1 (ko) * | 1999-02-26 | 2004-09-30 | 인피니언 테크놀로지스 아게 | 기억 셀 장치 및 그의 제조 방법 |
| EP1172855A3 (de) * | 2000-07-13 | 2008-09-24 | Infineon Technologies AG | Integrierter Halbleiterspeicher mit Speicherzellen in mehreren Speicherzellenfeldern und Verfahren zur Reparatur eines solchen Speichers |
| EP1253652A2 (en) | 2001-03-29 | 2002-10-30 | Kabushiki Kaisha Toshiba | Semiconductor memory device including memory cell portion and peripheral circuit portion |
| EP1253652A3 (en) * | 2001-03-29 | 2007-06-20 | Kabushiki Kaisha Toshiba | Semiconductor memory device including memory cell portion and peripheral circuit portion |
| US7158405B2 (en) | 2001-07-06 | 2007-01-02 | Infineon Technologies Ag | Semiconductor memory device having a plurality of memory areas with memory elements |
| US7072207B2 (en) | 2001-12-21 | 2006-07-04 | Renesas Technology Corp. | Thin film magnetic memory device for writing data of a plurality of bits in parallel |
| US7272064B2 (en) | 2001-12-21 | 2007-09-18 | Renesas Technology Corp. | Thin film magnetic memory device for writing data of a plurality of bits in parallel |
Also Published As
| Publication number | Publication date |
|---|---|
| US5920500A (en) | 1999-07-06 |
| JPH10116490A (ja) | 1998-05-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE19726852A1 (de) | Magnetischer Speicher mit wahlfreiem Zugriff mit gestapelten Speicherzellen und Herstellungsverfahren desselben | |
| DE102005036073B4 (de) | Verfahren zum Herstellen einer Leiterbahn mit ferromagnetischem Liner einer magnetischen Speichereinrichtung | |
| DE60308568T2 (de) | Magnetisches Joch in MRAM zur Reduzierung des Programmierungsleistungsverbrauchs und Herstellungsverfahren | |
| DE60301344T2 (de) | Materialkombination für tunnelübergangsdeckschicht, hartmaske und stackkeimschicht in der mram-herstellung | |
| DE60128678T2 (de) | Magnetisches element mit isolierenden beuteln und zugehöriges herstellungsverfahren | |
| DE10324866B4 (de) | Verfahren zum Herstellen eines magnetischen Direktzugriffsspeichers | |
| DE60032281T2 (de) | Magnetischer dynamischer Direktzugriffspeicher und dessen Herstellungsverfahren | |
| DE60201036T2 (de) | Verfahren zum Herstellen von Verkleidungsschicht auf einem Top-leiter | |
| DE10291412B4 (de) | Selbsteinstellender, grabenfreier Magneto-Widerstands-Zufallszugriffsspeicher (MRAM) - Vorrichtung mit Seitenwandeinschließung für die MRAM-Struktur | |
| DE60222985T2 (de) | Magnetische Speicheranordnung und deren Herstellungsverfahren | |
| DE19726077A1 (de) | Speicherzellenstruktur in einem magnetischen Speicher mit wahlfreiem Zugriff und Verfahren zu deren Herstellung | |
| DE60303664T2 (de) | Layout für thermisch ausgewählte kreuzpunkt mram zelle | |
| DE102005034665B9 (de) | Verfahren zum Herstellen einer Leiterbahn einer resistiven Speichereinrichtung | |
| DE102005033916B4 (de) | Ausrichtung eines MTJ-Stapels an Leiterbahnen in Abwesenheit von Topographie | |
| DE102005034386B4 (de) | Tiefe Justiermarken auf Rand-Chips zum anschließenden Ausrichten von opaken Schichten | |
| DE60314129T2 (de) | Verfahren zur bildung von mram-bausteinen | |
| DE60108543T2 (de) | Verbesserte Referenzschichtstruktur in einer magnetischen Speicherzelle | |
| DE69626259T2 (de) | Magnetischer Speicher und zugehöriges Verfahren | |
| EP1141960B1 (de) | Schreib-/lesearchitektur für mram | |
| DE102005035166B4 (de) | Magnetisches Speicherelement mit magnetischer Durchführung und magnetischem Sensorelement sowie magnetischem Direktzugriffsspeicher | |
| DE102004034822A1 (de) | MRAM und Verfahren zu dessen Herstellung | |
| EP1157388B1 (de) | Speicherzellenanordnung und verfahren zu deren herstellung | |
| DE69629264T2 (de) | Ferromagnetisches GMR Material | |
| DE60304209T2 (de) | Magnettunnelsperrschichtspeicherzellenarchitektur | |
| DE10020128A1 (de) | MRAM-Speicher |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| 8127 | New person/name/address of the applicant |
Owner name: FREESCALE SEMICONDUCTOR, INC. (N.D.GES.D. STAATES |
|
| 8127 | New person/name/address of the applicant |
Owner name: EVERSPIN TECHNOLOGIES,INC., CHANDLER, ARIZ., US |
|
| 8139 | Disposal/non-payment of the annual fee |