DE1966198C3 - Wäßriges Bad zur chemischen Abscheidung duktiler KupferOberzüge - Google Patents

Wäßriges Bad zur chemischen Abscheidung duktiler KupferOberzüge

Info

Publication number
DE1966198C3
DE1966198C3 DE1966198A DE1966198A DE1966198C3 DE 1966198 C3 DE1966198 C3 DE 1966198C3 DE 1966198 A DE1966198 A DE 1966198A DE 1966198 A DE1966198 A DE 1966198A DE 1966198 C3 DE1966198 C3 DE 1966198C3
Authority
DE
Germany
Prior art keywords
copper
ppm
formaldehyde
solution
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE1966198A
Other languages
German (de)
English (en)
Other versions
DE1966198B2 (de
DE1966198A1 (de
Inventor
Oleh Borys Medfield Dutkewych
Michael Gulla
Charles Raymond Shipley Jun.
Lucia Helene Shipley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Publication of DE1966198A1 publication Critical patent/DE1966198A1/de
Publication of DE1966198B2 publication Critical patent/DE1966198B2/de
Application granted granted Critical
Publication of DE1966198C3 publication Critical patent/DE1966198C3/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE1966198A 1968-08-13 1969-08-09 Wäßriges Bad zur chemischen Abscheidung duktiler KupferOberzüge Expired DE1966198C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US75225068A 1968-08-13 1968-08-13

Publications (3)

Publication Number Publication Date
DE1966198A1 DE1966198A1 (de) 1971-11-11
DE1966198B2 DE1966198B2 (de) 1978-07-13
DE1966198C3 true DE1966198C3 (de) 1979-03-15

Family

ID=25025526

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1966198A Expired DE1966198C3 (de) 1968-08-13 1969-08-09 Wäßriges Bad zur chemischen Abscheidung duktiler KupferOberzüge

Country Status (3)

Country Link
US (1) US3615735A (enrdf_load_stackoverflow)
JP (1) JPS5129701B1 (enrdf_load_stackoverflow)
DE (1) DE1966198C3 (enrdf_load_stackoverflow)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3765936A (en) * 1968-08-13 1973-10-16 Shipley Co Electroless copper plate
US4167601A (en) * 1976-11-15 1979-09-11 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
US4265943A (en) * 1978-11-27 1981-05-05 Macdermid Incorporated Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions
US4228213A (en) * 1979-08-13 1980-10-14 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
DE3404270A1 (de) * 1984-02-04 1985-08-08 Schering AG, 1000 Berlin und 4709 Bergkamen Waessriges alkalisches bad zur chemischen abscheidung von kupfer, nickel, kobalt und deren legierungen
US5077099B1 (en) * 1990-03-14 1997-12-02 Macdermid Inc Electroless copper plating process and apparatus
JP3115095B2 (ja) * 1992-04-20 2000-12-04 ディップソール株式会社 無電解メッキ液及びそれを使用するメッキ方法
US5258200A (en) * 1992-08-04 1993-11-02 Amp-Akzo Corporation Electroless copper deposition
US5256441A (en) * 1992-08-04 1993-10-26 Amp-Akzo Corporation Ductile copper
JP3058063B2 (ja) * 1995-10-18 2000-07-04 株式会社村田製作所 無電解めっきのための活性化触媒液および無電解めっき方法
EP1020543A1 (en) * 1999-01-15 2000-07-19 Interuniversitair Micro-Elektronica Centrum Vzw Deposition of copper on an activated surface of a substrate
US20040226407A1 (en) * 2003-05-14 2004-11-18 David Ericson Method and apparatus for converting metal ion in solution to the metal state
US20050067297A1 (en) * 2003-09-26 2005-03-31 Innovative Technology Licensing, Llc Copper bath for electroplating fine circuitry on semiconductor chips
US9153449B2 (en) 2012-03-19 2015-10-06 Lam Research Corporation Electroless gap fill

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3093509A (en) * 1959-09-28 1963-06-11 Wein Samuel Process for making copper films
US3134690A (en) * 1960-02-09 1964-05-26 Eriksson Lars Erik Method for deposition of a copper layer on a non-conductive material
DE1287885B (enrdf_load_stackoverflow) * 1964-05-27
US3329512A (en) * 1966-04-04 1967-07-04 Shipley Co Chemical deposition of copper and solutions therefor
US3475186A (en) * 1968-01-05 1969-10-28 Shipley Co Electroless copper plating

Also Published As

Publication number Publication date
DE1966198B2 (de) 1978-07-13
US3615735A (en) 1971-10-26
JPS5129701B1 (enrdf_load_stackoverflow) 1976-08-27
DE1966198A1 (de) 1971-11-11

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
EHJ Ceased/non-payment of the annual fee