DE19545231A1 - Verfahren zur elektrolytischen Abscheidung von Metallschichten - Google Patents
Verfahren zur elektrolytischen Abscheidung von MetallschichtenInfo
- Publication number
- DE19545231A1 DE19545231A1 DE19545231A DE19545231A DE19545231A1 DE 19545231 A1 DE19545231 A1 DE 19545231A1 DE 19545231 A DE19545231 A DE 19545231A DE 19545231 A DE19545231 A DE 19545231A DE 19545231 A1 DE19545231 A1 DE 19545231A1
- Authority
- DE
- Germany
- Prior art keywords
- metal
- current
- anodes
- copper
- compounds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/623—Porosity of the layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing of the conductive pattern
- H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
- Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19545231A DE19545231A1 (de) | 1995-11-21 | 1995-11-21 | Verfahren zur elektrolytischen Abscheidung von Metallschichten |
| TW085113990A TW420728B (en) | 1995-11-21 | 1996-11-15 | Method for electrolytic deposition of metal coatings |
| PCT/EP1996/005140 WO1997019206A1 (de) | 1995-11-21 | 1996-11-21 | Verfahren zur elektrolytischen abscheidung von metallschichten |
| ES96939882T ES2144789T3 (es) | 1995-11-21 | 1996-11-21 | Procedimiento para la deposicion electrolitica de capas metalicas. |
| US09/066,313 US6099711A (en) | 1995-11-21 | 1996-11-21 | Process for the electrolytic deposition of metal layers |
| JP9519399A JP2000500529A (ja) | 1995-11-21 | 1996-11-21 | 金属層の電解析出のための方法 |
| AT96939882T ATE190677T1 (de) | 1995-11-21 | 1996-11-21 | Verfahren zur elektrolytischen abscheidung von metallschichten |
| DE59604701T DE59604701D1 (de) | 1995-11-21 | 1996-11-21 | Verfahren zur elektrolytischen abscheidung von metallschichten |
| EP96939882A EP0862665B1 (de) | 1995-11-21 | 1996-11-21 | Verfahren zur elektrolytischen abscheidung von metallschichten |
| CA002233329A CA2233329C (en) | 1995-11-21 | 1996-11-21 | Method for electrolytic deposition of metal coatings |
| JP2009230437A JP5417112B2 (ja) | 1995-11-21 | 2009-10-02 | 金属層の電解析出のための方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19545231A DE19545231A1 (de) | 1995-11-21 | 1995-11-21 | Verfahren zur elektrolytischen Abscheidung von Metallschichten |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE19545231A1 true DE19545231A1 (de) | 1997-05-22 |
Family
ID=7779164
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19545231A Withdrawn DE19545231A1 (de) | 1995-11-21 | 1995-11-21 | Verfahren zur elektrolytischen Abscheidung von Metallschichten |
| DE59604701T Expired - Lifetime DE59604701D1 (de) | 1995-11-21 | 1996-11-21 | Verfahren zur elektrolytischen abscheidung von metallschichten |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE59604701T Expired - Lifetime DE59604701D1 (de) | 1995-11-21 | 1996-11-21 | Verfahren zur elektrolytischen abscheidung von metallschichten |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6099711A (https=) |
| EP (1) | EP0862665B1 (https=) |
| JP (2) | JP2000500529A (https=) |
| AT (1) | ATE190677T1 (https=) |
| CA (1) | CA2233329C (https=) |
| DE (2) | DE19545231A1 (https=) |
| ES (1) | ES2144789T3 (https=) |
| TW (1) | TW420728B (https=) |
| WO (1) | WO1997019206A1 (https=) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19915146C1 (de) * | 1999-01-21 | 2000-07-06 | Atotech Deutschland Gmbh | Verfahren zum galvanischen Bilden von Leiterstrukturen aus hochreinem Kupfer bei der Herstellung von integrierten Schaltungen |
| WO2000044042A1 (de) * | 1999-01-21 | 2000-07-27 | Atotech Deutschland Gmbh | Verfahren zum galvanischen bilden von leiterstrukturen aus hochreinem kupfer bei der herstellung von integrierten schaltungen |
| DE19925373A1 (de) * | 1999-06-02 | 2000-12-07 | Bosch Gmbh Robert | Verfahren und Vorrichtung zum Galvanisieren |
| NL1015348C2 (nl) * | 2000-05-31 | 2001-12-03 | D R P P B V Dutch Reverse Puls | Methode ter verbetering van electrolytische metaal neerslagverdeling op een substraat met behulp van Periodic Reversal Current waarbij gebruik wordt gemaakt van Oplosbare-, Inerte- en Hybride Anoden. |
| DE10259362A1 (de) * | 2002-12-18 | 2004-07-08 | Siemens Ag | Verfahren zum Abscheiden einer Legierung auf ein Substrat |
| WO2007112971A3 (de) * | 2006-03-30 | 2007-11-29 | Atotech Deutschland Gmbh | Elektrolytisches verfahren zum füllen von löchern und vertiefungen mit metallen |
| WO2010094998A1 (en) * | 2009-02-17 | 2010-08-26 | Atotech Deutschland Gmbh | Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv) |
| DE112005000842B4 (de) | 2004-04-15 | 2022-09-15 | Hitachi Metals, Ltd. | Verfahren zum Verleihen von Widerstand gegenüber Wasserstoff an einen Artikel |
| CN120239188A (zh) * | 2025-05-29 | 2025-07-01 | 珠海市航达科技有限公司 | 一种pcb板铜电镀方法 |
Families Citing this family (77)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19736350C1 (de) * | 1997-08-21 | 1999-08-05 | Atotech Deutschland Gmbh | Verfahren zur Konzentrationsregulierung von Stoffen in Elektrolyten und Vorrichtung zur Durchführung des Verfahrens |
| US6793796B2 (en) | 1998-10-26 | 2004-09-21 | Novellus Systems, Inc. | Electroplating process for avoiding defects in metal features of integrated circuit devices |
| US6946065B1 (en) | 1998-10-26 | 2005-09-20 | Novellus Systems, Inc. | Process for electroplating metal into microscopic recessed features |
| US20040045832A1 (en) * | 1999-10-14 | 2004-03-11 | Nicholas Martyak | Electrolytic copper plating solutions |
| US6294060B1 (en) | 1999-10-21 | 2001-09-25 | Ati Properties, Inc. | Conveyorized electroplating device |
| JP2001267726A (ja) * | 2000-03-22 | 2001-09-28 | Toyota Autom Loom Works Ltd | 配線基板の電解メッキ方法及び配線基板の電解メッキ装置 |
| US6491806B1 (en) | 2000-04-27 | 2002-12-10 | Intel Corporation | Electroplating bath composition |
| DE10061186C1 (de) * | 2000-12-07 | 2002-01-17 | Astrium Gmbh | Verfahren und Anordnung zur galvanischen Abscheidung von Nickel, Kobalt, Nickellegierungen oder Kobaltlegierungen mit periodischen Strompulsen und Verwendung des Verfahrens |
| US20040060728A1 (en) * | 2001-01-04 | 2004-04-01 | Philippe Steiert | Method for producing electroconductive structures |
| JP2002235189A (ja) * | 2001-02-05 | 2002-08-23 | Sansha Electric Mfg Co Ltd | めっき電流供給電源装置 |
| US6620303B2 (en) * | 2001-05-21 | 2003-09-16 | Hong Kong Polytechnic University | Process for making nickel electroforms |
| US6881318B2 (en) * | 2001-07-26 | 2005-04-19 | Applied Materials, Inc. | Dynamic pulse plating for high aspect ratio features |
| KR20040045390A (ko) * | 2001-10-16 | 2004-06-01 | 신꼬오덴기 고교 가부시키가이샤 | 소경홀의 구리 도금 방법 |
| JP2003183879A (ja) * | 2001-12-18 | 2003-07-03 | Learonal Japan Inc | 電解めっき方法 |
| US6919011B2 (en) * | 2001-12-27 | 2005-07-19 | The Hong Kong Polytechnic University | Complex waveform electroplating |
| US6558525B1 (en) | 2002-03-01 | 2003-05-06 | Northwest Aluminum Technologies | Anode for use in aluminum producing electrolytic cell |
| US7077945B2 (en) * | 2002-03-01 | 2006-07-18 | Northwest Aluminum Technologies | Cu—Ni—Fe anode for use in aluminum producing electrolytic cell |
| JP3964263B2 (ja) * | 2002-05-17 | 2007-08-22 | 株式会社デンソー | ブラインドビアホール充填方法及び貫通電極形成方法 |
| US7247222B2 (en) * | 2002-07-24 | 2007-07-24 | Applied Materials, Inc. | Electrochemical processing cell |
| US7128823B2 (en) * | 2002-07-24 | 2006-10-31 | Applied Materials, Inc. | Anolyte for copper plating |
| US20040134775A1 (en) * | 2002-07-24 | 2004-07-15 | Applied Materials, Inc. | Electrochemical processing cell |
| US7223323B2 (en) | 2002-07-24 | 2007-05-29 | Applied Materials, Inc. | Multi-chemistry plating system |
| KR100389061B1 (ko) * | 2002-11-14 | 2003-06-25 | 일진소재산업주식회사 | 전해 동박 제조용 전해액 및 이를 이용한 전해 동박 제조방법 |
| EP1475463B2 (en) † | 2002-12-20 | 2017-03-01 | Shipley Company, L.L.C. | Reverse pulse plating method |
| US20040118691A1 (en) * | 2002-12-23 | 2004-06-24 | Shipley Company, L.L.C. | Electroplating method |
| DE10261493A1 (de) * | 2002-12-23 | 2004-07-08 | METAKEM Gesellschaft für Schichtchemie der Metalle mbH | Anode zur Galvanisierung |
| KR20040073974A (ko) * | 2003-02-14 | 2004-08-21 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. | 전기도금 조성물 |
| US20050157475A1 (en) * | 2004-01-15 | 2005-07-21 | Endicott Interconnect Technologies, Inc. | Method of making printed circuit board with electroplated conductive through holes and board resulting therefrom |
| EP1598449B1 (en) * | 2004-04-26 | 2010-08-04 | Rohm and Haas Electronic Materials, L.L.C. | Improved plating method |
| US20050284766A1 (en) * | 2004-06-25 | 2005-12-29 | Herdman Roderick D | Pulse reverse electrolysis of acidic copper electroplating solutions |
| US7329334B2 (en) * | 2004-09-16 | 2008-02-12 | Herdman Roderick D | Controlling the hardness of electrodeposited copper coatings by variation of current profile |
| DE102004045451B4 (de) | 2004-09-20 | 2007-05-03 | Atotech Deutschland Gmbh | Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer |
| FR2881146B1 (fr) * | 2005-01-27 | 2007-10-19 | Snecma Moteurs Sa | Procede de reparation d'une surface de frottement d'une aube a calage variable de turbomachine |
| JP4799887B2 (ja) * | 2005-03-24 | 2011-10-26 | 石原薬品株式会社 | 電気銅メッキ浴、並びに銅メッキ方法 |
| JP2006283169A (ja) * | 2005-04-04 | 2006-10-19 | Okuno Chem Ind Co Ltd | 酸性電気銅めっき液、及び含硫黄有機化合物の電解消耗量の少ない電気銅めっき方法 |
| EP1712660A1 (de) * | 2005-04-12 | 2006-10-18 | Enthone Inc. | Unlösliche Anode |
| EP1717351A1 (de) * | 2005-04-27 | 2006-11-02 | Enthone Inc. | Galvanikbad |
| DE502005003655D1 (de) * | 2005-05-25 | 2008-05-21 | Enthone | Verfahren und Vorrichtung zur Einstellung der Ionenkonzentration in Elektrolyten |
| US7425255B2 (en) * | 2005-06-07 | 2008-09-16 | Massachusetts Institute Of Technology | Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition |
| TWI314957B (en) * | 2005-12-29 | 2009-09-21 | Ind Tech Res Inst | Apparatus for metal plating on a substrate |
| US20070278107A1 (en) * | 2006-05-30 | 2007-12-06 | Northwest Aluminum Technologies | Anode for use in aluminum producing electrolytic cell |
| JP2009167506A (ja) * | 2008-01-21 | 2009-07-30 | Ebara Udylite Kk | 酸性電解銅めっき液およびこれを用いる微細配線回路の作製方法 |
| DE102008031003B4 (de) | 2008-06-30 | 2010-04-15 | Siemens Aktiengesellschaft | Verfahren zum Erzeugen einer CNT enthaltenen Schicht aus einer ionischen Flüssigkeit |
| US10011917B2 (en) | 2008-11-07 | 2018-07-03 | Lam Research Corporation | Control of current density in an electroplating apparatus |
| US11225727B2 (en) | 2008-11-07 | 2022-01-18 | Lam Research Corporation | Control of current density in an electroplating apparatus |
| US9385035B2 (en) | 2010-05-24 | 2016-07-05 | Novellus Systems, Inc. | Current ramping and current pulsing entry of substrates for electroplating |
| EP2392694A1 (en) | 2010-06-02 | 2011-12-07 | ATOTECH Deutschland GmbH | Method for etching of copper and copper alloys |
| US20120024713A1 (en) | 2010-07-29 | 2012-02-02 | Preisser Robert F | Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv) with heated substrate and cooled electrolyte |
| EP2518187A1 (en) * | 2011-04-26 | 2012-10-31 | Atotech Deutschland GmbH | Aqueous acidic bath for electrolytic deposition of copper |
| US9028666B2 (en) | 2011-05-17 | 2015-05-12 | Novellus Systems, Inc. | Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath |
| CN103179806B (zh) * | 2011-12-21 | 2019-05-28 | 奥特斯有限公司 | 组合的通孔镀覆和孔填充的方法 |
| EP2735627A1 (en) | 2012-11-26 | 2014-05-28 | ATOTECH Deutschland GmbH | Copper plating bath composition |
| JP6035678B2 (ja) * | 2013-02-19 | 2016-11-30 | 住友金属鉱山株式会社 | フレキシブル配線板の製造方法ならびにフレキシブル配線板 |
| JP6411741B2 (ja) * | 2013-05-20 | 2018-10-24 | 国立大学法人 熊本大学 | 電解処理方法及び電解処理装置 |
| EP2865787A1 (en) * | 2013-10-22 | 2015-04-29 | ATOTECH Deutschland GmbH | Copper electroplating method |
| KR102426521B1 (ko) | 2015-04-20 | 2022-07-27 | 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 | 전해 구리 도금 배쓰 조성물 및 그 사용 방법 |
| EP3344800B1 (en) | 2015-08-31 | 2019-03-13 | ATOTECH Deutschland GmbH | Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate |
| EP3135709B1 (en) | 2015-08-31 | 2018-01-10 | ATOTECH Deutschland GmbH | Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions |
| ES2681836T3 (es) | 2015-09-10 | 2018-09-17 | Atotech Deutschland Gmbh | Composición de baño para chapado de cobre |
| US11035051B2 (en) | 2016-08-15 | 2021-06-15 | Atotech Deutschland Gmbh | Acidic aqueous composition for electrolytic copper plating |
| EP3360988B1 (en) | 2017-02-09 | 2019-06-26 | ATOTECH Deutschland GmbH | Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths |
| EP3470552B1 (en) | 2017-10-13 | 2020-12-30 | ATOTECH Deutschland GmbH | An acidic aqueous composition for electrolytically depositing a copper deposit |
| ES2800292T3 (es) | 2017-11-09 | 2020-12-29 | Atotech Deutschland Gmbh | Composiciones de electrodeposición para deposición electrolítica de cobre, su uso y un método para depositar electrolíticamente una capa de cobre o aleación de cobre sobre al menos una superficie de un sustrato |
| ES2881029T3 (es) | 2018-01-09 | 2021-11-26 | Atotech Deutschland Gmbh | Aditivo de ureileno, su uso y un método para su preparación |
| EP3511444B1 (en) | 2018-01-16 | 2020-07-22 | ATOTECH Deutschland GmbH | Metal or metal alloy deposition composition and plating compound |
| US11414772B2 (en) | 2018-06-15 | 2022-08-16 | Alberto Todescan | Electrolytic treatment process for coating stainless steel objects |
| US11716819B2 (en) * | 2018-06-21 | 2023-08-01 | Averatek Corporation | Asymmetrical electrolytic plating for a conductive pattern |
| JP7087759B2 (ja) * | 2018-07-18 | 2022-06-21 | 住友金属鉱山株式会社 | 銅張積層板 |
| CN112210801A (zh) * | 2019-07-09 | 2021-01-12 | 江西博泉化学有限公司 | 一种用于高纵横比电路板通孔电镀的电镀液及其电镀方法 |
| JP2022545091A (ja) * | 2019-08-19 | 2022-10-25 | アトテック ドイチェランド ゲーエムベーハー ウント コ カーゲー | 銅で充填されたマイクロビアを含む高密度相互接続プリント回路基板の製造方法 |
| EP4018790A1 (en) | 2019-08-19 | 2022-06-29 | Atotech Deutschland GmbH & Co. KG | Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board |
| EP3901331A1 (en) | 2020-04-23 | 2021-10-27 | ATOTECH Deutschland GmbH | Acidic aqueous composition for electrolytically depositing a copper deposit |
| EP3933073B1 (en) | 2020-06-29 | 2023-11-29 | Atotech Deutschland GmbH & Co. KG | Copper electroplating bath |
| US11542626B2 (en) * | 2020-10-08 | 2023-01-03 | Honeywell International Inc. | Systems and methods for enclosed electroplating chambers |
| EP4032930B1 (en) | 2021-01-22 | 2023-08-30 | Atotech Deutschland GmbH & Co. KG | Biuret-based quaternized polymers and their use in metal or metal alloy plating baths |
| CN113106527B (zh) * | 2021-04-19 | 2024-09-10 | 深圳铱创科技有限公司 | 不溶性阳极及脉冲电镀设备 |
| EP4400634A1 (en) * | 2023-01-13 | 2024-07-17 | Atotech Deutschland GmbH & Co. KG | Process for producing copper foil by electrolytic deposition of copper |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2739427C2 (de) * | 1976-09-01 | 1983-12-08 | Inoue-Japax Research Inc., Yokohama, Kanagawa | Verfahren zum Impulsgalvanisieren von Metall auf einem Werkstück |
| DD261613A1 (de) * | 1987-06-05 | 1988-11-02 | Leipzig Galvanotechnik | Verfahren zur elektrolytischen kupferabscheidung aus sauren elektrolyten mit dimensionsstabiler anode |
| WO1989007162A1 (en) * | 1988-01-27 | 1989-08-10 | Jct Controls Limited | Electrochemical processes |
| EP0129338B1 (en) * | 1983-05-19 | 1989-09-20 | Fuji Photo Film Co., Ltd. | Electrolytic treatment method |
| EP0356516A1 (de) * | 1988-02-23 | 1990-03-07 | Minsky Radiotekhnichesky Institut | Einrichtung zum auftragen von galvanischen überzügen |
| DE3307748C2 (https=) * | 1982-03-05 | 1990-08-23 | Olin Corp., East Alton, Ill., Us | |
| DD215589B5 (de) * | 1983-05-11 | 1994-06-01 | Heinz Dr Rer Nat Liebscher | Verfahren zur elektrolytischen Metallabscheidung bei erzwungener Konvektion |
| DE4344387A1 (de) * | 1993-12-24 | 1995-06-29 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung von metallischen Schichten mit vorbestimmten physikalischen Eigenschaften und Anordnung zur Durchführung des Verfahrens |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1396436A (en) * | 1973-01-08 | 1975-06-04 | Akad Wissenschaften Ddr | Process for the electrolytic production of hard-magnetic layers |
| NL8105150A (nl) * | 1981-11-13 | 1983-06-01 | Veco Beheer Bv | Werkwijze voor het vervaardigen van zeefmateriaal, verkregen zeefmateriaal, alsmede inrichting voor het uitvoeren van de werkwijze. |
| JPS58161793A (ja) * | 1982-03-19 | 1983-09-26 | Hitachi Ltd | 連続電気めつき方法 |
| US4808569A (en) * | 1986-10-24 | 1989-02-28 | Gaf Corporation | Fragrance additive |
| JPS63297590A (ja) * | 1987-05-29 | 1988-12-05 | Nagano Pref Gov | 高速電流反転電解によるめつき方法 |
| GB8913561D0 (en) * | 1989-06-13 | 1989-08-02 | Learonal Uk Plc | Method of stabilising an organic additive in an electroplating solution |
| JPH04320088A (ja) * | 1991-04-18 | 1992-11-10 | Cmk Corp | プリント配線板の製造方法 |
-
1995
- 1995-11-21 DE DE19545231A patent/DE19545231A1/de not_active Withdrawn
-
1996
- 1996-11-15 TW TW085113990A patent/TW420728B/zh not_active IP Right Cessation
- 1996-11-21 WO PCT/EP1996/005140 patent/WO1997019206A1/de not_active Ceased
- 1996-11-21 JP JP9519399A patent/JP2000500529A/ja not_active Withdrawn
- 1996-11-21 US US09/066,313 patent/US6099711A/en not_active Expired - Lifetime
- 1996-11-21 EP EP96939882A patent/EP0862665B1/de not_active Expired - Lifetime
- 1996-11-21 DE DE59604701T patent/DE59604701D1/de not_active Expired - Lifetime
- 1996-11-21 AT AT96939882T patent/ATE190677T1/de active
- 1996-11-21 CA CA002233329A patent/CA2233329C/en not_active Expired - Fee Related
- 1996-11-21 ES ES96939882T patent/ES2144789T3/es not_active Expired - Lifetime
-
2009
- 2009-10-02 JP JP2009230437A patent/JP5417112B2/ja not_active Expired - Lifetime
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2739427C2 (de) * | 1976-09-01 | 1983-12-08 | Inoue-Japax Research Inc., Yokohama, Kanagawa | Verfahren zum Impulsgalvanisieren von Metall auf einem Werkstück |
| DE3307748C2 (https=) * | 1982-03-05 | 1990-08-23 | Olin Corp., East Alton, Ill., Us | |
| DD215589B5 (de) * | 1983-05-11 | 1994-06-01 | Heinz Dr Rer Nat Liebscher | Verfahren zur elektrolytischen Metallabscheidung bei erzwungener Konvektion |
| EP0129338B1 (en) * | 1983-05-19 | 1989-09-20 | Fuji Photo Film Co., Ltd. | Electrolytic treatment method |
| DD261613A1 (de) * | 1987-06-05 | 1988-11-02 | Leipzig Galvanotechnik | Verfahren zur elektrolytischen kupferabscheidung aus sauren elektrolyten mit dimensionsstabiler anode |
| WO1989007162A1 (en) * | 1988-01-27 | 1989-08-10 | Jct Controls Limited | Electrochemical processes |
| EP0356516A1 (de) * | 1988-02-23 | 1990-03-07 | Minsky Radiotekhnichesky Institut | Einrichtung zum auftragen von galvanischen überzügen |
| DE4344387A1 (de) * | 1993-12-24 | 1995-06-29 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung von metallischen Schichten mit vorbestimmten physikalischen Eigenschaften und Anordnung zur Durchführung des Verfahrens |
Non-Patent Citations (2)
| Title |
|---|
| Metal Finishing, April 1991, S.21-27 * |
| Pulse-Plating, Eugen Lenze Verlag, 1986, S.26 * |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6793795B1 (en) | 1999-01-21 | 2004-09-21 | Atotech Deutschland Gmbh | Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits |
| WO2000044042A1 (de) * | 1999-01-21 | 2000-07-27 | Atotech Deutschland Gmbh | Verfahren zum galvanischen bilden von leiterstrukturen aus hochreinem kupfer bei der herstellung von integrierten schaltungen |
| DE19915146C1 (de) * | 1999-01-21 | 2000-07-06 | Atotech Deutschland Gmbh | Verfahren zum galvanischen Bilden von Leiterstrukturen aus hochreinem Kupfer bei der Herstellung von integrierten Schaltungen |
| DE19925373A1 (de) * | 1999-06-02 | 2000-12-07 | Bosch Gmbh Robert | Verfahren und Vorrichtung zum Galvanisieren |
| DE19925373B4 (de) * | 1999-06-02 | 2006-04-06 | Robert Bosch Gmbh | Verfahren und Vorrichtung zum Galvanisieren |
| NL1015348C2 (nl) * | 2000-05-31 | 2001-12-03 | D R P P B V Dutch Reverse Puls | Methode ter verbetering van electrolytische metaal neerslagverdeling op een substraat met behulp van Periodic Reversal Current waarbij gebruik wordt gemaakt van Oplosbare-, Inerte- en Hybride Anoden. |
| DE10259362A1 (de) * | 2002-12-18 | 2004-07-08 | Siemens Ag | Verfahren zum Abscheiden einer Legierung auf ein Substrat |
| DE112005000842B4 (de) | 2004-04-15 | 2022-09-15 | Hitachi Metals, Ltd. | Verfahren zum Verleihen von Widerstand gegenüber Wasserstoff an einen Artikel |
| WO2007112971A3 (de) * | 2006-03-30 | 2007-11-29 | Atotech Deutschland Gmbh | Elektrolytisches verfahren zum füllen von löchern und vertiefungen mit metallen |
| CN101416569B (zh) * | 2006-03-30 | 2011-04-06 | 埃托特克德国有限公司 | 用金属填充孔和凹处的电解方法 |
| US8784634B2 (en) | 2006-03-30 | 2014-07-22 | Atotech Deutschland Gmbh | Electrolytic method for filling holes and cavities with metals |
| WO2010094998A1 (en) * | 2009-02-17 | 2010-08-26 | Atotech Deutschland Gmbh | Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv) |
| CN120239188A (zh) * | 2025-05-29 | 2025-07-01 | 珠海市航达科技有限公司 | 一种pcb板铜电镀方法 |
| CN120239188B (zh) * | 2025-05-29 | 2025-09-16 | 珠海市航达科技有限公司 | 一种pcb板铜电镀方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE59604701D1 (de) | 2000-04-20 |
| US6099711A (en) | 2000-08-08 |
| JP2000500529A (ja) | 2000-01-18 |
| JP2009299195A (ja) | 2009-12-24 |
| ES2144789T3 (es) | 2000-06-16 |
| WO1997019206A1 (de) | 1997-05-29 |
| JP5417112B2 (ja) | 2014-02-12 |
| CA2233329C (en) | 2005-07-26 |
| EP0862665B1 (de) | 2000-03-15 |
| CA2233329A1 (en) | 1997-05-29 |
| ATE190677T1 (de) | 2000-04-15 |
| TW420728B (en) | 2001-02-01 |
| EP0862665A1 (de) | 1998-09-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE19545231A1 (de) | Verfahren zur elektrolytischen Abscheidung von Metallschichten | |
| DE19653681C2 (de) | Verfahren zur elektrolytischen Abscheidung von Kupferschichten mit gleichmäßiger Schichtdicke und guten optischen und metallphysikalischen Eigenschaften und Anwendung des Verfahrens | |
| EP0690934B1 (de) | Verfahren und vorrichtung zur elektrolytischen abscheidung von metallschichten | |
| DE3601698C2 (https=) | ||
| DE3012168C2 (https=) | ||
| EP0037535B1 (de) | Galvanisches Bad zur Abscheidung von Gold- und Goldlegierungsüberzügen | |
| EP2989236B1 (de) | Elektrisch leitende flüssigkeiten auf der basis von metall-diphosphonat-komplexen | |
| DE2208327A1 (de) | Verfahren zur galvanischen Metallplattierung | |
| EP2635724B1 (de) | Verfahren zur abscheidung von hartchrom aus cr(vi)-freien elektrolyten | |
| DE19915146C1 (de) | Verfahren zum galvanischen Bilden von Leiterstrukturen aus hochreinem Kupfer bei der Herstellung von integrierten Schaltungen | |
| EP0619386B1 (de) | Elektrolytische Abscheidung von Palladium oder Palladiumlegierungen | |
| DE3347593C2 (https=) | ||
| DE102020133188B4 (de) | Verwendung eines Silber-Bismut-Elektrolyt zur Abscheidung von Hartsilberschichten | |
| EP1080252B1 (de) | Verfahren zur galvanischen verkupferung von substraten | |
| DE4338148C2 (de) | Verfahren zur elektrolytischen Abscheidung matter und pickelfreier Kupferschichten mit hoher Bruchdehnung auf Substratoberflächen | |
| DE102021002197A1 (de) | Vorrichtung und Verfahren zum Beschichten eines Bauteils oder Halbzeugs mit einer Chromschicht | |
| DE10060127B4 (de) | Elektrolytisches Eisenabscheidungsbad und Verfahren zum elektrolytischen Abscheiden von Eisen und Anwendungen des Verfahrens | |
| DE2940741A1 (de) | Verfahren zur elektrolytischen gewinnung von nickel | |
| DE60103426T2 (de) | Kupferbad und verfahren zur abscheidung eines matten kupferüberzuges | |
| DD159268A3 (de) | Verfahren zur galvanischen abscheidung von kupferschichten auf leiterplatten | |
| DE2165329A1 (de) | Verfahren zum schnellen galvanischen Niederschlagen von Nickel | |
| DE102009041250B4 (de) | Verfahren zur elektrolytischen Verkupferung von Zinkdruckguss mit verringerter Neigung zur Blasenbildung | |
| DE4040526A1 (de) | Bad zur galvanischen abscheidung von goldlegierungen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| 8130 | Withdrawal |