DE1803138A1 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung

Info

Publication number
DE1803138A1
DE1803138A1 DE19681803138 DE1803138A DE1803138A1 DE 1803138 A1 DE1803138 A1 DE 1803138A1 DE 19681803138 DE19681803138 DE 19681803138 DE 1803138 A DE1803138 A DE 1803138A DE 1803138 A1 DE1803138 A1 DE 1803138A1
Authority
DE
Germany
Prior art keywords
semiconductor
components
semiconductor device
layer
binder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19681803138
Other languages
German (de)
English (en)
Inventor
Albert Schmitz
Velde Ties Siebolt Te
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of DE1803138A1 publication Critical patent/DE1803138A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H10W70/614—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together the multiple chips being integrally enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
    • H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/10—Configurations of laterally-adjacent chips

Landscapes

  • Luminescent Compositions (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
DE19681803138 1967-10-21 1968-10-15 Halbleitervorrichtung Pending DE1803138A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6714336A NL6714336A (enExample) 1967-10-21 1967-10-21

Publications (1)

Publication Number Publication Date
DE1803138A1 true DE1803138A1 (de) 1969-06-04

Family

ID=19801524

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19681803138 Pending DE1803138A1 (de) 1967-10-21 1968-10-15 Halbleitervorrichtung

Country Status (10)

Country Link
US (1) US3579056A (enExample)
BE (1) BE722669A (enExample)
BR (1) BR6803288D0 (enExample)
CH (1) CH496322A (enExample)
DE (1) DE1803138A1 (enExample)
ES (1) ES359345A1 (enExample)
FR (1) FR1591647A (enExample)
GB (1) GB1250815A (enExample)
NL (1) NL6714336A (enExample)
SE (1) SE352480B (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8237259B2 (en) 2007-06-13 2012-08-07 Infineon Technologies Ag Embedded chip package
DE102012005192A1 (de) * 2011-12-19 2013-06-20 Inoviscoat Gmbh Leuchtbild
WO2013091605A1 (de) 2011-12-19 2013-06-27 Inoviscoat Gmbh Leuchtbild
US9301367B2 (en) 2011-12-19 2016-03-29 Inoviscoat Gmbh Luminous elements with an electroluminescent arrangement and method for producing a luminous element

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3777220A (en) * 1972-06-30 1973-12-04 Ibm Circuit panel and method of construction
JPS51150068A (en) * 1975-06-19 1976-12-23 Citizen Watch Co Ltd Electronic circuit block
JPS54158669A (en) * 1978-06-05 1979-12-14 Matsushita Electric Industrial Co Ltd Printed circuit board
DE3019207A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip
US5344795A (en) * 1992-09-22 1994-09-06 Microelectronics And Computer Technology Corporation Method for encapsulating an integrated circuit using a removable heatsink support block
DE20117575U1 (de) * 2001-10-26 2002-03-28 Moser, Helmut, Dipl.-Volkswirt, 76646 Bruchsal Sandwichplatte mit beidseitigen Leuchtfeldern
DE10164800B4 (de) * 2001-11-02 2005-03-31 Infineon Technologies Ag Verfahren zur Herstellung eines elektronischen Bauelements mit mehreren übereinander gestapelten und miteinander kontaktierten Chips
DE10153609C2 (de) * 2001-11-02 2003-10-16 Infineon Technologies Ag Verfahren zur Herstellung eines elektronischen Bauelements mit mehreren übereinander gestapelten und miteinander kontaktierten Chips
DE10250621B4 (de) * 2002-10-30 2004-09-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Erzeugen verkapselter Chips und zum Erzeugen eines Stapels aus den verkapselten Chips
TW200507131A (en) * 2003-07-02 2005-02-16 North Corp Multi-layer circuit board for electronic device
US7768117B2 (en) * 2007-05-30 2010-08-03 Tessera, Inc. Microelectronic package having interconnected redistribution paths
US7968378B2 (en) * 2008-02-06 2011-06-28 Infineon Technologies Ag Electronic device
DE102010039156A1 (de) 2010-08-10 2012-02-16 Robert Bosch Gmbh Verfahren zum Herstellen einer elektrischen Schaltung und elektrische Schaltung
DE102010040704A1 (de) * 2010-09-14 2012-03-15 Robert Bosch Gmbh Verfahren zum Aufbauen einer elektrischen Schaltung und elektrische Schaltung
US9129959B2 (en) 2012-08-21 2015-09-08 Infineon Technologies Ag Method for manufacturing an electronic module and an electronic module
RU2642170C2 (ru) 2013-12-19 2018-01-24 Интел Корпорейшн Гибко оборачиваемый кристалл интегральной схемы

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3040416A (en) * 1959-05-13 1962-06-26 Hoffman Electronics Corp Method of making a large area solar cell panel
US3121177A (en) * 1962-01-23 1964-02-11 Robert H Davis Active thin-film devices controlling current by modulation of a quantum mechanical potential barrier
DE1514460A1 (de) * 1965-05-11 1969-05-22 Siemens Ag Verfahren zum Herstellen von Halbleiterschaltungen
US3411050A (en) * 1966-04-28 1968-11-12 Air Force Usa Flexible storable solar cell array
US3402331A (en) * 1966-08-02 1968-09-17 Philips Corp Solid-state active electronic device and microcircuits containing same
US3483038A (en) * 1967-01-05 1969-12-09 Rca Corp Integrated array of thin-film photovoltaic cells and method of making same
US3433677A (en) * 1967-04-05 1969-03-18 Cornell Aeronautical Labor Inc Flexible sheet thin-film photovoltaic generator

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8237259B2 (en) 2007-06-13 2012-08-07 Infineon Technologies Ag Embedded chip package
DE102012005192A1 (de) * 2011-12-19 2013-06-20 Inoviscoat Gmbh Leuchtbild
WO2013091605A1 (de) 2011-12-19 2013-06-27 Inoviscoat Gmbh Leuchtbild
US9301367B2 (en) 2011-12-19 2016-03-29 Inoviscoat Gmbh Luminous elements with an electroluminescent arrangement and method for producing a luminous element

Also Published As

Publication number Publication date
FR1591647A (enExample) 1970-05-04
CH496322A (de) 1970-09-15
GB1250815A (enExample) 1971-10-20
SE352480B (enExample) 1972-12-27
ES359345A1 (es) 1970-08-16
BE722669A (enExample) 1969-04-21
US3579056A (en) 1971-05-18
NL6714336A (enExample) 1969-04-23
BR6803288D0 (pt) 1973-01-04

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