GB1250815A - - Google Patents

Info

Publication number
GB1250815A
GB1250815A GB1250815DA GB1250815A GB 1250815 A GB1250815 A GB 1250815A GB 1250815D A GB1250815D A GB 1250815DA GB 1250815 A GB1250815 A GB 1250815A
Authority
GB
United Kingdom
Prior art keywords
layer
radiation
grains
contacts
oct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1250815A publication Critical patent/GB1250815A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H10W70/614—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together the multiple chips being integrally enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
    • H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/10—Configurations of laterally-adjacent chips

Landscapes

  • Luminescent Compositions (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
GB1250815D 1967-10-21 1968-10-18 Expired GB1250815A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6714336A NL6714336A (enExample) 1967-10-21 1967-10-21

Publications (1)

Publication Number Publication Date
GB1250815A true GB1250815A (enExample) 1971-10-20

Family

ID=19801524

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1250815D Expired GB1250815A (enExample) 1967-10-21 1968-10-18

Country Status (10)

Country Link
US (1) US3579056A (enExample)
BE (1) BE722669A (enExample)
BR (1) BR6803288D0 (enExample)
CH (1) CH496322A (enExample)
DE (1) DE1803138A1 (enExample)
ES (1) ES359345A1 (enExample)
FR (1) FR1591647A (enExample)
GB (1) GB1250815A (enExample)
NL (1) NL6714336A (enExample)
SE (1) SE352480B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1307074A3 (de) * 2001-10-26 2005-11-02 FER Fahrzeugelektrik GmbH Elektrolumineszenz-Leuchtanordnung

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3777220A (en) * 1972-06-30 1973-12-04 Ibm Circuit panel and method of construction
JPS51150068A (en) * 1975-06-19 1976-12-23 Citizen Watch Co Ltd Electronic circuit block
JPS54158669A (en) * 1978-06-05 1979-12-14 Matsushita Electric Industrial Co Ltd Printed circuit board
DE3019207A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip
US5344795A (en) * 1992-09-22 1994-09-06 Microelectronics And Computer Technology Corporation Method for encapsulating an integrated circuit using a removable heatsink support block
DE10164800B4 (de) * 2001-11-02 2005-03-31 Infineon Technologies Ag Verfahren zur Herstellung eines elektronischen Bauelements mit mehreren übereinander gestapelten und miteinander kontaktierten Chips
DE10153609C2 (de) * 2001-11-02 2003-10-16 Infineon Technologies Ag Verfahren zur Herstellung eines elektronischen Bauelements mit mehreren übereinander gestapelten und miteinander kontaktierten Chips
DE10250621B4 (de) * 2002-10-30 2004-09-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Erzeugen verkapselter Chips und zum Erzeugen eines Stapels aus den verkapselten Chips
TW200507131A (en) * 2003-07-02 2005-02-16 North Corp Multi-layer circuit board for electronic device
US7768117B2 (en) * 2007-05-30 2010-08-03 Tessera, Inc. Microelectronic package having interconnected redistribution paths
US8237259B2 (en) 2007-06-13 2012-08-07 Infineon Technologies Ag Embedded chip package
US7968378B2 (en) * 2008-02-06 2011-06-28 Infineon Technologies Ag Electronic device
DE102010039156A1 (de) 2010-08-10 2012-02-16 Robert Bosch Gmbh Verfahren zum Herstellen einer elektrischen Schaltung und elektrische Schaltung
DE102010040704A1 (de) * 2010-09-14 2012-03-15 Robert Bosch Gmbh Verfahren zum Aufbauen einer elektrischen Schaltung und elektrische Schaltung
DE102012005192A1 (de) * 2011-12-19 2013-06-20 Inoviscoat Gmbh Leuchtbild
EP2794814B1 (de) 2011-12-19 2017-10-18 InovisCoat GmbH Leuchtelemente mit einer elektrolumineszenzanordnung sowie verfahren zur herstellung eines leuchtelements
WO2013091605A1 (de) 2011-12-19 2013-06-27 Inoviscoat Gmbh Leuchtbild
US9129959B2 (en) 2012-08-21 2015-09-08 Infineon Technologies Ag Method for manufacturing an electronic module and an electronic module
RU2642170C2 (ru) 2013-12-19 2018-01-24 Интел Корпорейшн Гибко оборачиваемый кристалл интегральной схемы

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3040416A (en) * 1959-05-13 1962-06-26 Hoffman Electronics Corp Method of making a large area solar cell panel
US3121177A (en) * 1962-01-23 1964-02-11 Robert H Davis Active thin-film devices controlling current by modulation of a quantum mechanical potential barrier
DE1514460A1 (de) * 1965-05-11 1969-05-22 Siemens Ag Verfahren zum Herstellen von Halbleiterschaltungen
US3411050A (en) * 1966-04-28 1968-11-12 Air Force Usa Flexible storable solar cell array
US3402331A (en) * 1966-08-02 1968-09-17 Philips Corp Solid-state active electronic device and microcircuits containing same
US3483038A (en) * 1967-01-05 1969-12-09 Rca Corp Integrated array of thin-film photovoltaic cells and method of making same
US3433677A (en) * 1967-04-05 1969-03-18 Cornell Aeronautical Labor Inc Flexible sheet thin-film photovoltaic generator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1307074A3 (de) * 2001-10-26 2005-11-02 FER Fahrzeugelektrik GmbH Elektrolumineszenz-Leuchtanordnung

Also Published As

Publication number Publication date
FR1591647A (enExample) 1970-05-04
CH496322A (de) 1970-09-15
SE352480B (enExample) 1972-12-27
ES359345A1 (es) 1970-08-16
BE722669A (enExample) 1969-04-21
US3579056A (en) 1971-05-18
NL6714336A (enExample) 1969-04-23
BR6803288D0 (pt) 1973-01-04
DE1803138A1 (de) 1969-06-04

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees