DE1639357A1 - Zusammengesetzte Bodenplatte fuer die Huelle eines Halbleiters - Google Patents
Zusammengesetzte Bodenplatte fuer die Huelle eines HalbleitersInfo
- Publication number
- DE1639357A1 DE1639357A1 DE19681639357 DE1639357A DE1639357A1 DE 1639357 A1 DE1639357 A1 DE 1639357A1 DE 19681639357 DE19681639357 DE 19681639357 DE 1639357 A DE1639357 A DE 1639357A DE 1639357 A1 DE1639357 A1 DE 1639357A1
- Authority
- DE
- Germany
- Prior art keywords
- plate
- base plate
- semiconductor
- glass
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 12
- 239000002131 composite material Substances 0.000 title description 4
- 239000011521 glass Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 239000013078 crystal Substances 0.000 claims description 7
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 4
- 230000001603 reducing effect Effects 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 3
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 claims description 3
- 230000005496 eutectics Effects 0.000 claims description 3
- 239000011049 pearl Substances 0.000 claims description 3
- 229910000531 Co alloy Inorganic materials 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims 1
- 238000007493 shaping process Methods 0.000 claims 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 10
- 238000005476 soldering Methods 0.000 description 7
- 238000002844 melting Methods 0.000 description 6
- 239000011324 bead Substances 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 241000272517 Anseriformes Species 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 235000010603 pastilles Nutrition 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 101150108358 GLAA gene Proteins 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 235000015115 caffè latte Nutrition 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002431 foraging effect Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007937 lozenge Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 150000002843 nonmetals Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000009433 steel framing Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C29/00—Joining metals with the aid of glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
- Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Ceramic Products (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR96270A FR1519854A (fr) | 1967-02-23 | 1967-02-23 | Embase composite, notamment pour dispositif semi-conducteur |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1639357A1 true DE1639357A1 (de) | 1971-02-04 |
Family
ID=8625839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19681639357 Pending DE1639357A1 (de) | 1967-02-23 | 1968-02-20 | Zusammengesetzte Bodenplatte fuer die Huelle eines Halbleiters |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3528102A (en, 2012) |
| BE (1) | BE711119A (en, 2012) |
| DE (1) | DE1639357A1 (en, 2012) |
| FR (1) | FR1519854A (en, 2012) |
| GB (1) | GB1215535A (en, 2012) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL6903229A (en, 2012) * | 1969-03-01 | 1970-09-03 | ||
| GB1331980A (en) * | 1970-12-15 | 1973-09-26 | Mullard Ltd | Mounting semiconductor bodies |
| US3775645A (en) * | 1972-08-08 | 1973-11-27 | T Mccarthy | Header assembly |
| US4820659A (en) * | 1986-07-16 | 1989-04-11 | General Electric Company | Method of making a semiconductor device assembly |
| US4951011A (en) * | 1986-07-24 | 1990-08-21 | Harris Corporation | Impedance matched plug-in package for high speed microwave integrated circuits |
| KR20150002077A (ko) * | 2013-06-28 | 2015-01-07 | 삼성전자주식회사 | 파워 반도체 모듈 |
| US10319654B1 (en) * | 2017-12-01 | 2019-06-11 | Cubic Corporation | Integrated chip scale packages |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2975928A (en) * | 1956-11-23 | 1961-03-21 | Philips Corp | Method of joining two metal parts in a vacuum-tight manner and object manufactured by the use of such method |
| US3119052A (en) * | 1959-11-24 | 1964-01-21 | Nippon Electric Co | Enclosures for semi-conductor electronic elements |
| US3219748A (en) * | 1961-12-04 | 1965-11-23 | Motorola Inc | Semiconductor device with cold welded package and method of sealing the same |
| US3258662A (en) * | 1963-05-10 | 1966-06-28 | International Telephone And Telegraph Corporation | Semiconductor housing |
| US3419763A (en) * | 1966-10-31 | 1968-12-31 | Itt | High power transistor structure |
-
1967
- 1967-02-23 FR FR96270A patent/FR1519854A/fr not_active Expired
-
1968
- 1968-02-20 GB GB8255/68A patent/GB1215535A/en not_active Expired
- 1968-02-20 DE DE19681639357 patent/DE1639357A1/de active Pending
- 1968-02-21 BE BE711119D patent/BE711119A/xx unknown
- 1968-02-26 US US708386A patent/US3528102A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| GB1215535A (en) | 1970-12-09 |
| BE711119A (en, 2012) | 1968-08-21 |
| US3528102A (en) | 1970-09-08 |
| FR1519854A (fr) | 1968-04-05 |
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