BE711119A - - Google Patents
Info
- Publication number
- BE711119A BE711119A BE711119DA BE711119A BE 711119 A BE711119 A BE 711119A BE 711119D A BE711119D A BE 711119DA BE 711119 A BE711119 A BE 711119A
- Authority
- BE
- Belgium
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C29/00—Joining metals with the aid of glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
- Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Ceramic Products (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR96270A FR1519854A (fr) | 1967-02-23 | 1967-02-23 | Embase composite, notamment pour dispositif semi-conducteur |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE711119A true BE711119A (xx) | 1968-08-21 |
Family
ID=8625839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE711119D BE711119A (xx) | 1967-02-23 | 1968-02-21 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3528102A (xx) |
| BE (1) | BE711119A (xx) |
| DE (1) | DE1639357A1 (xx) |
| FR (1) | FR1519854A (xx) |
| GB (1) | GB1215535A (xx) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL6903229A (xx) * | 1969-03-01 | 1970-09-03 | ||
| GB1331980A (en) * | 1970-12-15 | 1973-09-26 | Mullard Ltd | Mounting semiconductor bodies |
| US3775645A (en) * | 1972-08-08 | 1973-11-27 | T Mccarthy | Header assembly |
| US4820659A (en) * | 1986-07-16 | 1989-04-11 | General Electric Company | Method of making a semiconductor device assembly |
| US4951011A (en) * | 1986-07-24 | 1990-08-21 | Harris Corporation | Impedance matched plug-in package for high speed microwave integrated circuits |
| KR20150002077A (ko) * | 2013-06-28 | 2015-01-07 | 삼성전자주식회사 | 파워 반도체 모듈 |
| US10319654B1 (en) * | 2017-12-01 | 2019-06-11 | Cubic Corporation | Integrated chip scale packages |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2975928A (en) * | 1956-11-23 | 1961-03-21 | Philips Corp | Method of joining two metal parts in a vacuum-tight manner and object manufactured by the use of such method |
| US3119052A (en) * | 1959-11-24 | 1964-01-21 | Nippon Electric Co | Enclosures for semi-conductor electronic elements |
| US3219748A (en) * | 1961-12-04 | 1965-11-23 | Motorola Inc | Semiconductor device with cold welded package and method of sealing the same |
| US3258662A (en) * | 1963-05-10 | 1966-06-28 | International Telephone And Telegraph Corporation | Semiconductor housing |
| US3419763A (en) * | 1966-10-31 | 1968-12-31 | Itt | High power transistor structure |
-
1967
- 1967-02-23 FR FR96270A patent/FR1519854A/fr not_active Expired
-
1968
- 1968-02-20 GB GB8255/68A patent/GB1215535A/en not_active Expired
- 1968-02-20 DE DE19681639357 patent/DE1639357A1/de active Pending
- 1968-02-21 BE BE711119D patent/BE711119A/xx unknown
- 1968-02-26 US US708386A patent/US3528102A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US3528102A (en) | 1970-09-08 |
| DE1639357A1 (de) | 1971-02-04 |
| GB1215535A (en) | 1970-12-09 |
| FR1519854A (fr) | 1968-04-05 |