DE112022000346T5 - Halbleitervorrichtung und Verfahren zum Herstellen derselben - Google Patents

Halbleitervorrichtung und Verfahren zum Herstellen derselben Download PDF

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Publication number
DE112022000346T5
DE112022000346T5 DE112022000346.4T DE112022000346T DE112022000346T5 DE 112022000346 T5 DE112022000346 T5 DE 112022000346T5 DE 112022000346 T DE112022000346 T DE 112022000346T DE 112022000346 T5 DE112022000346 T5 DE 112022000346T5
Authority
DE
Germany
Prior art keywords
semiconductor device
bonding layer
sintering paste
sintering
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112022000346.4T
Other languages
German (de)
English (en)
Inventor
Saito Takashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of DE112022000346T5 publication Critical patent/DE112022000346T5/de
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01351—Changing the shapes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Die Bonding (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
DE112022000346.4T 2021-08-12 2022-06-23 Halbleitervorrichtung und Verfahren zum Herstellen derselben Pending DE112022000346T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021131674 2021-08-12
JP2021-131674 2021-08-12
PCT/JP2022/025088 WO2023017680A1 (ja) 2021-08-12 2022-06-23 半導体装置及びその製造方法

Publications (1)

Publication Number Publication Date
DE112022000346T5 true DE112022000346T5 (de) 2023-09-07

Family

ID=85200448

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112022000346.4T Pending DE112022000346T5 (de) 2021-08-12 2022-06-23 Halbleitervorrichtung und Verfahren zum Herstellen derselben

Country Status (5)

Country Link
US (1) US20230369276A1 (https=)
JP (1) JP7552917B2 (https=)
CN (1) CN116830249A (https=)
DE (1) DE112022000346T5 (https=)
WO (1) WO2023017680A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025047350A1 (ja) * 2023-08-31 2025-03-06 ローム株式会社 半導体装置、車両および半導体装置の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8253233B2 (en) 2008-02-14 2012-08-28 Infineon Technologies Ag Module including a sintered joint bonding a semiconductor chip to a copper surface
US8835299B2 (en) 2012-08-29 2014-09-16 Infineon Technologies Ag Pre-sintered semiconductor die structure
JP2018148168A (ja) 2017-03-09 2018-09-20 日立化成株式会社 半導体装置
JP2019216183A (ja) 2018-06-13 2019-12-19 三菱電機株式会社 半導体装置、及び半導体装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014029897A (ja) * 2012-07-31 2014-02-13 Hitachi Ltd 導電性接合体およびそれを用いた半導体装置
JP2015103791A (ja) * 2013-11-22 2015-06-04 有限会社ディアックス 半導体チップの接合方法
JP2015216160A (ja) * 2014-05-08 2015-12-03 三菱電機株式会社 電力用半導体装置および電力用半導体装置の製造方法
TWI689016B (zh) * 2016-08-22 2020-03-21 日商千住金屬工業股份有限公司 金屬燒結接合體、及晶片接合方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8253233B2 (en) 2008-02-14 2012-08-28 Infineon Technologies Ag Module including a sintered joint bonding a semiconductor chip to a copper surface
US8415207B2 (en) 2008-02-14 2013-04-09 Infineon Technologies Ag Module including a sintered joint bonding a semiconductor chip to a copper surface
US8835299B2 (en) 2012-08-29 2014-09-16 Infineon Technologies Ag Pre-sintered semiconductor die structure
JP2018148168A (ja) 2017-03-09 2018-09-20 日立化成株式会社 半導体装置
JP2019216183A (ja) 2018-06-13 2019-12-19 三菱電機株式会社 半導体装置、及び半導体装置の製造方法

Also Published As

Publication number Publication date
JPWO2023017680A1 (https=) 2023-02-16
WO2023017680A1 (ja) 2023-02-16
US20230369276A1 (en) 2023-11-16
JP7552917B2 (ja) 2024-09-18
CN116830249A (zh) 2023-09-29

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