JP7552917B2 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP7552917B2
JP7552917B2 JP2023541236A JP2023541236A JP7552917B2 JP 7552917 B2 JP7552917 B2 JP 7552917B2 JP 2023541236 A JP2023541236 A JP 2023541236A JP 2023541236 A JP2023541236 A JP 2023541236A JP 7552917 B2 JP7552917 B2 JP 7552917B2
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Japan
Prior art keywords
paste
semiconductor device
bonding layer
manufacturing
sintered
Prior art date
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JP2023541236A
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English (en)
Japanese (ja)
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JPWO2023017680A5 (https=
JPWO2023017680A1 (https=
Inventor
隆 齊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
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Fuji Electric Co Ltd
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Publication of JPWO2023017680A1 publication Critical patent/JPWO2023017680A1/ja
Publication of JPWO2023017680A5 publication Critical patent/JPWO2023017680A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01351—Changing the shapes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Die Bonding (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
JP2023541236A 2021-08-12 2022-06-23 半導体装置及びその製造方法 Active JP7552917B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021131674 2021-08-12
JP2021131674 2021-08-12
PCT/JP2022/025088 WO2023017680A1 (ja) 2021-08-12 2022-06-23 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JPWO2023017680A1 JPWO2023017680A1 (https=) 2023-02-16
JPWO2023017680A5 JPWO2023017680A5 (https=) 2023-10-31
JP7552917B2 true JP7552917B2 (ja) 2024-09-18

Family

ID=85200448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023541236A Active JP7552917B2 (ja) 2021-08-12 2022-06-23 半導体装置及びその製造方法

Country Status (5)

Country Link
US (1) US20230369276A1 (https=)
JP (1) JP7552917B2 (https=)
CN (1) CN116830249A (https=)
DE (1) DE112022000346T5 (https=)
WO (1) WO2023017680A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025047350A1 (ja) * 2023-08-31 2025-03-06 ローム株式会社 半導体装置、車両および半導体装置の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015103791A (ja) 2013-11-22 2015-06-04 有限会社ディアックス 半導体チップの接合方法
JP2015216160A (ja) 2014-05-08 2015-12-03 三菱電機株式会社 電力用半導体装置および電力用半導体装置の製造方法
WO2018037992A1 (ja) 2016-08-22 2018-03-01 千住金属工業株式会社 金属焼結接合体、およびダイ接合方法
JP2019216183A (ja) 2018-06-13 2019-12-19 三菱電機株式会社 半導体装置、及び半導体装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8253233B2 (en) 2008-02-14 2012-08-28 Infineon Technologies Ag Module including a sintered joint bonding a semiconductor chip to a copper surface
JP2014029897A (ja) * 2012-07-31 2014-02-13 Hitachi Ltd 導電性接合体およびそれを用いた半導体装置
US8835299B2 (en) 2012-08-29 2014-09-16 Infineon Technologies Ag Pre-sintered semiconductor die structure
JP2018148168A (ja) 2017-03-09 2018-09-20 日立化成株式会社 半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015103791A (ja) 2013-11-22 2015-06-04 有限会社ディアックス 半導体チップの接合方法
JP2015216160A (ja) 2014-05-08 2015-12-03 三菱電機株式会社 電力用半導体装置および電力用半導体装置の製造方法
WO2018037992A1 (ja) 2016-08-22 2018-03-01 千住金属工業株式会社 金属焼結接合体、およびダイ接合方法
JP2019216183A (ja) 2018-06-13 2019-12-19 三菱電機株式会社 半導体装置、及び半導体装置の製造方法

Also Published As

Publication number Publication date
DE112022000346T5 (de) 2023-09-07
JPWO2023017680A1 (https=) 2023-02-16
WO2023017680A1 (ja) 2023-02-16
US20230369276A1 (en) 2023-11-16
CN116830249A (zh) 2023-09-29

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