JPWO2023017680A1 - - Google Patents
Info
- Publication number
- JPWO2023017680A1 JPWO2023017680A1 JP2023541236A JP2023541236A JPWO2023017680A1 JP WO2023017680 A1 JPWO2023017680 A1 JP WO2023017680A1 JP 2023541236 A JP2023541236 A JP 2023541236A JP 2023541236 A JP2023541236 A JP 2023541236A JP WO2023017680 A1 JPWO2023017680 A1 JP WO2023017680A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
- H10W72/01351—Changing the shapes of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/15—Containers comprising an insulating or insulated base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
- H10W76/42—Fillings
- H10W76/47—Solid or gel fillings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Die Bonding (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021131674 | 2021-08-12 | ||
| JP2021131674 | 2021-08-12 | ||
| PCT/JP2022/025088 WO2023017680A1 (ja) | 2021-08-12 | 2022-06-23 | 半導体装置及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023017680A1 true JPWO2023017680A1 (https=) | 2023-02-16 |
| JPWO2023017680A5 JPWO2023017680A5 (https=) | 2023-10-31 |
| JP7552917B2 JP7552917B2 (ja) | 2024-09-18 |
Family
ID=85200448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023541236A Active JP7552917B2 (ja) | 2021-08-12 | 2022-06-23 | 半導体装置及びその製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20230369276A1 (https=) |
| JP (1) | JP7552917B2 (https=) |
| CN (1) | CN116830249A (https=) |
| DE (1) | DE112022000346T5 (https=) |
| WO (1) | WO2023017680A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025047350A1 (ja) * | 2023-08-31 | 2025-03-06 | ローム株式会社 | 半導体装置、車両および半導体装置の製造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014029897A (ja) * | 2012-07-31 | 2014-02-13 | Hitachi Ltd | 導電性接合体およびそれを用いた半導体装置 |
| JP2015103791A (ja) * | 2013-11-22 | 2015-06-04 | 有限会社ディアックス | 半導体チップの接合方法 |
| JP2015216160A (ja) * | 2014-05-08 | 2015-12-03 | 三菱電機株式会社 | 電力用半導体装置および電力用半導体装置の製造方法 |
| WO2018037992A1 (ja) * | 2016-08-22 | 2018-03-01 | 千住金属工業株式会社 | 金属焼結接合体、およびダイ接合方法 |
| JP2019216183A (ja) * | 2018-06-13 | 2019-12-19 | 三菱電機株式会社 | 半導体装置、及び半導体装置の製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8253233B2 (en) | 2008-02-14 | 2012-08-28 | Infineon Technologies Ag | Module including a sintered joint bonding a semiconductor chip to a copper surface |
| US8835299B2 (en) | 2012-08-29 | 2014-09-16 | Infineon Technologies Ag | Pre-sintered semiconductor die structure |
| JP2018148168A (ja) | 2017-03-09 | 2018-09-20 | 日立化成株式会社 | 半導体装置 |
-
2022
- 2022-06-23 JP JP2023541236A patent/JP7552917B2/ja active Active
- 2022-06-23 CN CN202280012646.4A patent/CN116830249A/zh active Pending
- 2022-06-23 DE DE112022000346.4T patent/DE112022000346T5/de active Pending
- 2022-06-23 WO PCT/JP2022/025088 patent/WO2023017680A1/ja not_active Ceased
-
2023
- 2023-07-27 US US18/226,961 patent/US20230369276A1/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014029897A (ja) * | 2012-07-31 | 2014-02-13 | Hitachi Ltd | 導電性接合体およびそれを用いた半導体装置 |
| JP2015103791A (ja) * | 2013-11-22 | 2015-06-04 | 有限会社ディアックス | 半導体チップの接合方法 |
| JP2015216160A (ja) * | 2014-05-08 | 2015-12-03 | 三菱電機株式会社 | 電力用半導体装置および電力用半導体装置の製造方法 |
| WO2018037992A1 (ja) * | 2016-08-22 | 2018-03-01 | 千住金属工業株式会社 | 金属焼結接合体、およびダイ接合方法 |
| JP2019216183A (ja) * | 2018-06-13 | 2019-12-19 | 三菱電機株式会社 | 半導体装置、及び半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112022000346T5 (de) | 2023-09-07 |
| WO2023017680A1 (ja) | 2023-02-16 |
| US20230369276A1 (en) | 2023-11-16 |
| JP7552917B2 (ja) | 2024-09-18 |
| CN116830249A (zh) | 2023-09-29 |
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