DE112010003269B4 - Struktur mit kopplung zwischen strukturen mit sublithographischem rasterabstand und strukturen mit lithographischem rasterabstand und verfahren zur herstellung der struktur - Google Patents

Struktur mit kopplung zwischen strukturen mit sublithographischem rasterabstand und strukturen mit lithographischem rasterabstand und verfahren zur herstellung der struktur Download PDF

Info

Publication number
DE112010003269B4
DE112010003269B4 DE112010003269.6T DE112010003269T DE112010003269B4 DE 112010003269 B4 DE112010003269 B4 DE 112010003269B4 DE 112010003269 T DE112010003269 T DE 112010003269T DE 112010003269 B4 DE112010003269 B4 DE 112010003269B4
Authority
DE
Germany
Prior art keywords
pitch
conductive
conductive lines
vertical plane
lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE112010003269.6T
Other languages
German (de)
English (en)
Other versions
DE112010003269T5 (de
Inventor
Sarunya Bangsaruntip
Daniel C. Edelstein
Steven Koester
Paul M. Soloman
William D. Hinsberg
Ho-cheol Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GlobalFoundries US Inc
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE112010003269T5 publication Critical patent/DE112010003269T5/de
Application granted granted Critical
Publication of DE112010003269B4 publication Critical patent/DE112010003269B4/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
    • H10W20/089—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts using processes for implementing desired shapes or dispositions of the openings, e.g. double patterning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/73—Etching of wafers, substrates or parts of devices using masks for insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/063—Manufacture or treatment of conductive parts of the interconnections by forming conductive members before forming protective insulating material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/063—Manufacture or treatment of conductive parts of the interconnections by forming conductive members before forming protective insulating material
    • H10W20/0633—Manufacture or treatment of conductive parts of the interconnections by forming conductive members before forming protective insulating material using subtractive patterning of the conductive members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/42—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/435—Cross-sectional shapes or dispositions of interconnections

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE112010003269.6T 2009-08-13 2010-08-04 Struktur mit kopplung zwischen strukturen mit sublithographischem rasterabstand und strukturen mit lithographischem rasterabstand und verfahren zur herstellung der struktur Expired - Fee Related DE112010003269B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/540,759 US8247904B2 (en) 2009-08-13 2009-08-13 Interconnection between sublithographic-pitched structures and lithographic-pitched structures
US12/540,759 2009-08-13
PCT/US2010/044326 WO2011019552A1 (en) 2009-08-13 2010-08-04 Interconnection between sublithographic-pitched structures and lithographic-pitched structures

Publications (2)

Publication Number Publication Date
DE112010003269T5 DE112010003269T5 (de) 2013-04-25
DE112010003269B4 true DE112010003269B4 (de) 2014-05-15

Family

ID=43586394

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112010003269.6T Expired - Fee Related DE112010003269B4 (de) 2009-08-13 2010-08-04 Struktur mit kopplung zwischen strukturen mit sublithographischem rasterabstand und strukturen mit lithographischem rasterabstand und verfahren zur herstellung der struktur

Country Status (7)

Country Link
US (1) US8247904B2 (https=)
JP (1) JP5559329B2 (https=)
CN (1) CN102473649B (https=)
DE (1) DE112010003269B4 (https=)
GB (1) GB2485493B (https=)
TW (1) TWI527154B (https=)
WO (1) WO2011019552A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7405147B2 (en) * 2004-01-30 2008-07-29 International Business Machines Corporation Device and methodology for reducing effective dielectric constant in semiconductor devices
US9105590B2 (en) * 2011-08-10 2015-08-11 United Microelectronics Corp. Semiconductor structure having material layers which are level with each other and manufacturing method thereof
US20130320451A1 (en) * 2012-06-01 2013-12-05 Taiwan Semiconductor Manufacturing Company, Ltd., ("Tsmc") Semiconductor device having non-orthogonal element
US9581899B2 (en) * 2012-11-27 2017-02-28 International Business Machines Corporation 2-dimensional patterning employing tone inverted graphoepitaxy
US9136168B2 (en) * 2013-06-28 2015-09-15 Taiwan Semiconductor Manufacturing Company, Ltd. Conductive line patterning
JP6522662B2 (ja) * 2014-06-13 2019-05-29 インテル・コーポレーション 電子ビームによる一方向の層上金属
US9306164B1 (en) 2015-01-30 2016-04-05 International Business Machines Corporation Electrode pair fabrication using directed self assembly of diblock copolymers
KR102705024B1 (ko) 2016-12-14 2024-09-09 삼성전자주식회사 반도체 장치
US10361158B2 (en) 2017-08-29 2019-07-23 Micron Technology, Inc. Integrated assemblies having structures along a first pitch coupled with structures along a second pitch different from the first pitch

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080261395A1 (en) * 2007-04-20 2008-10-23 Stefan Blawid Semiconductor Device, Method for Manufacturing Semiconductor Devices and Mask Systems Used in the Manufacturing of Semiconductor Devices
US20090032959A1 (en) * 2007-07-31 2009-02-05 International Business Machines Corporation Electrical fuses and resistors having sublithographic dimensions
WO2010135168A2 (en) * 2009-05-20 2010-11-25 Micron Technology, Inc. Method for providing electrical connections to spaced conductive lines

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU610249B2 (en) * 1987-09-29 1991-05-16 Microelectronics And Computer Technology Corporation Customizable circuitry
US5886410A (en) * 1996-06-26 1999-03-23 Intel Corporation Interconnect structure with hard mask and low dielectric constant materials
US6262487B1 (en) * 1998-06-23 2001-07-17 Kabushiki Kaisha Toshiba Semiconductor integrated circuit device, semiconductor integrated circuit wiring method, and cell arranging method
US6194667B1 (en) * 1998-08-19 2001-02-27 International Business Machines Corporation Receptor pad structure for chip carriers
US6795367B1 (en) * 2000-05-16 2004-09-21 Micron Technology, Inc. Layout technique for address signal lines in decoders including stitched blocks
JP2001352053A (ja) * 2000-06-08 2001-12-21 Nikon Corp 固体撮像装置
US6531357B2 (en) * 2000-08-17 2003-03-11 Kabushiki Kaisha Toshiba Method of manufacturing a semiconductor device
JP3964608B2 (ja) * 2000-08-17 2007-08-22 株式会社東芝 半導体装置
JP2003330385A (ja) * 2002-05-17 2003-11-19 Dainippon Printing Co Ltd 電極パターンおよびその検査方法
JP2004048032A (ja) * 2002-07-12 2004-02-12 Sharp Corp 配線構造、表示装置および能動素子基板
DE10259634B4 (de) * 2002-12-18 2008-02-21 Qimonda Ag Verfahren zur Herstellung von Kontakten auf einem Wafer
JP4498088B2 (ja) * 2004-10-07 2010-07-07 株式会社東芝 半導体記憶装置およびその製造方法
JP2006173186A (ja) * 2004-12-13 2006-06-29 Toshiba Corp 半導体装置、パターンレイアウト作成方法および露光マスク
JP4936659B2 (ja) * 2004-12-27 2012-05-23 株式会社東芝 半導体装置の製造方法
DE602005023597D1 (de) * 2005-07-08 2010-10-28 St Microelectronics Srl Verfahren zur Realisierung einer elektrischen Verbindung in einer elektronischen Halbleitervorrichtung zwischen einem nanometrischen Schaltungsarchitektur und elektronischen Standardkomponenten
US8618221B2 (en) * 2005-10-14 2013-12-31 Wisconsin Alumni Research Foundation Directed assembly of triblock copolymers
JP2007194496A (ja) * 2006-01-20 2007-08-02 Toshiba Corp 半導体集積回路
US20080085600A1 (en) * 2006-10-10 2008-04-10 Toshiharu Furukawa Method of forming lithographic and sub-lithographic dimensioned structures
US7553760B2 (en) * 2006-10-19 2009-06-30 International Business Machines Corporation Sub-lithographic nano interconnect structures, and method for forming same
TWM314988U (en) * 2006-12-29 2007-07-01 Innolux Display Corp Flexible printed circuit board
US7767099B2 (en) * 2007-01-26 2010-08-03 International Business Machines Corporaiton Sub-lithographic interconnect patterning using self-assembling polymers
US7964107B2 (en) * 2007-02-08 2011-06-21 Micron Technology, Inc. Methods using block copolymer self-assembly for sub-lithographic patterning
US20090001045A1 (en) * 2007-06-27 2009-01-01 International Business Machines Corporation Methods of patterning self-assembly nano-structure and forming porous dielectric
JP2008047904A (ja) * 2007-08-10 2008-02-28 Hitachi Ltd 半導体装置
JP2009042660A (ja) * 2007-08-10 2009-02-26 Renesas Technology Corp 半導体装置、フォトマスク、半導体装置の製造方法およびパターンレイアウト方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080261395A1 (en) * 2007-04-20 2008-10-23 Stefan Blawid Semiconductor Device, Method for Manufacturing Semiconductor Devices and Mask Systems Used in the Manufacturing of Semiconductor Devices
US20090032959A1 (en) * 2007-07-31 2009-02-05 International Business Machines Corporation Electrical fuses and resistors having sublithographic dimensions
WO2010135168A2 (en) * 2009-05-20 2010-11-25 Micron Technology, Inc. Method for providing electrical connections to spaced conductive lines

Also Published As

Publication number Publication date
GB2485493A (en) 2012-05-16
US8247904B2 (en) 2012-08-21
CN102473649A (zh) 2012-05-23
GB2485493B (en) 2014-01-15
DE112010003269T5 (de) 2013-04-25
TWI527154B (zh) 2016-03-21
JP5559329B2 (ja) 2014-07-23
WO2011019552A1 (en) 2011-02-17
JP2013502072A (ja) 2013-01-17
GB201200163D0 (en) 2012-02-15
US20110037175A1 (en) 2011-02-17
TW201123351A (en) 2011-07-01
CN102473649B (zh) 2015-03-18

Similar Documents

Publication Publication Date Title
DE112010003269B4 (de) Struktur mit kopplung zwischen strukturen mit sublithographischem rasterabstand und strukturen mit lithographischem rasterabstand und verfahren zur herstellung der struktur
DE102016123943B4 (de) Halbleiterverfahren
DE102016100766B4 (de) Strukturierung von durchkontaktierungen durch mehrfachfotolithografie und mehrfachätzung
DE102016117486B4 (de) Herstellungsverfahren für eine halbleitervorrichtung
DE112012005734B4 (de) Lithographieprozess und Lithographische Struktur mit doppelter Hartmaske
DE102007026372B4 (de) Verfahren zur Ausbildung einer Mikrostruktur in einer Halbleitervorrichtung
DE102019203596B4 (de) Mehrfachstrukturierung mit Dornschnitten, die unter Verwendung einer Blockmaske gebildet werden
DE102010064289B4 (de) Größenreduzierung von Kontaktelementen und Kontaktdurchführungen in einem Halbleiterbauelement durch Einbau eines zusätzlichen Abschrägungsmaterials
DE69512125T2 (de) Herstellung von Löchern in polymerischen Materialien
DE102019200054B4 (de) Verfahren zum Strukturieren von Metallisierungsleitungen mit variabler Breite
DE102011085203B4 (de) Herstellungsverfahren für Halbleiterbauelemente mit Durchgangskontakten
DE102017128235A1 (de) Strukturierungsverfahren für ein halbleiterbauelement und daraus resultierende strukturen
DE102013103976B4 (de) Halbleiterbauelement mit selbstausgerichteten Verbindungen und Sperrabschnitten
DE102018208546B4 (de) Strukturen aus dem mittleren Bereich der Fertigungslinie und Herstellungsverfahren dafür
DE102019217879A1 (de) Verbindungsstruktur für obere elektrode
DE102018220751A1 (de) Middle-of-line strukturen
DE102019203224A1 (de) Selbstausgerichtete Mehrfachstrukturierungsprozesse mit geschichteten Dornen
DE102018205693B4 (de) Verfahren zum bilden von selbstausgerichteten schnitten
DE102004001853B3 (de) Verfahren zum Herstellen von Kontaktierungsanschlüssen
DE102007035898B4 (de) Verfahren zur Herstellung eines Halbleiterbauelements
DE102022110498A1 (de) Halbleitervorrichtung und herstellungsverfahren davon
DE10228344B4 (de) Verfahren zur Herstellung von Mikrostrukturen sowie Anordnung von Mikrostrukturen
DE10046915A1 (de) Halbleitervorrichtung und Verfahren zum Herstellen derselben
DE112012002648T5 (de) Lokale Zwischenverbindung mit einem niedrigen Profil und Verfahren zum Herstellen derselben
DE102018222234B4 (de) Cut-first-vorgehen mit selbstausrichtung bei linien-strukturierung

Legal Events

Date Code Title Description
R163 Identified publications notified
R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0021440000

Ipc: H01L0029423000

Effective date: 20130606

R016 Response to examination communication
R016 Response to examination communication
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0029423000

Ipc: H01L0023535000

R018 Grant decision by examination section/examining division
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0029423000

Ipc: H01L0023535000

Effective date: 20140127

R084 Declaration of willingness to licence
R020 Patent grant now final
R020 Patent grant now final

Effective date: 20150217

R081 Change of applicant/patentee

Owner name: GLOBALFOUNDRIES U.S. INC., SANTA CLARA, US

Free format text: FORMER OWNER: INTERNATIONAL BUSINESS MACHINES CORPORATION, ARMONK, N.Y., US

Owner name: GLOBALFOUNDRIES INC., KY

Free format text: FORMER OWNER: INTERNATIONAL BUSINESS MACHINES CORPORATION, ARMONK, N.Y., US

R082 Change of representative

Representative=s name: GRUENECKER PATENT- UND RECHTSANWAELTE PARTG MB, DE

Representative=s name: RICHARDT PATENTANWAELTE PARTG MBB, DE

R081 Change of applicant/patentee

Owner name: GLOBALFOUNDRIES U.S. INC., SANTA CLARA, US

Free format text: FORMER OWNER: GLOBALFOUNDRIES US 2 LLC (N.D.GES.DES STAATES DELAWARE), HOPEWELL JUNCTION, N.Y., US

Owner name: GLOBALFOUNDRIES INC., KY

Free format text: FORMER OWNER: GLOBALFOUNDRIES US 2 LLC (N.D.GES.DES STAATES DELAWARE), HOPEWELL JUNCTION, N.Y., US

R082 Change of representative

Representative=s name: GRUENECKER PATENT- UND RECHTSANWAELTE PARTG MB, DE

Representative=s name: RICHARDT PATENTANWAELTE PARTG MBB, DE

R081 Change of applicant/patentee

Owner name: GLOBALFOUNDRIES U.S. INC., SANTA CLARA, US

Free format text: FORMER OWNER: GLOBALFOUNDRIES INC., GRAND CAYMAN, KY

R082 Change of representative

Representative=s name: GRUENECKER PATENT- UND RECHTSANWAELTE PARTG MB, DE

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee