DE10259187B4 - Metallisierung von Kunststoffsubstraten und Lösung zum Beizen und Aktivieren - Google Patents

Metallisierung von Kunststoffsubstraten und Lösung zum Beizen und Aktivieren Download PDF

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Publication number
DE10259187B4
DE10259187B4 DE10259187A DE10259187A DE10259187B4 DE 10259187 B4 DE10259187 B4 DE 10259187B4 DE 10259187 A DE10259187 A DE 10259187A DE 10259187 A DE10259187 A DE 10259187A DE 10259187 B4 DE10259187 B4 DE 10259187B4
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DE
Germany
Prior art keywords
solution
plastic substrates
plastic
acid
pickling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE10259187A
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German (de)
English (en)
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DE10259187A1 (de
Inventor
Andreas Dr. Königshofen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone Inc filed Critical Enthone Inc
Priority to DE10259187A priority Critical patent/DE10259187B4/de
Priority to JP2003400018A priority patent/JP4109615B2/ja
Priority to KR1020030086320A priority patent/KR100600574B1/ko
Priority to EP03028259A priority patent/EP1441045B1/de
Priority to ES03028259T priority patent/ES2353661T3/es
Priority to DE50313233T priority patent/DE50313233D1/de
Priority to AT03028259T priority patent/ATE486978T1/de
Priority to CNB200310123221XA priority patent/CN1328412C/zh
Priority to US10/739,842 priority patent/US20040132300A1/en
Publication of DE10259187A1 publication Critical patent/DE10259187A1/de
Application granted granted Critical
Publication of DE10259187B4 publication Critical patent/DE10259187B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/42—Introducing metal atoms or metal-containing groups
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/208—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
DE10259187A 2002-12-18 2002-12-18 Metallisierung von Kunststoffsubstraten und Lösung zum Beizen und Aktivieren Expired - Fee Related DE10259187B4 (de)

Priority Applications (9)

Application Number Priority Date Filing Date Title
DE10259187A DE10259187B4 (de) 2002-12-18 2002-12-18 Metallisierung von Kunststoffsubstraten und Lösung zum Beizen und Aktivieren
JP2003400018A JP4109615B2 (ja) 2002-12-18 2003-11-28 合成物質電気メッキ用基板の活性化方法
KR1020030086320A KR100600574B1 (ko) 2002-12-18 2003-12-01 합성수지의 전착을 위한 기판 활성화 방법
ES03028259T ES2353661T3 (es) 2002-12-18 2003-12-10 Procedimiento para la activación de substratos para la galvanización de plásticos.
EP03028259A EP1441045B1 (de) 2002-12-18 2003-12-10 Verfahren zur Aktivierung von Substraten für die Kunststoffgalvanisierung
DE50313233T DE50313233D1 (de) 2002-12-18 2003-12-10 Verfahren zur Aktivierung von Substraten für die Kunststoffgalvanisierung
AT03028259T ATE486978T1 (de) 2002-12-18 2003-12-10 Verfahren zur aktivierung von substraten für die kunststoffgalvanisierung
CNB200310123221XA CN1328412C (zh) 2002-12-18 2003-12-18 用于塑料电镀的基底的活化方法
US10/739,842 US20040132300A1 (en) 2002-12-18 2003-12-18 Procedure for activation of substrates for plastic galvanizing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10259187A DE10259187B4 (de) 2002-12-18 2002-12-18 Metallisierung von Kunststoffsubstraten und Lösung zum Beizen und Aktivieren

Publications (2)

Publication Number Publication Date
DE10259187A1 DE10259187A1 (de) 2004-07-01
DE10259187B4 true DE10259187B4 (de) 2008-06-19

Family

ID=32403903

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10259187A Expired - Fee Related DE10259187B4 (de) 2002-12-18 2002-12-18 Metallisierung von Kunststoffsubstraten und Lösung zum Beizen und Aktivieren
DE50313233T Expired - Lifetime DE50313233D1 (de) 2002-12-18 2003-12-10 Verfahren zur Aktivierung von Substraten für die Kunststoffgalvanisierung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE50313233T Expired - Lifetime DE50313233D1 (de) 2002-12-18 2003-12-10 Verfahren zur Aktivierung von Substraten für die Kunststoffgalvanisierung

Country Status (8)

Country Link
US (1) US20040132300A1 (enExample)
EP (1) EP1441045B1 (enExample)
JP (1) JP4109615B2 (enExample)
KR (1) KR100600574B1 (enExample)
CN (1) CN1328412C (enExample)
AT (1) ATE486978T1 (enExample)
DE (2) DE10259187B4 (enExample)
ES (1) ES2353661T3 (enExample)

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DE102004049663B3 (de) * 2004-10-11 2006-04-13 Infineon Technologies Ag Kunststoffgehäuse und Halbleiterbauteil mit derartigem Kunststoffgehäuse sowie Verfahren zur Herstellung derselben
EP1840246A4 (en) * 2005-01-17 2015-01-21 Daicel Polymer Ltd METHOD FOR PRODUCING A COATED RESIN CASTING ARTICLE
EP1734156B1 (de) * 2005-06-10 2017-03-01 Enthone, Inc. Verfahren zur Direktmetallisierung von nicht leitenden Substraten
DE102005051632B4 (de) * 2005-10-28 2009-02-19 Enthone Inc., West Haven Verfahren zum Beizen von nicht leitenden Substratoberflächen und zur Metallisierung von Kunststoffoberflächen
JP4275157B2 (ja) * 2006-07-27 2009-06-10 荏原ユージライト株式会社 プラスチック表面の金属化方法
CN101195911B (zh) * 2006-12-08 2011-06-22 埃托特克德国有限公司 在具有塑料表面的基底上形成涂布金属层的预处理溶液和方法
CN102363383A (zh) * 2011-08-30 2012-02-29 常熟市江顺塑料制品有限公司 一种复合塑料件
LT5997B (lt) * 2012-06-05 2014-02-25 Atotech Deutschland Gmbh Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas
DE102013007432A1 (de) * 2013-04-30 2014-10-30 Saurer Germany Gmbh & Co. Kg Faserführendes Textilmaschinen-Kunststoffteil, Textilmaschine mit faserführenden Funktionsbauteilen, Verfahren zum Herstellen eines faserführenden Textilmaschinen-Funktionsbauteils und Verwendung eines Kunststoffkörpers
US9364822B2 (en) 2013-06-28 2016-06-14 Rohm And Haas Electronic Materials Llc Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
CN104878423A (zh) * 2015-05-08 2015-09-02 芜湖航天特种电缆厂 镀覆方法
CN104988548A (zh) * 2015-07-21 2015-10-21 苏州荣昌复合材料有限公司 增加工程塑料镀层结合力的表面处理剂及应用
JP2018523016A (ja) * 2015-07-30 2018-08-16 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ プラスチック表面のめっき方法
JP6614845B2 (ja) * 2015-07-31 2019-12-04 マクセルホールディングス株式会社 メッキ部品の製造方法
CN108251874B (zh) * 2018-01-24 2019-08-16 永星化工(上海)有限公司 适于电镀的功能性树脂组合物上涂布金属层的预处理溶液
JP7005363B2 (ja) * 2018-01-29 2022-01-21 マクセル株式会社 メッキ膜被覆体の製造方法及び前処理液
JP2024512789A (ja) * 2021-03-29 2024-03-19 ハーエスオー ヘルベルト シュミット ゲーエムベーハー ウント コンパニー カーゲー ポリアミド用酸洗い剤
CN114775009B (zh) * 2022-04-26 2024-12-03 上海瑞尔实业有限公司 一种进气格栅高光电镀工艺

Citations (6)

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Publication number Priority date Publication date Assignee Title
FR1493783A (fr) * 1965-08-06 1967-09-01 Procédé pour activer la surface de matières plastiques appelées à être métallisées chimiquement et bain pour la mise en oeuvre de ce procédé
DE1264921B (de) * 1964-08-07 1968-03-28 Schering Ag Verfahren zur Vorbehandlung von Kunststoffoberflaechen fuer das Galvanisieren
US3437507A (en) * 1965-07-16 1969-04-08 Mc Donnell Douglas Corp Plating of substrates
DE1949277A1 (de) * 1969-09-25 1971-04-01 Schering Ag Verfahren zur Vorbehandlung von Kunststoffoberflaechen fuer das Galvanisieren
DE2039405C3 (de) * 1969-08-08 1977-01-20 Nihon Kagaku Kizai KJC., Tokio Verfahren zum chemischen Abscheiden von Nickel auf einem Träger aus Kunstharz
DE1949278C3 (de) * 1969-09-25 1982-07-15 Schering Ag, 1000 Berlin Und 4619 Bergkamen Verfahren zur Vorbehandlung von Kunststoffteilen für das chemische und galvanische Metallisieren auf Gestellen

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DE1264921B (de) * 1964-08-07 1968-03-28 Schering Ag Verfahren zur Vorbehandlung von Kunststoffoberflaechen fuer das Galvanisieren
US3437507A (en) * 1965-07-16 1969-04-08 Mc Donnell Douglas Corp Plating of substrates
FR1493783A (fr) * 1965-08-06 1967-09-01 Procédé pour activer la surface de matières plastiques appelées à être métallisées chimiquement et bain pour la mise en oeuvre de ce procédé
DE2039405C3 (de) * 1969-08-08 1977-01-20 Nihon Kagaku Kizai KJC., Tokio Verfahren zum chemischen Abscheiden von Nickel auf einem Träger aus Kunstharz
DE1949277A1 (de) * 1969-09-25 1971-04-01 Schering Ag Verfahren zur Vorbehandlung von Kunststoffoberflaechen fuer das Galvanisieren
DE1949278C3 (de) * 1969-09-25 1982-07-15 Schering Ag, 1000 Berlin Und 4619 Bergkamen Verfahren zur Vorbehandlung von Kunststoffteilen für das chemische und galvanische Metallisieren auf Gestellen

Also Published As

Publication number Publication date
DE10259187A1 (de) 2004-07-01
DE50313233D1 (de) 2010-12-16
ES2353661T3 (es) 2011-03-03
KR20040054494A (ko) 2004-06-25
CN1328412C (zh) 2007-07-25
ATE486978T1 (de) 2010-11-15
EP1441045A2 (de) 2004-07-28
EP1441045B1 (de) 2010-11-03
JP4109615B2 (ja) 2008-07-02
JP2004197221A (ja) 2004-07-15
US20040132300A1 (en) 2004-07-08
KR100600574B1 (ko) 2006-07-13
EP1441045A3 (de) 2006-01-04
CN1508287A (zh) 2004-06-30

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