DE102011007228B4 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung Download PDF

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Publication number
DE102011007228B4
DE102011007228B4 DE102011007228.4A DE102011007228A DE102011007228B4 DE 102011007228 B4 DE102011007228 B4 DE 102011007228B4 DE 102011007228 A DE102011007228 A DE 102011007228A DE 102011007228 B4 DE102011007228 B4 DE 102011007228B4
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DE
Germany
Prior art keywords
housing
cover
head
projection
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102011007228.4A
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German (de)
English (en)
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DE102011007228A1 (de
Inventor
Tetsuo Kuroda
Manabu Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication date
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Publication of DE102011007228A1 publication Critical patent/DE102011007228A1/de
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Publication of DE102011007228B4 publication Critical patent/DE102011007228B4/de
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
DE102011007228.4A 2010-05-19 2011-04-12 Halbleitervorrichtung Active DE102011007228B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-115526 2010-05-19
JP2010115526A JP5229271B2 (ja) 2010-05-19 2010-05-19 半導体装置

Publications (2)

Publication Number Publication Date
DE102011007228A1 DE102011007228A1 (de) 2011-11-24
DE102011007228B4 true DE102011007228B4 (de) 2019-08-22

Family

ID=44900590

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102011007228.4A Active DE102011007228B4 (de) 2010-05-19 2011-04-12 Halbleitervorrichtung

Country Status (3)

Country Link
JP (1) JP5229271B2 (enrdf_load_stackoverflow)
CN (1) CN102254878B (enrdf_load_stackoverflow)
DE (1) DE102011007228B4 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101346650B (zh) 2005-12-23 2010-09-29 3M创新有限公司 包含热塑性有机硅嵌段共聚物的多层膜
JP6848802B2 (ja) 2017-10-11 2021-03-24 三菱電機株式会社 半導体装置
JP6861622B2 (ja) * 2017-12-19 2021-04-21 三菱電機株式会社 半導体装置及び電力変換装置
EP4270469A1 (en) * 2022-04-29 2023-11-01 Infineon Technologies AG Power semiconductor module

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3308720A1 (de) 1983-03-11 1984-09-13 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit scheibenfoermigem gehaeuse
JPS63164345A (ja) 1986-12-26 1988-07-07 Nec Corp 半導体集積回路用パツケ−ジ
US5646445A (en) 1995-07-07 1997-07-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device having electrodes embedded in an insulating case
JP2004103936A (ja) 2002-09-11 2004-04-02 Mitsubishi Electric Corp 電力半導体装置およびその製造方法
US6787893B2 (en) 2001-01-23 2004-09-07 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
EP1494278A1 (de) 2003-07-04 2005-01-05 Siemens Aktiengesellschaft Elektronisches Leistungsmodul mit Gummidichtung und entsprechendes Herstellungsverfahren
EP1768182A2 (de) 2005-09-27 2007-03-28 Semikron Elektronik GmbH & Co. KG Patentabteilung Leistungshalbleitermodul mit Überstromschutzeinrichtung
DE102008051560A1 (de) 2007-10-18 2009-04-23 Infineon Technologies Ag Leistungshalbleitermodul

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4079511A (en) * 1976-07-30 1978-03-21 Amp Incorporated Method for packaging hermetically sealed integrated circuit chips on lead frames
JPS6329957A (ja) * 1986-07-23 1988-02-08 Seiko Epson Corp 半導体装置の封止形態
JPH02307250A (ja) * 1989-05-23 1990-12-20 Mitsubishi Electric Corp 混成集積回路パツケージ
CN100361317C (zh) * 2004-02-27 2008-01-09 矽品精密工业股份有限公司 具有支撑体的感光半导体封装件及其制法
JP4242401B2 (ja) * 2006-06-29 2009-03-25 三菱電機株式会社 半導体装置
CN101101880A (zh) * 2006-07-03 2008-01-09 矽品精密工业股份有限公司 散热型封装结构及其制法
JP4858336B2 (ja) * 2007-07-10 2012-01-18 三菱電機株式会社 電力用半導体装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3308720A1 (de) 1983-03-11 1984-09-13 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit scheibenfoermigem gehaeuse
JPS63164345A (ja) 1986-12-26 1988-07-07 Nec Corp 半導体集積回路用パツケ−ジ
US5646445A (en) 1995-07-07 1997-07-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device having electrodes embedded in an insulating case
US6787893B2 (en) 2001-01-23 2004-09-07 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JP2004103936A (ja) 2002-09-11 2004-04-02 Mitsubishi Electric Corp 電力半導体装置およびその製造方法
EP1494278A1 (de) 2003-07-04 2005-01-05 Siemens Aktiengesellschaft Elektronisches Leistungsmodul mit Gummidichtung und entsprechendes Herstellungsverfahren
EP1768182A2 (de) 2005-09-27 2007-03-28 Semikron Elektronik GmbH & Co. KG Patentabteilung Leistungshalbleitermodul mit Überstromschutzeinrichtung
DE102008051560A1 (de) 2007-10-18 2009-04-23 Infineon Technologies Ag Leistungshalbleitermodul

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP S63- 164 345 A (Maschinenübersetzung), AIPN [online] JPO [abgerufen am 06.03.2019] *

Also Published As

Publication number Publication date
CN102254878A (zh) 2011-11-23
CN102254878B (zh) 2015-01-14
JP2011243798A (ja) 2011-12-01
DE102011007228A1 (de) 2011-11-24
JP5229271B2 (ja) 2013-07-03

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