DE102007053849A1 - Anordnung umfassend ein optoelektronisches Bauelement - Google Patents

Anordnung umfassend ein optoelektronisches Bauelement Download PDF

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Publication number
DE102007053849A1
DE102007053849A1 DE102007053849A DE102007053849A DE102007053849A1 DE 102007053849 A1 DE102007053849 A1 DE 102007053849A1 DE 102007053849 A DE102007053849 A DE 102007053849A DE 102007053849 A DE102007053849 A DE 102007053849A DE 102007053849 A1 DE102007053849 A1 DE 102007053849A1
Authority
DE
Germany
Prior art keywords
component
arrangement according
optoelectronic
web
optoelectronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102007053849A
Other languages
German (de)
English (en)
Inventor
Dieter Dr. Eissler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to DE102007053849A priority Critical patent/DE102007053849A1/de
Priority to CN2008801093434A priority patent/CN101809773B/zh
Priority to EP08801317.2A priority patent/EP2193551B1/de
Priority to PCT/DE2008/001513 priority patent/WO2009039825A1/de
Priority to US12/678,511 priority patent/US8427839B2/en
Priority to KR1020107009231A priority patent/KR101475978B1/ko
Priority to JP2010526154A priority patent/JP5389034B2/ja
Priority to TW097137011A priority patent/TWI447943B/zh
Publication of DE102007053849A1 publication Critical patent/DE102007053849A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/168—Wrong mounting prevention
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/879—Bump connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Photovoltaic Devices (AREA)
DE102007053849A 2007-09-28 2007-11-12 Anordnung umfassend ein optoelektronisches Bauelement Withdrawn DE102007053849A1 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE102007053849A DE102007053849A1 (de) 2007-09-28 2007-11-12 Anordnung umfassend ein optoelektronisches Bauelement
CN2008801093434A CN101809773B (zh) 2007-09-28 2008-09-09 包括光电子器件的装置
EP08801317.2A EP2193551B1 (de) 2007-09-28 2008-09-09 Anordnung umfassend ein optoelektronisches bauelement
PCT/DE2008/001513 WO2009039825A1 (de) 2007-09-28 2008-09-09 Anordnung umfassend ein optoelektronisches bauelement
US12/678,511 US8427839B2 (en) 2007-09-28 2008-09-09 Arrangement comprising an optoelectronic component
KR1020107009231A KR101475978B1 (ko) 2007-09-28 2008-09-09 광전 소자를 포함하는 장치
JP2010526154A JP5389034B2 (ja) 2007-09-28 2008-09-09 オプトエレクトロニクス部品を備えている配置構造
TW097137011A TWI447943B (zh) 2007-09-28 2008-09-26 包含光電組件之配置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007046720 2007-09-28
DE102007046720.8 2007-09-28
DE102007053849A DE102007053849A1 (de) 2007-09-28 2007-11-12 Anordnung umfassend ein optoelektronisches Bauelement

Publications (1)

Publication Number Publication Date
DE102007053849A1 true DE102007053849A1 (de) 2009-04-02

Family

ID=40384467

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102007053849A Withdrawn DE102007053849A1 (de) 2007-09-28 2007-11-12 Anordnung umfassend ein optoelektronisches Bauelement

Country Status (8)

Country Link
US (1) US8427839B2 (https=)
EP (1) EP2193551B1 (https=)
JP (1) JP5389034B2 (https=)
KR (1) KR101475978B1 (https=)
CN (1) CN101809773B (https=)
DE (1) DE102007053849A1 (https=)
TW (1) TWI447943B (https=)
WO (1) WO2009039825A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016103862A1 (de) * 2016-03-03 2017-09-07 Osram Opto Semiconductors Gmbh Optoelektronische Leuchtvorrichtung, Träger für einen optoelektronischen Halbleiterchip und optoelektronisches Leuchtsystem

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2852975B1 (en) * 2012-05-23 2020-04-29 Lumileds Holding B.V. Surface mountable semiconductor device
DE102014100773A1 (de) 2014-01-23 2015-07-23 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
DE112015007162B4 (de) * 2015-11-30 2025-06-26 Intel Corporation Stapelchipgehäuse mit wärmeleitenden Strukturen Durch-die-Form zwischen einem unteren Chip und einem wärmeleitenden Material
CN107464873A (zh) * 2017-05-03 2017-12-12 合肥彩虹蓝光科技有限公司 一种避免倒装芯片固晶漏电的方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3657610A (en) * 1969-07-10 1972-04-18 Nippon Electric Co Self-sealing face-down bonded semiconductor device
US3811186A (en) * 1972-12-11 1974-05-21 Ibm Method of aligning and attaching circuit devices on a substrate
DE4020048A1 (de) * 1990-06-23 1992-01-02 Ant Nachrichtentech Anordnung aus substrat und bauelement und verfahren zur herstellung
US20010010743A1 (en) * 2000-02-02 2001-08-02 Ian Cayrefourcq Passive alignment using slanted wall pedestal
DE10157205A1 (de) * 2001-11-22 2003-06-12 Fraunhofer Ges Forschung Kontakthöcker mit profilierter Oberflächenstruktur sowie Verfahren zur Herstellung
DE202005014073U1 (de) * 2005-09-06 2007-01-18 Ic-Haus Gmbh Chipträgerbaugruppe

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Publication number Priority date Publication date Assignee Title
JP3138343B2 (ja) * 1992-09-30 2001-02-26 日本電信電話株式会社 光モジュールの製造方法
DE69410168T2 (de) 1993-06-24 1998-11-05 Toshiba Kawasaki Shi Kk Elektronische Schaltungsanordnung
JP3152834B2 (ja) * 1993-06-24 2001-04-03 株式会社東芝 電子回路装置
JPH07209559A (ja) * 1994-01-24 1995-08-11 Oki Electric Ind Co Ltd 光モジュールとその組立て方法
JPH08191141A (ja) * 1995-01-09 1996-07-23 Sony Corp 固体撮像素子
US5931371A (en) * 1997-01-16 1999-08-03 Ford Motor Company Standoff controlled interconnection
CN1191394A (zh) * 1997-02-20 1998-08-26 杨泰和 藉前置光－电转换元件驱动的绝缘栅双极晶体管
JP3011232B2 (ja) * 1997-02-25 2000-02-21 日本電気株式会社 固体撮像素子及びその製造方法
JP3786128B2 (ja) 2001-03-06 2006-06-14 ソニー株式会社 表示装置の製造方法
CN1220283C (zh) * 2001-04-23 2005-09-21 松下电工株式会社 使用led芯片的发光装置
JP2002319705A (ja) 2001-04-23 2002-10-31 Matsushita Electric Works Ltd Ｌｅｄ装置
JP4122784B2 (ja) * 2001-09-19 2008-07-23 松下電工株式会社 発光装置
JP4348894B2 (ja) * 2002-03-22 2009-10-21 日亜化学工業株式会社 発光装置
JP4139634B2 (ja) * 2002-06-28 2008-08-27 松下電器産業株式会社 Ｌｅｄ照明装置およびその製造方法
JP4153914B2 (ja) * 2003-01-27 2008-09-24 日本碍子株式会社 光デバイス
JP3947481B2 (ja) 2003-02-19 2007-07-18 浜松ホトニクス株式会社 光モジュール及びその製造方法
EP1473771A1 (en) * 2003-04-14 2004-11-03 Epitech Corporation, Ltd. Color mixing light emitting diode
US7495322B2 (en) * 2003-05-26 2009-02-24 Panasonic Electric Works Co., Ltd. Light-emitting device
JP2005158957A (ja) * 2003-11-25 2005-06-16 Matsushita Electric Works Ltd 発光装置
JP4123105B2 (ja) * 2003-05-26 2008-07-23 松下電工株式会社 発光装置
KR20060113710A (ko) * 2003-11-12 2006-11-02 이 아이 듀폰 디 네모아 앤드 캄파니 전자 장치용 캡슐화 어셈블리
EP1714327A1 (en) 2004-01-12 2006-10-25 Asetronics AG Arrangement with a light emitting device on a substrate
JP2006066519A (ja) * 2004-08-25 2006-03-09 Kyocera Corp 発光素子用配線基板ならびに発光装置
KR100867515B1 (ko) 2004-12-06 2008-11-07 삼성전기주식회사 발광소자 패키지
JP4789671B2 (ja) * 2006-03-28 2011-10-12 京セラ株式会社 発光素子用配線基板ならびに発光装置
JP4967548B2 (ja) * 2006-09-06 2012-07-04 株式会社ニコン 発光装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3657610A (en) * 1969-07-10 1972-04-18 Nippon Electric Co Self-sealing face-down bonded semiconductor device
US3811186A (en) * 1972-12-11 1974-05-21 Ibm Method of aligning and attaching circuit devices on a substrate
DE4020048A1 (de) * 1990-06-23 1992-01-02 Ant Nachrichtentech Anordnung aus substrat und bauelement und verfahren zur herstellung
US20010010743A1 (en) * 2000-02-02 2001-08-02 Ian Cayrefourcq Passive alignment using slanted wall pedestal
DE10157205A1 (de) * 2001-11-22 2003-06-12 Fraunhofer Ges Forschung Kontakthöcker mit profilierter Oberflächenstruktur sowie Verfahren zur Herstellung
DE202005014073U1 (de) * 2005-09-06 2007-01-18 Ic-Haus Gmbh Chipträgerbaugruppe

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016103862A1 (de) * 2016-03-03 2017-09-07 Osram Opto Semiconductors Gmbh Optoelektronische Leuchtvorrichtung, Träger für einen optoelektronischen Halbleiterchip und optoelektronisches Leuchtsystem
US10833475B2 (en) 2016-03-03 2020-11-10 Osram Oled Gmbh Optoelectronic lighting device, carrier for an optoelectronic semiconductor chip, and optoelectronic lighting system
DE112017001125B4 (de) 2016-03-03 2022-10-13 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische Leuchtvorrichtung, Herstellungsverfahren und optoelektronisches Leuchtsystem

Also Published As

Publication number Publication date
KR20100080603A (ko) 2010-07-09
EP2193551B1 (de) 2015-06-03
EP2193551A1 (de) 2010-06-09
JP2010541219A (ja) 2010-12-24
CN101809773B (zh) 2013-07-17
TWI447943B (zh) 2014-08-01
WO2009039825A1 (de) 2009-04-02
TW200926458A (en) 2009-06-16
CN101809773A (zh) 2010-08-18
US20100214727A1 (en) 2010-08-26
US8427839B2 (en) 2013-04-23
JP5389034B2 (ja) 2014-01-15
WO2009039825A4 (de) 2009-05-28
KR101475978B1 (ko) 2014-12-24

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OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
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Effective date: 20140908

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee