JP5389034B2 - オプトエレクトロニクス部品を備えている配置構造 - Google Patents

オプトエレクトロニクス部品を備えている配置構造 Download PDF

Info

Publication number
JP5389034B2
JP5389034B2 JP2010526154A JP2010526154A JP5389034B2 JP 5389034 B2 JP5389034 B2 JP 5389034B2 JP 2010526154 A JP2010526154 A JP 2010526154A JP 2010526154 A JP2010526154 A JP 2010526154A JP 5389034 B2 JP5389034 B2 JP 5389034B2
Authority
JP
Japan
Prior art keywords
web
component
contact
optoelectronic
optoelectronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010526154A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010541219A5 (https=
JP2010541219A (ja
Inventor
ディーター アイスラー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of JP2010541219A publication Critical patent/JP2010541219A/ja
Publication of JP2010541219A5 publication Critical patent/JP2010541219A5/ja
Application granted granted Critical
Publication of JP5389034B2 publication Critical patent/JP5389034B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/168—Wrong mounting prevention
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/879—Bump connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Photovoltaic Devices (AREA)
JP2010526154A 2007-09-28 2008-09-09 オプトエレクトロニクス部品を備えている配置構造 Expired - Fee Related JP5389034B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102007046720 2007-09-28
DE102007046720.8 2007-09-28
DE102007053849.0 2007-11-12
DE102007053849A DE102007053849A1 (de) 2007-09-28 2007-11-12 Anordnung umfassend ein optoelektronisches Bauelement
PCT/DE2008/001513 WO2009039825A1 (de) 2007-09-28 2008-09-09 Anordnung umfassend ein optoelektronisches bauelement

Publications (3)

Publication Number Publication Date
JP2010541219A JP2010541219A (ja) 2010-12-24
JP2010541219A5 JP2010541219A5 (https=) 2011-08-18
JP5389034B2 true JP5389034B2 (ja) 2014-01-15

Family

ID=40384467

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010526154A Expired - Fee Related JP5389034B2 (ja) 2007-09-28 2008-09-09 オプトエレクトロニクス部品を備えている配置構造

Country Status (8)

Country Link
US (1) US8427839B2 (https=)
EP (1) EP2193551B1 (https=)
JP (1) JP5389034B2 (https=)
KR (1) KR101475978B1 (https=)
CN (1) CN101809773B (https=)
DE (1) DE102007053849A1 (https=)
TW (1) TWI447943B (https=)
WO (1) WO2009039825A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2852975B1 (en) * 2012-05-23 2020-04-29 Lumileds Holding B.V. Surface mountable semiconductor device
DE102014100773A1 (de) 2014-01-23 2015-07-23 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
DE112015007162B4 (de) * 2015-11-30 2025-06-26 Intel Corporation Stapelchipgehäuse mit wärmeleitenden Strukturen Durch-die-Form zwischen einem unteren Chip und einem wärmeleitenden Material
DE102016103862A1 (de) * 2016-03-03 2017-09-07 Osram Opto Semiconductors Gmbh Optoelektronische Leuchtvorrichtung, Träger für einen optoelektronischen Halbleiterchip und optoelektronisches Leuchtsystem
CN107464873A (zh) * 2017-05-03 2017-12-12 合肥彩虹蓝光科技有限公司 一种避免倒装芯片固晶漏电的方法

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831507B1 (https=) * 1969-07-10 1973-09-29
US3811186A (en) * 1972-12-11 1974-05-21 Ibm Method of aligning and attaching circuit devices on a substrate
DE4020048A1 (de) * 1990-06-23 1992-01-02 Ant Nachrichtentech Anordnung aus substrat und bauelement und verfahren zur herstellung
JP3138343B2 (ja) * 1992-09-30 2001-02-26 日本電信電話株式会社 光モジュールの製造方法
DE69410168T2 (de) 1993-06-24 1998-11-05 Toshiba Kawasaki Shi Kk Elektronische Schaltungsanordnung
JP3152834B2 (ja) * 1993-06-24 2001-04-03 株式会社東芝 電子回路装置
JPH07209559A (ja) * 1994-01-24 1995-08-11 Oki Electric Ind Co Ltd 光モジュールとその組立て方法
JPH08191141A (ja) * 1995-01-09 1996-07-23 Sony Corp 固体撮像素子
US5931371A (en) * 1997-01-16 1999-08-03 Ford Motor Company Standoff controlled interconnection
CN1191394A (zh) * 1997-02-20 1998-08-26 杨泰和 藉前置光－电转换元件驱动的绝缘栅双极晶体管
JP3011232B2 (ja) * 1997-02-25 2000-02-21 日本電気株式会社 固体撮像素子及びその製造方法
EP1122567A1 (en) * 2000-02-02 2001-08-08 Corning Incorporated Passive alignement using slanted wall pedestal
JP3786128B2 (ja) 2001-03-06 2006-06-14 ソニー株式会社 表示装置の製造方法
CN1220283C (zh) * 2001-04-23 2005-09-21 松下电工株式会社 使用led芯片的发光装置
JP2002319705A (ja) 2001-04-23 2002-10-31 Matsushita Electric Works Ltd Ｌｅｄ装置
JP4122784B2 (ja) * 2001-09-19 2008-07-23 松下電工株式会社 発光装置
DE10157205A1 (de) * 2001-11-22 2003-06-12 Fraunhofer Ges Forschung Kontakthöcker mit profilierter Oberflächenstruktur sowie Verfahren zur Herstellung
JP4348894B2 (ja) * 2002-03-22 2009-10-21 日亜化学工業株式会社 発光装置
JP4139634B2 (ja) * 2002-06-28 2008-08-27 松下電器産業株式会社 Ｌｅｄ照明装置およびその製造方法
JP4153914B2 (ja) * 2003-01-27 2008-09-24 日本碍子株式会社 光デバイス
JP3947481B2 (ja) 2003-02-19 2007-07-18 浜松ホトニクス株式会社 光モジュール及びその製造方法
EP1473771A1 (en) * 2003-04-14 2004-11-03 Epitech Corporation, Ltd. Color mixing light emitting diode
US7495322B2 (en) * 2003-05-26 2009-02-24 Panasonic Electric Works Co., Ltd. Light-emitting device
JP2005158957A (ja) * 2003-11-25 2005-06-16 Matsushita Electric Works Ltd 発光装置
JP4123105B2 (ja) * 2003-05-26 2008-07-23 松下電工株式会社 発光装置
KR20060113710A (ko) * 2003-11-12 2006-11-02 이 아이 듀폰 디 네모아 앤드 캄파니 전자 장치용 캡슐화 어셈블리
EP1714327A1 (en) 2004-01-12 2006-10-25 Asetronics AG Arrangement with a light emitting device on a substrate
JP2006066519A (ja) * 2004-08-25 2006-03-09 Kyocera Corp 発光素子用配線基板ならびに発光装置
KR100867515B1 (ko) 2004-12-06 2008-11-07 삼성전기주식회사 발광소자 패키지
DE202005014073U1 (de) 2005-09-06 2007-01-18 Ic-Haus Gmbh Chipträgerbaugruppe
JP4789671B2 (ja) * 2006-03-28 2011-10-12 京セラ株式会社 発光素子用配線基板ならびに発光装置
JP4967548B2 (ja) * 2006-09-06 2012-07-04 株式会社ニコン 発光装置

Also Published As

Publication number Publication date
KR20100080603A (ko) 2010-07-09
EP2193551B1 (de) 2015-06-03
EP2193551A1 (de) 2010-06-09
JP2010541219A (ja) 2010-12-24
CN101809773B (zh) 2013-07-17
TWI447943B (zh) 2014-08-01
WO2009039825A1 (de) 2009-04-02
TW200926458A (en) 2009-06-16
CN101809773A (zh) 2010-08-18
US20100214727A1 (en) 2010-08-26
US8427839B2 (en) 2013-04-23
DE102007053849A1 (de) 2009-04-02
WO2009039825A4 (de) 2009-05-28
KR101475978B1 (ko) 2014-12-24

Similar Documents

Publication Publication Date Title
CN103080646B (zh) 具有提高热传递的发光器件封装件
JP4122784B2 (ja) 発光装置
US6940704B2 (en) Semiconductor light emitting device
CN102130113B (zh) 用于半导体发光器件封装的子基板和包括其的半导体发光器件封装
JP5349755B2 (ja) 表面実装の発光チップパッケージ
US10256385B2 (en) Light emitting die (LED) packages and related methods
US20070117273A1 (en) Accurate Alignment of an LED Assembly
US11069846B2 (en) Ultraviolet ray emitting device having maximized electrode area for improved heat dissipation
JP2004207367A (ja) 発光ダイオード及び発光ダイオード配列板
JP5389034B2 (ja) オプトエレクトロニクス部品を備えている配置構造
KR100863612B1 (ko) 발광소자
JP6754769B2 (ja) 半導体モジュールおよびその製造方法
CN100391017C (zh) 发光器件
KR20110123945A (ko) 발광다이오드 방열 패키지 및 그 제조방법
JP2008300542A (ja) 発光素子パッケージ用基板及び発光素子パッケージ
TWI385824B (zh) 光源裝置
KR101610378B1 (ko) 발광장치
KR100726967B1 (ko) 와이어 본딩 방식을 적용하지 않는 발광 다이오드 패키징
JP2020516066A (ja) 固体光エミッタパッケージ、ランプ、照明器具、及び固体光エミッタパッケージの製造方法
KR20110034123A (ko) 발광소자 패키지
US20230231083A1 (en) Light emitting diode module
CN116314526A (zh) 用于优化的热阻、焊接可靠性和smt加工良率的led金属焊盘配置
KR20170037907A (ko) 발광 장치
KR101925315B1 (ko) 라이트 유닛 및 이를 포함하는 발광 모듈
KR20110038334A (ko) 발광장치

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110317

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110704

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120829

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121204

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130218

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130514

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130806

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130924

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20131008

R150 Certificate of patent or registration of utility model

Ref document number: 5389034

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees