KR101475978B1 - 광전 소자를 포함하는 장치 - Google Patents

광전 소자를 포함하는 장치 Download PDF

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Publication number
KR101475978B1
KR101475978B1 KR1020107009231A KR20107009231A KR101475978B1 KR 101475978 B1 KR101475978 B1 KR 101475978B1 KR 1020107009231 A KR1020107009231 A KR 1020107009231A KR 20107009231 A KR20107009231 A KR 20107009231A KR 101475978 B1 KR101475978 B1 KR 101475978B1
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South Korea
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bridge
additional
contact
component
contacts
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Expired - Fee Related
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KR1020107009231A
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English (en)
Korean (ko)
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KR20100080603A (ko
Inventor
디터 아이슬러
Original Assignee
오스람 옵토 세미컨덕터스 게엠베하
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/168—Wrong mounting prevention
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/879—Bump connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Photovoltaic Devices (AREA)
KR1020107009231A 2007-09-28 2008-09-09 광전 소자를 포함하는 장치 Expired - Fee Related KR101475978B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102007046720 2007-09-28
DE102007046720.8 2007-09-28
DE102007053849.0 2007-11-12
DE102007053849A DE102007053849A1 (de) 2007-09-28 2007-11-12 Anordnung umfassend ein optoelektronisches Bauelement

Publications (2)

Publication Number Publication Date
KR20100080603A KR20100080603A (ko) 2010-07-09
KR101475978B1 true KR101475978B1 (ko) 2014-12-24

Family

ID=40384467

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107009231A Expired - Fee Related KR101475978B1 (ko) 2007-09-28 2008-09-09 광전 소자를 포함하는 장치

Country Status (8)

Country Link
US (1) US8427839B2 (https=)
EP (1) EP2193551B1 (https=)
JP (1) JP5389034B2 (https=)
KR (1) KR101475978B1 (https=)
CN (1) CN101809773B (https=)
DE (1) DE102007053849A1 (https=)
TW (1) TWI447943B (https=)
WO (1) WO2009039825A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2852975B1 (en) * 2012-05-23 2020-04-29 Lumileds Holding B.V. Surface mountable semiconductor device
DE102014100773A1 (de) 2014-01-23 2015-07-23 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
DE112015007162B4 (de) * 2015-11-30 2025-06-26 Intel Corporation Stapelchipgehäuse mit wärmeleitenden Strukturen Durch-die-Form zwischen einem unteren Chip und einem wärmeleitenden Material
DE102016103862A1 (de) * 2016-03-03 2017-09-07 Osram Opto Semiconductors Gmbh Optoelektronische Leuchtvorrichtung, Träger für einen optoelektronischen Halbleiterchip und optoelektronisches Leuchtsystem
CN107464873A (zh) * 2017-05-03 2017-12-12 合肥彩虹蓝光科技有限公司 一种避免倒装芯片固晶漏电的方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08191141A (ja) * 1995-01-09 1996-07-23 Sony Corp 固体撮像素子
JPH118380A (ja) * 1997-02-20 1999-01-12 Tai-Haa Yan 光電変換素子作動の絶縁ゲートバイポーラトランジスタ
KR100266803B1 (ko) * 1997-02-25 2000-10-02 가네꼬 히사시 평탄성이 개선된 ccd-형 고체촬상소자

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JPS4831507B1 (https=) * 1969-07-10 1973-09-29
US3811186A (en) * 1972-12-11 1974-05-21 Ibm Method of aligning and attaching circuit devices on a substrate
DE4020048A1 (de) * 1990-06-23 1992-01-02 Ant Nachrichtentech Anordnung aus substrat und bauelement und verfahren zur herstellung
JP3138343B2 (ja) * 1992-09-30 2001-02-26 日本電信電話株式会社 光モジュールの製造方法
DE69410168T2 (de) 1993-06-24 1998-11-05 Toshiba Kawasaki Shi Kk Elektronische Schaltungsanordnung
JP3152834B2 (ja) * 1993-06-24 2001-04-03 株式会社東芝 電子回路装置
JPH07209559A (ja) * 1994-01-24 1995-08-11 Oki Electric Ind Co Ltd 光モジュールとその組立て方法
US5931371A (en) * 1997-01-16 1999-08-03 Ford Motor Company Standoff controlled interconnection
EP1122567A1 (en) * 2000-02-02 2001-08-08 Corning Incorporated Passive alignement using slanted wall pedestal
JP3786128B2 (ja) 2001-03-06 2006-06-14 ソニー株式会社 表示装置の製造方法
CN1220283C (zh) * 2001-04-23 2005-09-21 松下电工株式会社 使用led芯片的发光装置
JP2002319705A (ja) 2001-04-23 2002-10-31 Matsushita Electric Works Ltd Ｌｅｄ装置
JP4122784B2 (ja) * 2001-09-19 2008-07-23 松下電工株式会社 発光装置
DE10157205A1 (de) * 2001-11-22 2003-06-12 Fraunhofer Ges Forschung Kontakthöcker mit profilierter Oberflächenstruktur sowie Verfahren zur Herstellung
JP4348894B2 (ja) * 2002-03-22 2009-10-21 日亜化学工業株式会社 発光装置
JP4139634B2 (ja) * 2002-06-28 2008-08-27 松下電器産業株式会社 Ｌｅｄ照明装置およびその製造方法
JP4153914B2 (ja) * 2003-01-27 2008-09-24 日本碍子株式会社 光デバイス
JP3947481B2 (ja) 2003-02-19 2007-07-18 浜松ホトニクス株式会社 光モジュール及びその製造方法
EP1473771A1 (en) * 2003-04-14 2004-11-03 Epitech Corporation, Ltd. Color mixing light emitting diode
US7495322B2 (en) * 2003-05-26 2009-02-24 Panasonic Electric Works Co., Ltd. Light-emitting device
JP2005158957A (ja) * 2003-11-25 2005-06-16 Matsushita Electric Works Ltd 発光装置
JP4123105B2 (ja) * 2003-05-26 2008-07-23 松下電工株式会社 発光装置
KR20060113710A (ko) * 2003-11-12 2006-11-02 이 아이 듀폰 디 네모아 앤드 캄파니 전자 장치용 캡슐화 어셈블리
EP1714327A1 (en) 2004-01-12 2006-10-25 Asetronics AG Arrangement with a light emitting device on a substrate
JP2006066519A (ja) * 2004-08-25 2006-03-09 Kyocera Corp 発光素子用配線基板ならびに発光装置
KR100867515B1 (ko) 2004-12-06 2008-11-07 삼성전기주식회사 발광소자 패키지
DE202005014073U1 (de) 2005-09-06 2007-01-18 Ic-Haus Gmbh Chipträgerbaugruppe
JP4789671B2 (ja) * 2006-03-28 2011-10-12 京セラ株式会社 発光素子用配線基板ならびに発光装置
JP4967548B2 (ja) * 2006-09-06 2012-07-04 株式会社ニコン 発光装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08191141A (ja) * 1995-01-09 1996-07-23 Sony Corp 固体撮像素子
JPH118380A (ja) * 1997-02-20 1999-01-12 Tai-Haa Yan 光電変換素子作動の絶縁ゲートバイポーラトランジスタ
KR100266803B1 (ko) * 1997-02-25 2000-10-02 가네꼬 히사시 평탄성이 개선된 ccd-형 고체촬상소자

Also Published As

Publication number Publication date
KR20100080603A (ko) 2010-07-09
EP2193551B1 (de) 2015-06-03
EP2193551A1 (de) 2010-06-09
JP2010541219A (ja) 2010-12-24
CN101809773B (zh) 2013-07-17
TWI447943B (zh) 2014-08-01
WO2009039825A1 (de) 2009-04-02
TW200926458A (en) 2009-06-16
CN101809773A (zh) 2010-08-18
US20100214727A1 (en) 2010-08-26
US8427839B2 (en) 2013-04-23
DE102007053849A1 (de) 2009-04-02
JP5389034B2 (ja) 2014-01-15
WO2009039825A4 (de) 2009-05-28

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