DE102005057981A1 - Leistungshalbleitervorrichtung - Google Patents
Leistungshalbleitervorrichtung Download PDFInfo
- Publication number
- DE102005057981A1 DE102005057981A1 DE102005057981A DE102005057981A DE102005057981A1 DE 102005057981 A1 DE102005057981 A1 DE 102005057981A1 DE 102005057981 A DE102005057981 A DE 102005057981A DE 102005057981 A DE102005057981 A DE 102005057981A DE 102005057981 A1 DE102005057981 A1 DE 102005057981A1
- Authority
- DE
- Germany
- Prior art keywords
- power
- semiconductor device
- power modules
- power semiconductor
- modules
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
- H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Inverter Devices (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004-354826 | 2004-12-08 | ||
| JP2004354826 | 2004-12-08 | ||
| JP2005-300261 | 2005-10-14 | ||
| JP2005300261A JP2006190972A (ja) | 2004-12-08 | 2005-10-14 | 電力用半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102005057981A1 true DE102005057981A1 (de) | 2006-06-14 |
Family
ID=36500367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102005057981A Withdrawn DE102005057981A1 (de) | 2004-12-08 | 2005-12-05 | Leistungshalbleitervorrichtung |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7656016B2 (https=) |
| JP (1) | JP2006190972A (https=) |
| DE (1) | DE102005057981A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102023213051A1 (de) * | 2023-12-20 | 2025-06-26 | Zf Friedrichshafen Ag | Baugruppe mit Leistungsmodul und Kühler, Inverter und Kraftfahrzeug |
Families Citing this family (66)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4575034B2 (ja) * | 2004-06-03 | 2010-11-04 | 株式会社東芝 | インバータ装置 |
| JP4293246B2 (ja) * | 2007-02-19 | 2009-07-08 | 株式会社日立製作所 | 電力変換装置 |
| US7965508B2 (en) * | 2007-03-27 | 2011-06-21 | Denso Corporation | Cooling device for electronic component and power converter equipped with the same |
| US7911806B2 (en) * | 2007-09-28 | 2011-03-22 | Hitachi, Ltd | Method and apparatus for reducing EMI emissions from a power inverter |
| US9064737B2 (en) * | 2007-11-13 | 2015-06-23 | Siemens Aktiengesellschaft | Power semiconductor module |
| JP4819071B2 (ja) * | 2008-02-06 | 2011-11-16 | 本田技研工業株式会社 | 電気車両及び車両用dc/dcコンバータの冷却方法 |
| US7911792B2 (en) * | 2008-03-11 | 2011-03-22 | Ford Global Technologies Llc | Direct dipping cooled power module and packaging |
| JP5319979B2 (ja) * | 2008-07-28 | 2013-10-16 | 株式会社ケーヒン | バスバーを有する端子 |
| JP2010129806A (ja) * | 2008-11-28 | 2010-06-10 | Mitsubishi Electric Corp | 電力用半導体装置および製造方法 |
| JP5262752B2 (ja) * | 2009-01-26 | 2013-08-14 | 株式会社デンソー | 電力変換装置 |
| JP5326646B2 (ja) * | 2009-02-24 | 2013-10-30 | 株式会社デンソー | 電力変換装置 |
| JP5083261B2 (ja) * | 2009-03-26 | 2012-11-28 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
| JP2010258308A (ja) * | 2009-04-27 | 2010-11-11 | Sharp Corp | 半導体装置およびコネクタ |
| JP5182249B2 (ja) * | 2009-08-06 | 2013-04-17 | 株式会社デンソー | 半導体冷却器 |
| JP5241688B2 (ja) * | 2009-11-13 | 2013-07-17 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
| JP5336413B2 (ja) * | 2010-04-02 | 2013-11-06 | 株式会社豊田中央研究所 | パワーモジュール |
| JP5473733B2 (ja) * | 2010-04-02 | 2014-04-16 | 株式会社日立製作所 | パワー半導体モジュール |
| JP5062302B2 (ja) | 2010-06-29 | 2012-10-31 | 株式会社デンソー | 冷却器への電子部品内蔵配線基板の取付構造及びその取付方法 |
| DE102011075921B8 (de) * | 2011-05-16 | 2014-08-07 | Infineon Technologies Ag | Mittels Klemmkeil und Gegenkeil elektrisch anschließbares Leistungshalbleitermodul und Leistungshalbleitermodulsystem mit einem solchen Leistungshalbleitermodul |
| JP5652346B2 (ja) * | 2011-06-30 | 2015-01-14 | 株式会社明電舎 | パワー半導体モジュール |
| JP5838700B2 (ja) * | 2011-10-04 | 2016-01-06 | 株式会社デンソー | 半導体モジュールの配設構造 |
| JP5935672B2 (ja) | 2012-01-31 | 2016-06-15 | アイシン・エィ・ダブリュ株式会社 | スイッチング素子ユニット |
| EP2648495B1 (en) * | 2012-04-04 | 2015-02-25 | Inmotion Technologies AB | Switched power converter |
| CN202799522U (zh) * | 2012-07-28 | 2013-03-13 | 中山大洋电机制造有限公司 | 一种电机控制器结构 |
| US8897014B2 (en) * | 2012-09-04 | 2014-11-25 | General Electric Company | Mechanical layout for half-bridge power module that is optimized for low inductance |
| WO2014046058A1 (ja) | 2012-09-20 | 2014-03-27 | ローム株式会社 | パワーモジュール半導体装置およびインバータ装置、およびパワーモジュール半導体装置の製造方法、および金型 |
| JP2014222745A (ja) * | 2013-05-14 | 2014-11-27 | 富士通株式会社 | 冷却構造体、基板ユニット、システム基板体及び電子機器 |
| DE112014004189T5 (de) * | 2013-09-12 | 2016-06-02 | Hanon Systems | Wärmetauscher zum Kühlen eines elektrischen Bauteils |
| KR102089628B1 (ko) * | 2014-05-19 | 2020-03-16 | 한온시스템 주식회사 | 전기소자 냉각용 열교환기 |
| KR101988992B1 (ko) * | 2013-09-27 | 2019-06-13 | 한온시스템 주식회사 | 전기소자 냉각용 열교환기 |
| WO2015111211A1 (ja) | 2014-01-27 | 2015-07-30 | 株式会社日立製作所 | パワーモジュール及びその製造方法 |
| KR102089630B1 (ko) * | 2014-05-19 | 2020-03-16 | 한온시스템 주식회사 | 전기소자 냉각용 열교환기 제조방법 |
| TWI539894B (zh) * | 2014-11-28 | 2016-06-21 | 財團法人工業技術研究院 | 功率模組 |
| JP6409556B2 (ja) * | 2014-12-19 | 2018-10-24 | 富士通株式会社 | 冷却機構付き基板及び電子機器 |
| DE112016000129B4 (de) * | 2015-03-10 | 2021-10-14 | Hanon Systems | Wärmetauscher zum Kühlen eines elektrischen Elements, sowie Wärmetauscheranordnung und Kühlmodul |
| US10037977B2 (en) * | 2015-08-19 | 2018-07-31 | Ford Global Technologies, Llc | Power electronics system |
| JP2017060291A (ja) * | 2015-09-16 | 2017-03-23 | 富士電機株式会社 | 電力変換装置 |
| KR102356681B1 (ko) * | 2015-10-08 | 2022-02-07 | 현대모비스 주식회사 | 직접냉각유로를 갖는 전력반도체 냉각 장치 |
| KR102443261B1 (ko) * | 2015-10-08 | 2022-09-13 | 현대모비스 주식회사 | 직접냉각유로를 갖는 전력반도체 양면 냉각 장치 |
| US10132400B2 (en) | 2016-01-19 | 2018-11-20 | Ford Global Technologies, Llc | Differential mounting system |
| FR3049159B1 (fr) * | 2016-03-15 | 2019-10-25 | Institut Vedecom | Module d’electronique de puissance refroidi, moteur et vehicule integrant un tel module |
| US20170336152A1 (en) * | 2016-05-20 | 2017-11-23 | Hyundai Motor Company | Double-sided cooler for cooling both sides of electronic component |
| KR102440583B1 (ko) * | 2016-11-22 | 2022-09-05 | 현대자동차 주식회사 | 파워 유닛, 및 이를 구비한 전력변환장치 |
| US10607919B2 (en) | 2017-04-28 | 2020-03-31 | Semiconductor Components Industries, Llc | Semiconductor package having junction cooling pipes embedded in substrates |
| KR102325110B1 (ko) * | 2017-05-31 | 2021-11-11 | 한온시스템 주식회사 | 전기소자 냉각용 열교환기 |
| DE102018112601A1 (de) * | 2017-05-31 | 2018-12-06 | Hanon Systems | Elektroelement-Kühlungsmodul |
| CN109285817A (zh) * | 2017-07-19 | 2019-01-29 | 比亚迪股份有限公司 | 半导体装置及具有其的车辆 |
| US10483028B2 (en) * | 2017-12-18 | 2019-11-19 | Deere & Company | Electrical assembly having cavities for coolant |
| US10377217B1 (en) | 2018-06-05 | 2019-08-13 | Ford Global Technologies, Llc | Power supply device |
| US11052740B2 (en) | 2018-06-05 | 2021-07-06 | Ford Global Technologies, Llc | Power supply device |
| CN109524375A (zh) * | 2018-11-29 | 2019-03-26 | 徐州华琅自动化设备有限公司 | 一种电动车控制器mos管散热装置 |
| US11495881B1 (en) * | 2018-12-10 | 2022-11-08 | Ball Aerospace & Technologies Corp. | Antenna system with integrated electromagnetic interference shielded heat sink |
| US11135936B2 (en) | 2019-03-06 | 2021-10-05 | Fermata, LLC | Methods for using temperature data to protect electric vehicle battery health during use of bidirectional charger |
| US11958372B2 (en) * | 2019-11-26 | 2024-04-16 | Fermata Energy Llc | Device for bi-directional power conversion and charging for use with electric vehicles |
| EP3962257A4 (en) * | 2020-05-28 | 2022-07-13 | Hangzhou Dareruohan Technology Co., Ltd. | HEAT DISSIPATION DEVICE AND HEAT DISSIPATION AND HEATING SYSTEM |
| DE112021002452T5 (de) | 2020-10-14 | 2023-02-09 | Rohm Co., Ltd. | Halbleitermodul |
| CN116018677A (zh) | 2020-10-14 | 2023-04-25 | 罗姆股份有限公司 | 半导体模块 |
| WO2022080055A1 (ja) | 2020-10-14 | 2022-04-21 | ローム株式会社 | 半導体モジュール |
| US20230307411A1 (en) | 2020-10-14 | 2023-09-28 | Rohm Co., Ltd. | Semiconductor module |
| FR3117729B1 (fr) * | 2020-12-14 | 2023-12-29 | Valeo Systemes Thermiques | Système de traitement thermique d’un élément électrique et/ou électronique |
| JP7552365B2 (ja) * | 2021-01-07 | 2024-09-18 | 株式会社デンソー | パワーモジュール |
| US12101916B2 (en) * | 2021-05-26 | 2024-09-24 | Ferrari S.P.A. | Compact electronic power converter to control at least one electric motor of a vehicle |
| KR20230024476A (ko) * | 2021-08-11 | 2023-02-21 | 현대자동차주식회사 | 차량용 전력 변환 장치 |
| JP7705779B2 (ja) * | 2021-10-22 | 2025-07-10 | Astemo株式会社 | 電力変換装置 |
| US11856687B2 (en) * | 2021-12-21 | 2023-12-26 | Semikron Elektronik Gmbh & Co. Kg | Power electronics system having a housing, a cooling device, a power semiconductor module and a capacitor device |
| US12484187B2 (en) * | 2023-06-28 | 2025-11-25 | Hyundai Motor Company | Cooling apparatus for power module |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
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| DE2160001C2 (de) * | 1971-12-03 | 1974-01-10 | Siemens Ag, 1000 Berlin U. 8000 Muenchen | Halbleiteranordnung, insbesondere Thyristorbaugruppe |
| US4192565A (en) * | 1976-10-28 | 1980-03-11 | Richard Gianni | Multi-level socket for an integrated circuit |
| US4392153A (en) * | 1978-05-01 | 1983-07-05 | General Electric Company | Cooled semiconductor power module including structured strain buffers without dry interfaces |
| CA1227886A (en) | 1984-01-26 | 1987-10-06 | Haruhiko Yamamoto | Liquid-cooling module system for electronic circuit components |
| US4878106A (en) * | 1986-12-02 | 1989-10-31 | Anton Piller Gmbh & Co. Kg | Semiconductor circuit packages for use in high power applications and method of making the same |
| JPH0720923Y2 (ja) * | 1988-03-01 | 1995-05-15 | サンケン電気株式会社 | 電子部品 |
| US5060112A (en) | 1990-04-02 | 1991-10-22 | Cocconi Alan G | Electrical component assembly with heat sink |
| JP2856962B2 (ja) * | 1991-10-14 | 1999-02-10 | オークマ株式会社 | パワー配線基板 |
| JP2575566B2 (ja) * | 1992-01-24 | 1997-01-29 | 株式会社東芝 | 半導体装置 |
| JPH0624279A (ja) | 1992-05-12 | 1994-02-01 | Nippondenso Co Ltd | 電気自動車用冷却装置 |
| US5801437A (en) * | 1993-03-29 | 1998-09-01 | Staktek Corporation | Three-dimensional warp-resistant integrated circuit module method and apparatus |
| JPH0794669A (ja) * | 1993-09-20 | 1995-04-07 | Toshiba Corp | 半導体パッケ−ジモジュ−ル |
| JPH07335783A (ja) * | 1994-06-13 | 1995-12-22 | Fujitsu Ltd | 半導体装置及び半導体装置ユニット |
| US5615475A (en) * | 1995-01-30 | 1997-04-01 | Staktek Corporation | Method of manufacturing an integrated package having a pair of die on a common lead frame |
| KR0179803B1 (ko) * | 1995-12-29 | 1999-03-20 | 문정환 | 리드노출형 반도체 패키지 |
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| JP3547333B2 (ja) * | 1999-02-22 | 2004-07-28 | 株式会社日立産機システム | 電力変換装置 |
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| JP2001100474A (ja) * | 1999-09-29 | 2001-04-13 | Kyocera Mita Corp | 画像形成装置の底面構造 |
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| JP3630070B2 (ja) * | 2000-03-30 | 2005-03-16 | 株式会社デンソー | 半導体チップおよび半導体装置 |
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| JP2001308266A (ja) * | 2000-04-21 | 2001-11-02 | Denso Corp | 半導体モジュール装置 |
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| JP3910383B2 (ja) * | 2001-07-17 | 2007-04-25 | 株式会社日立製作所 | パワーモジュールおよびインバータ |
| JP4803928B2 (ja) * | 2001-09-13 | 2011-10-26 | 東芝エレベータ株式会社 | 電力変換装置 |
| JP3627738B2 (ja) * | 2001-12-27 | 2005-03-09 | 株式会社デンソー | 半導体装置 |
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| JP3896006B2 (ja) * | 2002-02-22 | 2007-03-22 | 三洋電機株式会社 | 電子装置 |
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| JP3669971B2 (ja) | 2002-05-21 | 2005-07-13 | 三菱電機株式会社 | 半導体モジュール |
| JP3736527B2 (ja) | 2002-12-27 | 2006-01-18 | 日産自動車株式会社 | インバータ装置のパワーモジュール設置構造 |
| US6870271B2 (en) * | 2003-01-29 | 2005-03-22 | Sun Microsystems, Inc. | Integrated circuit assembly module that supports capacitive communication between semiconductor dies |
| JP4210908B2 (ja) | 2003-02-19 | 2009-01-21 | 株式会社デンソー | 半導体モジュール |
| JP4120876B2 (ja) | 2003-05-26 | 2008-07-16 | 株式会社デンソー | 半導体装置 |
| TWI283467B (en) * | 2003-12-31 | 2007-07-01 | Advanced Semiconductor Eng | Multi-chip package structure |
-
2005
- 2005-10-14 JP JP2005300261A patent/JP2006190972A/ja active Pending
- 2005-12-05 DE DE102005057981A patent/DE102005057981A1/de not_active Withdrawn
- 2005-12-07 US US11/295,442 patent/US7656016B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102023213051A1 (de) * | 2023-12-20 | 2025-06-26 | Zf Friedrichshafen Ag | Baugruppe mit Leistungsmodul und Kühler, Inverter und Kraftfahrzeug |
Also Published As
| Publication number | Publication date |
|---|---|
| US7656016B2 (en) | 2010-02-02 |
| JP2006190972A (ja) | 2006-07-20 |
| US20060119512A1 (en) | 2006-06-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |
Effective date: 20110701 |