DE69401137T2 - Kühlungsanordnung für elektrische Leistungsbauteile - Google Patents

Kühlungsanordnung für elektrische Leistungsbauteile

Info

Publication number
DE69401137T2
DE69401137T2 DE69401137T DE69401137T DE69401137T2 DE 69401137 T2 DE69401137 T2 DE 69401137T2 DE 69401137 T DE69401137 T DE 69401137T DE 69401137 T DE69401137 T DE 69401137T DE 69401137 T2 DE69401137 T2 DE 69401137T2
Authority
DE
Germany
Prior art keywords
electrical power
power components
cooling arrangement
cooling
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69401137T
Other languages
English (en)
Other versions
DE69401137D1 (de
Inventor
Jean-Luc Dubelloy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alstom Transport SA
Original Assignee
GEC Alsthom Transport SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GEC Alsthom Transport SA filed Critical GEC Alsthom Transport SA
Application granted granted Critical
Publication of DE69401137D1 publication Critical patent/DE69401137D1/de
Publication of DE69401137T2 publication Critical patent/DE69401137T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D7/00—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D7/04—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being spirally coiled
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE69401137T 1993-02-10 1994-02-07 Kühlungsanordnung für elektrische Leistungsbauteile Expired - Fee Related DE69401137T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9301459A FR2701600B1 (fr) 1993-02-10 1993-02-10 Dispositif de refroidissement de composants electriques de puissance.

Publications (2)

Publication Number Publication Date
DE69401137D1 DE69401137D1 (de) 1997-01-30
DE69401137T2 true DE69401137T2 (de) 1997-04-03

Family

ID=9443905

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69401137T Expired - Fee Related DE69401137T2 (de) 1993-02-10 1994-02-07 Kühlungsanordnung für elektrische Leistungsbauteile

Country Status (6)

Country Link
US (1) US5495889A (de)
EP (1) EP0611198B1 (de)
CA (1) CA2115303C (de)
DE (1) DE69401137T2 (de)
ES (1) ES2095133T3 (de)
FR (1) FR2701600B1 (de)

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DE19514548C1 (de) * 1995-04-20 1996-10-02 Daimler Benz Ag Verfahren zur Herstellung einer Mikrokühleinrichtung
TW346566B (en) * 1996-08-29 1998-12-01 Showa Aluminiun Co Ltd Radiator for portable electronic apparatus
US5870823A (en) * 1996-11-27 1999-02-16 International Business Machines Corporation Method of forming a multilayer electronic packaging substrate with integral cooling channels
US6163073A (en) * 1998-04-17 2000-12-19 International Business Machines Corporation Integrated heatsink and heatpipe
FR2786656B1 (fr) * 1998-11-27 2001-01-26 Alstom Technology Composant electronique de puissance comportant des moyens de refroidissement
US6674164B1 (en) 1999-04-26 2004-01-06 Aerovironment, Inc. System for uniformly interconnecting and cooling
WO2001082376A1 (fr) * 2000-04-25 2001-11-01 Kabushiki Kaisha Toyota Jidoshokki Dispositif a semi-conducteur
GB0026145D0 (en) * 2000-10-26 2000-12-13 South Bank Univ Entpr Ltd Cooling of receive coil in MRI scanners
CA2329408C (en) * 2000-12-21 2007-12-04 Long Manufacturing Ltd. Finned plate heat exchanger
US7011142B2 (en) 2000-12-21 2006-03-14 Dana Canada Corporation Finned plate heat exchanger
DE20115922U1 (de) * 2001-01-11 2002-01-17 Siemens Ag Kunststoff-Schaltplatte eines hydraulischen Kraftfahrzeug-Getriebesteuergerätes
DE10101091A1 (de) * 2001-01-11 2002-07-25 Siemens Ag Hydraulisches Kraftfahrzeug-Getriebesteuergerät mit Kunststoff-Hydraulikverteilerplatte und darin integrierten Leitern und Verfahren zu dessen Herstellung
US6892762B2 (en) * 2001-02-28 2005-05-17 Porter Instrument Company, Inc. Manifolded fluid delivery system
CA2372399C (en) * 2002-02-19 2010-10-26 Long Manufacturing Ltd. Low profile finned heat exchanger
CA2392610C (en) * 2002-07-05 2010-11-02 Long Manufacturing Ltd. Baffled surface cooled heat exchanger
JP4133170B2 (ja) * 2002-09-27 2008-08-13 Ｄｏｗａホールディングス株式会社 アルミニウム−セラミックス接合体
CA2425233C (en) * 2003-04-11 2011-11-15 Dana Canada Corporation Surface cooled finned plate heat exchanger
US7182125B2 (en) * 2003-11-28 2007-02-27 Dana Canada Corporation Low profile heat exchanger with notched turbulizer
JP2006032490A (ja) * 2004-07-13 2006-02-02 Hitachi Ltd エンジン制御回路装置
JP5128951B2 (ja) * 2005-09-28 2013-01-23 日本碍子株式会社 ヒートシンクモジュール及びその製造方法
US20070217152A1 (en) * 2006-03-16 2007-09-20 Kloeppel Gregg M Integrated liquid cooled heatsink system
TW200947188A (en) * 2008-05-01 2009-11-16 Acer Inc Liquid cooling heat dissipating device
US8120915B2 (en) * 2008-08-18 2012-02-21 General Electric Company Integral heat sink with spiral manifolds
US7817422B2 (en) * 2008-08-18 2010-10-19 General Electric Company Heat sink and cooling and packaging stack for press-packages
US20100038774A1 (en) * 2008-08-18 2010-02-18 General Electric Company Advanced and integrated cooling for press-packages
EP2172731A3 (de) * 2008-10-03 2013-08-21 Danfoss Drives A/S Flussverteileranordnung und Kühleinheit mit einer Flussverteileranordnung
JP4951094B2 (ja) * 2010-02-16 2012-06-13 株式会社東芝 電子機器の冷却構造
US8991478B2 (en) * 2010-03-29 2015-03-31 Hamilton Sundstrand Space Systems International, Inc. Compact two sided cold plate with transfer tubes
US20110232866A1 (en) * 2010-03-29 2011-09-29 Zaffetti Mark A Integral cold plate and honeycomb facesheet assembly
US8931546B2 (en) * 2010-03-29 2015-01-13 Hamilton Sundstrand Space Sytems International, Inc. Compact two sided cold plate with threaded inserts
US20110317369A1 (en) * 2010-06-29 2011-12-29 General Electric Company Heat sinks with millichannel cooling
US8218320B2 (en) 2010-06-29 2012-07-10 General Electric Company Heat sinks with C-shaped manifolds and millichannel cooling
US8897010B2 (en) * 2011-08-22 2014-11-25 General Electric Company High performance liquid cooled heatsink for IGBT modules
EP2672798B1 (de) * 2012-06-07 2020-08-19 Hamilton Sundstrand Space Systems International, Inc. Kompakte zweiseitige Kühlplatte mit schwimmenden Übertragungsröhren
US10345874B1 (en) * 2016-05-02 2019-07-09 Juniper Networks, Inc Apparatus, system, and method for decreasing heat migration in ganged heatsinks
US9955613B2 (en) 2016-09-13 2018-04-24 Denso International America, Inc. Cooler and power electronic module having the same
GB2559180B (en) * 2017-01-30 2020-09-09 Yasa Ltd Semiconductor cooling arrangement
US10591964B1 (en) 2017-02-14 2020-03-17 Juniper Networks, Inc Apparatus, system, and method for improved heat spreading in heatsinks
CA3125570A1 (en) * 2019-01-24 2020-07-30 Magna International Inc. Power converter with integrated multi-layer cooling
EP3723123A1 (de) * 2019-04-09 2020-10-14 Siemens Aktiengesellschaft Wärmeübertragungsvorrichtung und bauteil

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2915685A (en) * 1957-05-27 1959-12-01 Int Rectifier Corp Dry rectifier assembly and housing therefor
US4183042A (en) * 1977-02-18 1980-01-08 Pavel Kafunek Power semiconductor device
DE3137407A1 (de) * 1981-09-19 1983-04-07 BBC Aktiengesellschaft Brown, Boveri & Cie., 5401 Baden, Aargau Leistungshalbleiterbauelement fuer siedekuehlung
DE3143336A1 (de) * 1981-10-31 1983-05-19 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichterbaueinheit
DE3466833D1 (en) * 1983-11-02 1987-11-19 Bbc Brown Boveri & Cie Cooling body for the liquid cooling of power semiconductor devices
US4559580A (en) * 1983-11-04 1985-12-17 Sundstrand Corporation Semiconductor package with internal heat exchanger
CH677293A5 (en) * 1989-01-16 1991-04-30 Asea Brown Boveri Power semiconductor heat sink - has meandering flow path containing insulating hose filled with cooling fluid

Also Published As

Publication number Publication date
CA2115303A1 (fr) 1994-08-11
FR2701600A1 (fr) 1994-08-19
FR2701600B1 (fr) 1995-09-08
US5495889A (en) 1996-03-05
DE69401137D1 (de) 1997-01-30
ES2095133T3 (es) 1997-02-01
CA2115303C (fr) 2004-05-25
EP0611198B1 (de) 1996-12-18
EP0611198A1 (de) 1994-08-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee