200947188 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種液冷式散熱裝置’特別是有關於 一種兼具散熱鰭片及可移除式液冷模組之散熱裝置。 【先前技術】 目前’由於半導體製程以及電路設計的技術日益進 〇步，積體電路晶片的效能有大幅地成長，而且產品週期 也越來越短。晶片效能越好，工作頻率越高，其產生的 熱能也越大，若無法即時將熱能排除使晶片溫度降低於 二範圍，則會大大影響晶片的效能，甚至會造成晶片損 壞。因此，散熱裝置在電腦系統的重要性日益增加。 ,此外，目刚電腦大多具有可擴充性，可讓使用者自 行更換效月b更好的處理晶片或顯示卡晶片。因此，使用 者：期可能需求較低’所以購買效能較低的電腦系統， ❹隨者需求增加’使用者會對處理晶片絲示卡晶片做超 ，義，以提高效能，或是直接將原有日日日片更換成效能 ^的日0片。但是，效能較高的晶片亦會產生較多的熱 :讓=„須安裝散熱效過更好的散熱裝置，方 i讓效犯較面的晶片發揮出完整的效能。 置，大體上分為兩類’ 一類是被動式散熱裝 熱對流原，式散熱裝置，其不需動力，僅靠氣體 散:裝置，如風扇或液冷式散丄另其== 驅流體u體或料)與_進㈣域，藉此將熱能導 5 200947188 離熱源。一般而言，主動式散熱裝置的散熱效能比被動 式散熱裝置為佳’而液冷式散熱裝置的散熱效能亦比風 扇為佳’因此低階電腦大多配置被動式散熱裝置及風 扇，而高階電腦會配置液冷式散熱裝置。 請參考第1圖，其係為習知技藝之液冷式散熱裝置 • 之示意圖。圖中，液冷式散熱裝置1包含液冷模組丨丨及 散熱鰭片12。液冷模組11係覆蓋於晶片上，並以螺絲 14鎖接於電路板上。液體透過液冷模組11之入液管道 132流入進行熱交換，再從出液管道131流出，而散熱鰭 片12係設置於出液管道131上，以將水中的熱能散出。 液冷式散熱裝置1雖然可提供較佳的散熱功能，但其擴 充性不佳，若使用者再更換效能更高的晶片，則使用者 必須更換整組液冷式散熱裝置丨。此外，使用者亦無法從 較低1¾的散熱裝置擴充成液冷式散熱裝置丨。由於習知技 藝之鰭片式散熱裝置與液冷式散熱裝置的擴充性不佳， 對電腦廠商而言，廠商必須準備同時準備用於高階電腦 的液冷式散熱裝置，以及用於低階電腦的鰭片式散熱裝 置，以及用於高階電腦的液冷式散熱裝置，而且針&不 同效能的高階電腦又必須準備種不同的液冷式散熱装 置，此備料成本對電腦廠商是一項極大的負擔。…、 由於目前處理晶片及繪圖晶片的產品週期也越來 短，所以使用者更換散熱裝置的需求也越來越大。因此， ^何提供-種具擴充性之散熱裝置是—項亟待解決的問 有鑑於習知技藝之各項問題，為了能夠兼顧解決 6 200947188 之，本發明人基於多年研究開發與諸多實務經驗，提出 一種液冷式散熱裝置，以作為改善上述缺點之實現方式 與依據。 【發明内容】 有鑑於此，本發明之目的就是在提供一種液冷式散 熱裝置，以提高散熱裝置之擴充性及組裝便利性。 根據本發明之目的，提出一種液冷式散熱裝置，用 ❹以對至少一熱源進行散熱。此液冷式散熱裝置包含一基 座、至少一散熱鰭片及一液冷模組。基座之一侧係接觸 熱源之表面，而基座之另一侧之表面具有一第一區域及 一第二區域，而散熱鰭片係設置於第一區域，液冷模組 係可移除地(removably)設置於第二區域。 其中，此液冷式散熱裝置更可包含一接合器，其一 端係用以與液冷模組相結合，而另一端係用以與基座相 結合，致使液冷模組可透過接合器固定於第二區域上。 〇 此外，本發明更提出一種液冷式散熱裝置，用以對 第一熱源及第二熱源進行散熱，此液冷式散熱裝置包含 一第一基座、一第二基座、至少一第一散熱鰭片、至少 一第二散熱鰭片及一液冷模組。第一基座之一侧係接觸 第一熱源之表面，而第一基座之另一侧之表面具有一第 一區域及一第二區域。第二基座之一侧係接觸第一熱源 之表面，而第二基座之另一側之表面具有一第三區域及 一第四區域。第一散熱鰭片及第二散熱鰭片係分別設置 於該第一區域及第三區域。而液冷模組係可移除地 7 200947188 (removably)設置於第二區域及第四區域。 、其中，此液冷式散熱裝置更可包含兩個接合器，該 液冷模組之兩端部係透過該些接合器分別固 二區域及該第四區域上。 '以第 【實施方式】 以下將參照相關圖示，說明依本發明液冷式散熱裝 置之實施例，為使便於理冑，下述實施例中之相同^ ^ 係以相同之符號標示來說明。 請參閱第2圖及第3圖，其係為本發明之液冷式散 熱裝置之第一實施例之立體分解圖及組合侧視圖。圖 中，液冷式散熱裝置2包含一基座2卜複數個散熱鰭片 24、一結合器23及一液冷模組22。基座21之一侧係接 觸熱源之表面，例如一晶片之表面，而另一側之表面具 有第一區域211及一第二區域212，散熱鰭片24係設 置於第一區域211。散熱鰭片24與基座21較佳為一^ 3 成型。 在第二區域212中係具有一容置槽25，其内壁具有 一螺紋251。而接合器23之外壁具有一螺紋232，而第 螺紋251與螺紋232係相匹配。此外，接合器23具有 一開孔25 ’開孔25之内壁具有一螺紋231。 、 液冷模組22包含一本體220、一入液管道221及一 出液管道222,而液體係流過入液管道221及一出液管道 222與本體220進行熱交換。而在本體22〇之一端具有一 螺紋223 ’螺紋231係與螺紋223係相匹配。 200947188 組裝時，使用者可先將液冷模組22套入接合器23 使螺紋231與螺紋223部分咬合，在將接合器23置入容 置槽25使螺紋232與螺紋251部分咬合，接著，使用者 可轉動接合器23，讓螺紋251與螺紋232相鎖緊，螺紋 231與螺紋223相鎖緊，藉此，讓液冷模組22透過結合 器23可移除地（removably)設置於第二區域212，如第3 圖所示。 ' 基座21、散熱鰭片24、接合器23、液冷模組22之 〇 本體220較佳為導熱性良好之金屬所製成。基座21可熱 源所產生之熱能傳導至散熱鰭片24以進行散熱，若有安 裝液冷模組22,則熱能亦透過接合器23傳導至液冷模組 22之本體220,再由液體流過入液管道221及一出液管 道222與本體220進行熱交換。 由於液冷模組22具有入液管道221及出液管道 222，藉由使用結合器23，在組裝中可不需轉動液冷模組 22，以免入液管道221及出液管道222打結，進而提高 〇組裝便利性。 因此，當熱源為工作頻率較低之晶片時，其產生的 熱能較低，使用者可移除液冷模組22，僅使用散熱鰭片 24做被動式散熱，以節省散熱裝置2之耗能。當熱源為 工作頻率較高之晶片時，使用者可安裝液冷模組22以進 行主動式散熱，讓晶片可表現出較佳效能。 圖中所示第一區域211及第二區域212之位置，僅 為舉例，但並不以此為限，在基座表面上，凡液冷模組2 所設置之區域係定義為第二區域，而第二區域之外之區 9 200947188 域係定義為第一區域，皆在本發明之保護範圍内。 此外，圖中所示散熱鰭片24係分置於液冷模組2之 兩侧，並面向液冷模組2間隔設置，此僅為舉例，但並 不以此為限，例如散熱鰭片亦可圍繞液冷模組2組成一 太陽花狀、或是任何可達到散熱效果之設置佈局，皆在 本發明之保護範圍内。 請參閱第4圖及第5圖，其係為本發明之液冷式散熱 裝置之第二實施例之立體分解圖及組合侧視圖。圖中，液 ® 冷式散熱裝置3與液冷式散熱裝置2不同之處在於，結合 器33係具有一卡合機構(wedge) 331，而液冷模組32之 一端具有一凸緣323，卡合結構331係與凸緣323相匹配。 組裝時，使用者可先將接合器33鎖接於容置槽25, 接著，使用者可撥開卡合機構331，將液冷模組32之凸 緣323置入卡合機構331所包圍的空間中，再放開卡合 機構331，利用卡合機構331本身材料的彈性讓卡合機構 331可緊靠著本體220，並卡合凸緣323以固定液冷模組 ❹ 32，如第5圖所示，藉此，熱源所產生之熱能可從基座 21傳導至結合器33，再傳導至液冷模組32。 請參閱第6圖，其係為本發明之液冷式散熱裝置之 第三實施例之組合侧視圖。當對多個熱源進行散熱時， 可使用較大尺寸之基座，圖中，液冷式散熱裝置4之基 座41 一侧係覆蓋晶片491〜495,而基座41之另一侧具有 散熱鰭片以及液冷模組22，且使用者可視需要選擇性地 移除液冷模組22或安裝液冷模組22於基座41上。液冷 式散熱裝置4可以螺絲或卡榫固定於電路板496上。例 200947188 如，當主機板上安裝有處理晶片及_晶片_，便可使 :液：式散熱裝置4’同時對處理晶片及繪圖晶片進行散 2。藉由使用本發明之液冷式散㈣置，以液冷模組 ^配不同尺寸之基座，便可解決—熱源或多熱源之散妖 問題，亦降低所需的成本。 π參閱第7圖’其係為本發明之液冷式散熱裝置之 第四實施例之組合侧視圖。圖中，液冷式散熱裝置5係BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid-cooled heat sink device, and more particularly to a heat sink device having a heat sink fin and a removable liquid-cooling module. [Prior Art] At present, due to the increasingly advanced technology of semiconductor manufacturing and circuit design, the performance of integrated circuit chips has grown substantially, and the product cycle has become shorter and shorter. The better the performance of the chip, the higher the operating frequency, the greater the thermal energy generated. If the thermal energy is not removed immediately, the wafer temperature is lowered to two ranges, which will greatly affect the performance of the wafer and even cause wafer damage. Therefore, the importance of heat sinks in computer systems is increasing. In addition, most of the computers are extensible, allowing users to better process wafers or display card chips by replacing them. Therefore, the user may have a lower demand period, so the computer system with lower purchasing efficiency will increase the demand of the user. The user will do super-processing, processing, or improving the performance, or directly There are 0 pieces of the day when the daily film replacement effect can be ^. However, higher-efficiency wafers will also generate more heat: let = „have to install a heat-dissipating device with better heat dissipation, so that the wafers that are more effective can achieve full performance. Two types of 'one type is passive heat-dissipating heat convection, type heat sink, which does not require power, only gas dispersion: device, such as fan or liquid-cooled divergence, another == drive fluid u body or material) and _ (4) Domain, which will separate the thermal energy guide 5 200947188 from the heat source. In general, the active heat sink has better heat dissipation performance than the passive heat sink, and the liquid cooling heat sink has better heat dissipation performance than the fan. Therefore, the low-end computer Most of them are equipped with passive heat sinks and fans, while high-end computers are equipped with liquid-cooled heat sinks. Please refer to Figure 1, which is a schematic diagram of a liquid-cooled heat sink according to the prior art. In the figure, a liquid-cooled heat sink 1 The liquid cooling module 丨丨 and the heat dissipation fins 12 are included. The liquid cooling module 11 is covered on the wafer and is locked to the circuit board by screws 14. The liquid flows through the liquid inlet pipe 132 of the liquid cooling module 11 to perform heat. Exchange, then from the outlet pipe 1 31 flows out, and the heat dissipating fins 12 are disposed on the liquid discharge pipe 131 to dissipate heat energy in the water. The liquid cooling heat dissipating device 1 can provide better heat dissipation function, but the expandability is not good, if the user In order to replace the higher-efficiency wafer, the user must replace the entire set of liquid-cooled heat sinks. In addition, the user cannot expand from a lower 13⁄4 heat sink to a liquid-cooled heat sink. The chip type heat sink and the liquid-cooled heat sink are not expandable. For computer manufacturers, manufacturers must prepare liquid-cooled heat sinks for high-end computers and fin-type heat sinks for low-end computers. As well as liquid-cooled heat sinks for high-end computers, and high-end computers with different performances of needles and amplifiers must be prepared with different liquid-cooled heat sinks. This material cost is a great burden for computer manufacturers.... At present, the product cycle of processing wafers and graphics wafers is becoming shorter, so the demand for users to replace heat sinks is also increasing. Therefore, what is provided - a kind of expansion heat dissipation In order to be able to solve the problems of the prior art, the inventor has proposed a liquid-cooled heat sink based on years of research and development and many practical experiences in order to improve the above-mentioned problems. SUMMARY OF THE INVENTION In view of the above, an object of the present invention is to provide a liquid-cooled heat sink for improving the expandability and assembly convenience of the heat sink. According to the object of the present invention, a liquid is proposed. The cooling device is configured to dissipate heat from at least one heat source. The liquid cooling heat dissipating device comprises a base, at least one heat dissipating fin and a liquid cooling module. One side of the base contacts the surface of the heat source, and The surface of the other side of the base has a first area and a second area, and the heat dissipation fins are disposed in the first area, and the liquid cooling module is removably disposed in the second area. Wherein, the liquid cooling heat dissipating device further comprises an adapter, one end of which is combined with the liquid cooling module, and the other end is used for combining with the base, so that the liquid cooling module can be fixed through the adapter On the second area. In addition, the present invention further provides a liquid-cooling heat dissipating device for dissipating heat from the first heat source and the second heat source, the liquid-cooling heat sink device comprising a first base, a second base, and at least a first a heat sink fin, at least one second heat sink fin, and a liquid cooling module. One side of the first base contacts the surface of the first heat source, and the other side of the first base has a first area and a second area. One side of the second base contacts the surface of the first heat source, and the other side of the second base has a third area and a fourth area. The first heat dissipation fin and the second heat dissipation fin are respectively disposed in the first region and the third region. The liquid cooling module is removably 7 200947188 (removably) disposed in the second area and the fourth area. The liquid-cooled heat sink further includes two adapters, and the two ends of the liquid-cooling module are respectively fixed to the second region and the fourth region through the adapters. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a liquid-cooling heat sink according to the present invention will be described with reference to the accompanying drawings. For the sake of convenience, the same reference numerals in the following embodiments are denoted by the same reference numerals. . 2 and 3 are perspective exploded views and a combined side view of a first embodiment of the liquid-cooled heat sink of the present invention. In the figure, the liquid-cooled heat sink 2 comprises a base 2, a plurality of heat-dissipating fins 24, a combiner 23 and a liquid-cooling module 22. One side of the susceptor 21 is in contact with the surface of the heat source, such as a surface of a wafer, and the other side has a first area 211 and a second area 212, and the heat dissipation fins 24 are disposed in the first area 211. The heat sink fins 24 and the base 21 are preferably formed in a shape of one. In the second region 212, there is a receiving groove 25 having an inner wall having a thread 251. The outer wall of the adapter 23 has a thread 232, and the first thread 251 is mated with the thread 232. Further, the adapter 23 has an opening 25' and the inner wall of the opening 25 has a thread 231. The liquid cooling module 22 includes a body 220, a liquid inlet pipe 221 and an liquid outlet pipe 222, and the liquid system flows through the liquid inlet pipe 221 and an outlet pipe 222 to exchange heat with the body 220. At one end of the body 22, a thread 223' thread 231 is mated with the thread 223. 200947188 When assembling, the user can first insert the liquid cooling module 22 into the adapter 23 to partially engage the thread 231 with the thread 223, and place the adapter 23 into the receiving groove 25 to partially engage the thread 232 with the thread 251. Then, The user can rotate the adapter 23 to lock the thread 251 with the thread 232, and the thread 231 is locked with the thread 223, thereby allowing the liquid cooling module 22 to be removably disposed through the coupler 23 The second area 212 is as shown in Figure 3. The susceptor 21, the heat dissipating fins 24, the adapter 23, and the cymbal body 220 of the liquid cooling module 22 are preferably made of a metal having good thermal conductivity. The susceptor 21 can conduct heat generated by the heat source to the heat dissipation fins 24 for heat dissipation. If the liquid cooling module 22 is installed, the heat energy is also transmitted to the body 220 of the liquid cooling module 22 through the adapter 23, and then the liquid flow The liquid inlet pipe 221 and the liquid outlet pipe 222 exchange heat with the body 220. Since the liquid cooling module 22 has the liquid inlet pipe 221 and the liquid outlet pipe 222, by using the combiner 23, the liquid cooling module 22 does not need to be rotated during assembly, so as to prevent the liquid inlet pipe 221 and the liquid outlet pipe 222 from being knotted. Improve the ease of assembly. Therefore, when the heat source is a wafer with a lower operating frequency, the heat energy generated is lower, and the user can remove the liquid cooling module 22 and use only the heat dissipation fins 24 to perform passive heat dissipation to save the energy consumption of the heat sink 2. When the heat source is a wafer with a higher operating frequency, the user can install the liquid cooling module 22 for active heat dissipation, so that the wafer can exhibit better performance. The positions of the first area 211 and the second area 212 are shown as an example, but are not limited thereto. On the surface of the base, the area set by the liquid cooling module 2 is defined as the second area. The area outside the second area 9 200947188 is defined as the first area, and is within the protection scope of the present invention. In addition, the heat dissipating fins 24 are disposed on both sides of the liquid cooling module 2 and are spaced apart from the liquid cooling module 2, which is only an example, but not limited thereto, such as heat sink fins. It is also possible to form a sun-like pattern around the liquid-cooling module 2, or any arrangement that can achieve a heat-dissipating effect, which is within the protection scope of the present invention. Please refer to FIG. 4 and FIG. 5, which are perspective exploded views and a combined side view of a second embodiment of the liquid-cooled heat sink of the present invention. In the figure, the liquid® cold heat sink 3 is different from the liquid cooling heat sink 2 in that the combiner 33 has a engaging mechanism 331, and one end of the liquid cooling module 32 has a flange 323. The snap-fit structure 331 is mated with the flange 323. During assembly, the user can first lock the adapter 33 to the receiving groove 25, and then the user can disengage the engaging mechanism 331 to place the flange 323 of the liquid cooling module 32 in the engaging mechanism 331. In the space, the engaging mechanism 331 is released, and the elastic mechanism of the material of the engaging mechanism 331 allows the engaging mechanism 331 to abut against the body 220 and engages the flange 323 to fix the liquid cooling module 32, such as the fifth. As shown, heat energy generated by the heat source can be conducted from the susceptor 21 to the bonder 33 and then to the liquid cooling module 32. Please refer to Fig. 6, which is a combined side view of a third embodiment of the liquid-cooled heat sink of the present invention. When heat is dissipated from a plurality of heat sources, a larger-sized pedestal can be used. In the figure, the pedestal 41 side of the liquid-cooled heat sink 4 covers the wafers 491 to 495, and the other side of the susceptor 41 has heat dissipation. The fins and the liquid cooling module 22, and the user can selectively remove the liquid cooling module 22 or the liquid cooling module 22 on the base 41 as needed. The liquid-cooled heat sink 4 can be screwed or fastened to the circuit board 496. Example 200947188 For example, when the processing chip and the _chip_ are mounted on the motherboard, the liquid-type heat sink 4' can simultaneously disperse the processing wafer and the drawing wafer. By using the liquid-cooled dispersion (four) of the present invention, and the liquid-cooling module can be equipped with pedestals of different sizes, the problem of the heat source or multiple heat sources can be solved, and the required cost is also reduced. π is referred to in Fig. 7 which is a combined side view of a fourth embodiment of the liquid-cooled heat sink of the present invention. In the figure, the liquid cooling type heat sink 5
Ο ^對兩個相面對之熱源進行散熱。液冷式散熱裝置$ 匕3基座21、基座51、散熱鰭片24及54、結合器23及 53及液冷模組22。基座21之一側係接觸熱源如之表 面’而另-侧之表面具有一第一區域211及一第二區域 212,散熱鰭片24係設置於第一區域211。基座51之一 側係接觸熱源592之表面，而另—側之表面具有一第三 ，域511及-第四區域512，散熱鱗# 54係設置於第三 區域5U。散熱鰭片24與基座21，散熱鰭片54與基座 51係體成型。熱源591及熱源592係分別設置於電路 板581及591上。 、在第二區域212及第四區域212中分別具有容置槽 以谷置接合器23及接合器53,而容置槽與接合器之結合 方式，及液冷模組與接合器之結合方式，皆與上述實施 例相同，在此不再贅述。當使用者於電腦中安裝兩張顯 不卡時，便可使用液冷式散熱裝置5對兩個繪圖晶片同 時進行散熱。 液冷模組22之入液管道221及一出液管道222係設 置於本體22之侧邊，而第6圖中，入液管道221、出液 200947188 管道222、散熱鰭片24及54之配置佈局㈦㈧加)僅為舉 例，但並不以此為限，凡可讓液冷模組22自基座上移除 的配置佈局都在本發明之保護範圍内。 此外，上述容置槽與結合器之結合方式僅為舉例， 但並不以此為限，凡可穩固結合之機構皆在本發明之保 • 護範圍内，例如第8圖及第9圖所示之範例。在第8圖 中，液冷式散熱裝置6與其他實施例不同之處在於，基 座61上之第二區域212具有一凸起部65，且凸起部 之外壁具有一螺紋651，而結合器63之開孔内壁之兩端 部分別有螺紋231及632，螺紋632係匹配螺紋651。組 裝時，使用者可先將液冷模組22套入接合器63使螺紋 231與螺紋223部分咬合，在將接合器63套上凸起部65 使螺紋651與螺紋632部分咬合。接著，使用者可轉動 接合器63，讓螺紋231與螺紋223相鎖緊，螺紋651與 螺紋632相鎖緊，藉此，讓液冷模組22透過結合器63 緊密地固定於第二區域212。 ® 在第9圖中，液冷式散熱裝置7與其他實施例不同 之處在於，基座71上之第二區域212具有一複數個凸起 柱75，且此些凸起柱75係組成一類環狀，且面内類環狀 中心之一侧係具有一螺紋751，而接合器73之外壁具有 一螺紋732,螺紋751係與螺紋732相匹配。而接合器 73與凸起柱75之組合方式與上述實施例相同。 此外，螺紋751亦可設置於凸起柱75之對應類環狀 中心之外側，而螺紋732設置於接合器73之開孔内壁。 请參閱第10圖，其係為本發明之液冷式散熱裝置之 12 200947188 應用示意圖。圖中，電腦系統8之處理晶片及繪圖晶片 需要進行散熱，使用者可將本發明之液冷式散熱裝置81 及液冷式散熱裝置82分別設置於處理晶片及繪圖晶片 上，再將液冷模組之管道841〜843串接至一幫浦83之入 水口及出水口。幫浦83係驅動管道841〜843内的液體不 斷循環，讓液體可吸收並帶離處理晶片及繪圖晶片所產 生之熱能。 ' 本發明之液冷式散熱裝置之液冷模組係可移除地 ❹ （removably)設置在基座上，例如上述實施例所述之鎖接或 卡合之手段，與傳統液冷式散熱裝置之液冷模組係固接於 基座上有所不同，因此本發明之液冷式散熱裝置可提供較佳 的擴充性及備料成本控制。 目前個人電腦大多具有可擴充性，使用者可自行更換 效能更好的處理晶片或顯示卡，因此，當使用者初期購 買的電腦系統效能較低，系統中的晶片產生的熱能較 少，則使用者可先安裝本發明之基座於晶片上，僅靠散 〇 熱鰭片便足以散離晶片產生的熱能。之後，當使用者欲 更新為工作頻率更快、效能較高的晶片，而僅靠散熱鰭 片不足以散離晶片產生的熱能時，使用者可將液冷模組 安裝至基座上即可，此舉可大大增加散熱裝置之可擴充 性。 此外，對電腦製造商而言，本發明之液冷式散熱裝 置亦可降低元件庫存成本。當電腦製造商欲生產低階電 腦及高階電腦時，不需分別準備低階電腦及高階電腦所 使用之散熱裝置，使用本發明之液冷式散熱裝置，廠商 13 200947188 之的基座，當高階電 可’此舉可降低廠商 可將所有電腦都安裝具有散熱韓片 腦要出㈣’再安裝域冷模組即 的備料成本並提高備科彈性。 嗖置；^ :在f述實施例中，液冷模組係透過接合器 ;土座上，但並不以此為限， 器係可提高安裝便利性， 接合 冷模組可移除地設置於心^^接^亦可達到將液 之社人古斗π^ a 基座之目的。而液冷模組與基座Ο ^Dissipate heat from two facing heat sources. The liquid-cooled heat sink $ 匕 3 base 21, base 51, heat sink fins 24 and 54, couplers 23 and 53 and liquid cooling module 22. One side of the susceptor 21 is in contact with a heat source such as a surface ‘the other side has a first area 211 and a second area 212, and the heat dissipation fins 24 are disposed in the first area 211. One side of the base 51 contacts the surface of the heat source 592, and the other side has a third, domain 511 and - fourth region 512, and the heat sink scale #54 is disposed in the third region 5U. The heat dissipation fins 24 and the susceptor 21, and the heat dissipation fins 54 and the susceptor 51 are integrally formed. The heat source 591 and the heat source 592 are provided on the circuit boards 581 and 591, respectively. The second region 212 and the fourth region 212 respectively have a receiving groove for placing the adapter 23 and the adapter 53, and the combination of the receiving groove and the adapter, and the combination of the liquid cooling module and the adapter The same as the above embodiment, and details are not described herein again. When the user installs two display cards in the computer, the liquid cooling device 5 can be used to simultaneously dissipate the two drawing chips. The liquid inlet pipe 221 and the liquid outlet pipe 222 of the liquid cooling module 22 are disposed on the side of the body 22, and in FIG. 6, the liquid inlet pipe 221, the liquid outlet 200947188 pipe 222, and the heat dissipation fins 24 and 54 are disposed. Layout (7) (8) Plus) is merely an example, but is not limited thereto, and any configuration that allows the liquid cooling module 22 to be removed from the pedestal is within the scope of the present invention. In addition, the combination of the above-mentioned accommodating groove and the coupling is only an example, but it is not limited thereto, and all the mechanisms that can be firmly combined are within the protection range of the present invention, for example, FIG. 8 and FIG. An example of the show. In Fig. 8, the liquid-cooling heat sink 6 is different from the other embodiments in that the second region 212 on the base 61 has a convex portion 65, and the outer wall of the convex portion has a thread 651, and the combination The ends of the inner wall of the opening of the 63 have threads 231 and 632, respectively, and the threads 632 match the threads 651. When assembling, the user can first insert the liquid cooling module 22 into the adapter 63 to partially engage the thread 231 with the thread 223, and put the boss 63 on the boss 63 to partially engage the thread 651 with the thread 632. Next, the user can rotate the adapter 63 to lock the thread 231 with the thread 223, and the thread 651 is locked with the thread 632, thereby allowing the liquid cooling module 22 to be tightly fixed to the second region 212 through the coupler 63. . In Fig. 9, the liquid-cooled heat sink 7 differs from the other embodiments in that the second region 212 on the base 71 has a plurality of raised columns 75, and the raised columns 75 are grouped into one type. The ring-shaped, and one side of the in-plane annular center has a thread 751, and the outer wall of the adapter 73 has a thread 732 that matches the thread 732. The combination of the adapter 73 and the boss 75 is the same as that of the above embodiment. Further, the thread 751 may be disposed on the outer side of the corresponding annular center of the boss column 75, and the thread 732 is disposed on the inner wall of the opening of the adapter 73. Please refer to FIG. 10 , which is a schematic diagram of the application of the liquid cooling heat sink 12 200947188 of the present invention. In the figure, the processing chip and the drawing chip of the computer system 8 need to be dissipated, and the user can set the liquid cooling heat dissipating device 81 and the liquid cooling heat dissipating device 82 of the present invention on the processing chip and the drawing wafer, respectively, and then liquid-cooling. The pipes 841 to 843 of the module are connected in series to the water inlet and the water outlet of a pump 83. The liquid in the pump 83 system drives the pipes 841 to 843 to circulate continuously, allowing the liquid to absorb and carry away the heat generated by the processing wafer and the drawing wafer. The liquid-cooled module of the liquid-cooled heat sink of the present invention is removably disposed on the base, such as the means of locking or snapping as described in the above embodiments, and the conventional liquid-cooled heat sink. The liquid cooling module of the device is fixed on the base, so the liquid cooling heat sink of the present invention can provide better expandability and material cost control. At present, most personal computers are extensible, and users can replace the processing chips or display cards with better performance. Therefore, when the user's initial purchase of the computer system is low, and the heat generated by the wafer in the system is less, the use is small. The susceptor of the present invention can be mounted on the wafer first, and only by dissipating the heat fins is sufficient to dissipate the heat energy generated by the wafer. After that, when the user wants to update to a faster and more efficient wafer, and the heat sink fins alone are not enough to dissipate the heat generated by the wafer, the user can install the liquid cooling module on the pedestal. This can greatly increase the expandability of the heat sink. In addition, the liquid-cooled heat sink of the present invention can also reduce component inventory costs for computer manufacturers. When a computer manufacturer wants to produce low-end computers and high-end computers, it is not necessary to separately prepare heat sinks for low-end computers and high-end computers. The liquid-cooled heat sink of the present invention, the base of the manufacturer 13 200947188, is a high-order This can reduce the manufacturer's ability to install all the computers with the heat of the Korean brain (4) 'reinstall the domain cold module that is the cost of the preparation and improve the flexibility of the preparation.嗖; ^: In the embodiment described, the liquid cooling module is passed through the adapter; the earth seat, but not limited thereto, the device can improve the installation convenience, and the joint cold module can be removably set Yu Xin ^ ^ connected ^ can also achieve the purpose of the liquid community of the ancient π ^ a base. Liquid cooling module and base
，可分離之接合方式。若液冷式散熱裝置 2冷模組與接合，及接合II與基座之間的結合 ’可包含螺紋鎖接、卡合或其他可緊密接合但又可分 離之接合方式。 以上所述僅為舉例性，而非為限制性者。任何未脫 離本發明之精神與範疇，而對其進行之等效修改或變 更，均應包含於後附之申請專利範圍中。 〇 【圖式簡單說明】 第1圖係為習知技藝之液冷式散熱裝置之示意圖； 第2圖係為本發明之液冷式散熱裝置之第一實施例之 立體分解圖； 第3圖係為本發明之液冷式散熱裝置之第一實施例之 組合侧視圖； 第4圖係本發明之液冷式散熱裝置之第二實施例之立 體分解圖； 第5圖係本發明之液冷式散熱裝置之第二實施例之組合 200947188 侧視圖； 第6圖係本發明之液冷式散熱裝置之第三實施例之組合 侧視圖； 第7圖係本發明之液冷式散熱裝置之第四實施例之組合 侧視圖； 第8圖係為本發明之液冷式散熱裝置之第五實施例之 立體分解圖； 第9圖係為本發明之液冷式散熱裝置之第六實施例之 立體分解圖；以及 第10圖係本發明之液冷式散熱裝置之應用示意圖。 【主要元件符號說明】 1〜7 :液冷式散熱裝置； 11、 22、32 :液冷模組； 12、 24、54 :散熱鰭片； 13卜 132、221、222、84卜843 :管道； 14 :螺絲； 2卜4卜5卜6卜71、8卜82 ··基座； 211、212、5U、512 :區域； 220 :本體； 223、231、232、251、632、651、732、751 :螺紋； 23、33、53、63、73 :結合器； 25 :容置槽； 323 :凸緣； 331 :卡合機構； 15 200947188 491〜495 :晶片； 496、581、591 :電路板 582、592 ··熱源； 65 :凸起部； 75 :凸起柱； 8 :電腦系統；以及 83 :幫浦。 ❹Separable joining method. If the liquid-cooled heat sink 2 is cooled and joined, and the bond between the joint II and the base' may include a threaded lock, snap fit or other tightly engageable but separable joint. The above is intended to be illustrative only and not limiting. Any changes or modifications to the spirit and scope of the present invention are intended to be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a liquid-cooled heat sink of the prior art; FIG. 2 is an exploded perspective view of the first embodiment of the liquid-cooled heat sink of the present invention; It is a combined side view of the first embodiment of the liquid-cooled heat sink of the present invention; FIG. 4 is a perspective exploded view of the second embodiment of the liquid-cooled heat sink of the present invention; Combination of a second embodiment of a cold heat sink 200947188 side view; Fig. 6 is a combined side view of a third embodiment of the liquid cooled heat sink of the present invention; Fig. 7 is a liquid cooled heat sink of the present invention 4 is a perspective view of a liquid-cooled heat sink according to a fifth embodiment of the present invention; and FIG. 9 is a sixth embodiment of the liquid-cooled heat sink of the present invention. 3D exploded view; and Fig. 10 is a schematic view showing the application of the liquid cooling heat sink of the present invention. [Main component symbol description] 1~7: liquid-cooled heat sink; 11, 22, 32: liquid cooling module; 12, 24, 54: heat sink fin; 13 Bu 132, 221, 222, 84 843: pipe ; 14 : Screws; 2 Bu 4 Bu 5 Bu 6 Bu 71, 8 Bu 82 · Pedestal; 211, 212, 5U, 512: Area; 220: Body; 223, 231, 232, 251, 632, 651, 732 , 751: thread; 23, 33, 53, 63, 73: combiner; 25: accommodating groove; 323: flange; 331: engaging mechanism; 15 200947188 491~495: wafer; 496, 581, 591: circuit Plate 582, 592 · · heat source; 65 : raised portion; 75 : raised column; 8 : computer system; and 83 : pump. ❹
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