CN2736925Y - 散热装置 - Google Patents

散热装置 Download PDF

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CN2736925Y
CN2736925Y CNU2004200884165U CN200420088416U CN2736925Y CN 2736925 Y CN2736925 Y CN 2736925Y CN U2004200884165 U CNU2004200884165 U CN U2004200884165U CN 200420088416 U CN200420088416 U CN 200420088416U CN 2736925 Y CN2736925 Y CN 2736925Y
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heat
heat pipe
mentioned
radiator
radiating
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李学坤
陈俊吉
周世文
符猛
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to US11/221,285 priority patent/US7296617B2/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种散热装置,用以散发电子元件产生的热量,其包括一散热器及至少一热管,该散热器底端吸收电子元件的热量,该热管一端为蒸发部,该蒸发部与散热器底端热性接合,上述热管连续弯折形成远离该蒸发部的若干冷凝部,上述散热器具有由若干散热片组组成的散热部,该散热部对应热管的冷凝部设有若干筒状接合面,该热管的冷凝部分别与上述散热部的筒状接合面热性接合。本实用新型散热装置的热管具有连续的若干冷凝部与散热部接触,提高热管的利用率,提高整个散热装置的散热效率。

Description

散热装置
【技术领域】
本实用新型是关于一种散热装置,特别是一种可有效冷却电子元件的高效率热管散热装置。
【背景技术】
随着电子信息业不断发展,电子元件(尤为中央处理器)运行频率和速度在不断提升。但是,高频高速将使电子元件产生的热量随之增多,使得其温度不断升高,严重威胁着电子元件运行时的性能,为确保电子元件能正常运作,必须及时排出电子元件所产生的大量热量。
为此,业界通常使用一种散热装置进行散热,这些现有散热装置均包括一底座和设在底座上的若干散热鳍片,该散热底座底面为平滑的实体金属,是供贴设在中央处理器表面。而随着中央处理器体积越来越小,其发热也更加集中,因局限于金属的传热性能,散热底座中心处的热量往往过于集中,而无法有效传递到散热装置的四周,从而严重影响整体散热效果,使得中央处理器的性能下降,无法有效运算,甚至烧毁。
为克服上述问题,业界采用热管传导热量的散热装置日益增多,热管是在金属管体内设置毛细结构物(如粉末烧结物、沟槽结构、丝网结构等),并密封装入工作液体(如水、酒精等),然后抽至真空状态,依赖工作液体受热后进行液气两相变化而吸收、释放热量,由于热管的传热不定向且有一定的长度,可将热量传递至较远端。中国台湾专利公告第532758号揭示一种运用热管的电子元件散热装置,其包括一基座、设置于基座上的若干散热鳍片及二大致呈“コ”形的热管。该基座底面与电子元件表面贴合,该基座上表面及散热鳍片下端缘对应开设两对半圆形凹槽,每一热管一端部通过导热胶黏合或焊接在上述凹槽中。这些散热鳍片远离基座的适当位置开设穿孔,供套设于热管另一端部上。电子元件产生的热量传递到基座,然后通过热管将热量传递到上部的散热鳍片上,最后通过散热鳍片将热量散发到周围空气中,达到冷却电子元件的目的。但是,因热管上端部与散热鳍片只接触一次,传导至散热鳍片上部的热量相对较少,散热过程中还是未能充分利用散热鳍片的上方部位,未能充分发挥热管的传热远、传热快的性能,这种情况在散热鳍片的纵向及水平尺寸较大时更为明显。
【发明内容】
本实用新型的目的在于提供一种散热效率高的具有热管的散热装置。
本实用新型的目的是通过以下技术方案实现的:
本实用新型的散热装置,用以散发电子元件产生的热量,其包括一散热器及至少一热管。该散热器底端吸收电子元件的热量,上述热管连续弯折形成位于其一端的一蒸发部及远离该蒸发部的若干冷凝部,上述散热器具有由若干散热片组组成的散热部,该散热部对应热管的冷凝部设有若干筒状接合面,该热管的蒸发部与散热器底端热性接合,热管的冷凝部分别与上述散热部的筒状接合面热性接合。
本实用新型与先前技术相比具有如下优点:由于散热装置的热管具有若干冷凝部与散热部接触,散热过程中能充分利用散热部的散热面积,充分发挥了热管的传热远、传热快的性能,提高热管的利用率,提高了散热装置整体散热效率。
下面参照附图,结合实施例对本实用新型作进一步的描述。
【附图说明】
图1是本实用新型散热装置的立体分解图。
图2是本实用新型散热装置的组装状态图。
图3是本实用新型散热装置的立体组合图。
【具体实施方式】
请参阅图1至图3,本实用新型散热装置是用来安装在中央处理器(图未示)等发热电子元件上对其进行散热。该散热装置包括一散热器10及一对与散热器10的底部、中部及上部同时接合的热管20。
上述散热器10包括一基座11及设置于基座11上表面的散热部,该散热部包括相互叠合形成的第一散热片组14和第二散热片组16。该基座11下表面与中央处理器表面相贴合,其上表面上开设有一对半圆筒状凹槽120。上述第一散热片组14由若干第一散热鳍片140并列组合而成。每一第一散热鳍片140相对两端分别同向垂直弯折延伸形成折边142,这些第一散热鳍片140的两端折边142分别连续形成一平面,其一平面与基座11上表面相结合,且该平面上相应基座11的凹槽120设有半圆筒状凹口144,从而形成一对第一圆筒状内接合面44。上述第二散热片组16由若干第二散热鳍片160并列组合而成。每一第二散热鳍片160相对两端也分别同向垂直弯折延伸形成折边162,这些若干第二散热鳍片160的两端折边162分别连续形成一平面,其一平面与第一散热片组14的折边142形成的另一平面相叠合,且该相叠合的两平面上分别对应形成两对半圆筒状凹口146、166,从而形成一对第二圆筒状内接合面46,同时每一散热鳍片160靠近上端的适当位置还设有一对穿孔164,每一穿孔164内周缘垂直弯折延伸形成折边168,从而这些穿孔164的折边168连续形成第三圆筒状内接合面66。其中,不难看出,上述第一圆筒状接合面44还可以直接在基座11的内部穿孔形成。
上述每一热管20连续弯折形成第一水平段22、第二水平段24和第三水平段26,从而每一热管20整体上呈S字型。每一热管20的第一水平段22及第二水平段24可通过导热胶粘接或锡膏焊接等方式分别贴合于上述第一及第二圆筒状内接合面44、46上,而每一热管20的第三水平段26可通过锡膏焊接或过盈配合等方式穿接于上述第三圆筒状内接合面66上。
从而,中央处理器工作时,产生的热量传递到散热器10的基座11,其一部分热量直接传递至第一、第二散热片组14、16,同时另一部分热量使每一热管20内的工作流体在第一水平段22受热蒸发,在第二水平段24及第三水平段26被冷凝,使散热器10的底部的热量能够快速传导至其中部和上方部位,最后第一、第二散热鳍片140、160将热量散发到四周。
上述散热器10一侧可安装至少一散热风扇(图未示),以提高散热器10与周围空气的热对流速度。
在上述实施例中,本实用新型散热装置的热管20为圆筒状,其主要提供具有第一水平段22,即一蒸发部,及第二水平段24和第三水平段26,即二冷凝部。可以理解地,圆筒状热管20及板型热管的传热原理及性能是基本相同的,故本实用新型散热装置也可使用S字型板型热管,此时,第一、第二散热片组14、16及基座11上的容设热管蒸发部及冷凝部的各接合面相对形成方形筒状接合面即可。
上述实施例中,散热器10具有一基座11,该基座11主要是吸收中央处理器产生的热量,然后分别将热量传递至散热部底部及热管20蒸发部。本实用新型散热装置也可只由第一、第二散热片组14、16和热管20组成,此时热管20的第一水平段22(蒸发部)与第一散热片组14下端的平面平齐设置,可直接与中央处理器等发热源热性接触即可。
上述各实施例中,热管20包括连续弯折形成的一蒸发部及远离该蒸发部的二冷凝部。可以理解地,本实用新型散热装置的热管还可以根据散热需求,经连续弯折而形成两个以上的冷凝部,此时对应该若干冷凝部设置由若干散热片组组成的散热部,散热部上对应这些冷凝部分别形成容置该冷凝部的筒状接合面。

Claims (9)

1.一种散热装置,用以散发电子元件产生的热量,其包括一散热器及至少一热管,该散热器底端吸收电子元件的热量,该热管一端为蒸发部,该蒸发部与散热器底端热性接合,其特征在于:上述热管连续弯折形成远离该蒸发部的若干冷凝部,上述散热器具有由若干散热片组组成的散热部,该散热部对应热管的冷凝部设有若干筒状接合面,该热管的冷凝部分别与上述散热部的筒状接合面热性接合。
2.如权利要求1所述的散热装置,其特征在于:上述热管整体呈S字型,其具有第一水平段、第二水平段和第三水平段,该第一水平段为上述热管的蒸发部,该第二、第三水平段为上述热管的冷凝部。
3.如权利要求2所述的散热装置,其特征在于:上述散热部具有相互叠合的第一、第二散热片组,该第一、第二散热片组分别由若干第一、第二散热鳍片组合而成,每一散热鳍片相叠合的一端垂直弯折延伸形成一折边,该折边上形成容置该热管冷凝部的该筒状接合面。
4.如权利要求3所述的散热装置,其特征在于:上述热管为圆筒状,上述筒状接合面呈圆形。
5.如权利要求3所述的散热装置,其特征在于:上述热管为板型,上述筒状接合面呈方形。
6.如权利要求3、4或5所述的散热装置,其特征在于:上述热管的蒸发部与上述第一散热片组的底面相互平齐,并与电子元件热性接合。
7.如权利要求1所述的散热装置,其特征在于:上述散热器还包括一基座,该基座一表面与电子元件接触,其另一相对表面上设置上述散热部。
8.如权利要求7所述的散热装置,其特征在于:上述基座上表面上开设有至少一筒状凹槽,该凹槽与该散热部底端共同形成容置热管蒸发部的筒状接合面。
9.如权利要求7所述的散热装置,其特征在于:上述基座上形成容置上述热管蒸发部的筒状接合面。
CNU2004200884165U 2004-09-15 2004-09-15 散热装置 Expired - Lifetime CN2736925Y (zh)

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US11/221,285 US7296617B2 (en) 2004-09-15 2005-09-07 Heat sink

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CN102237322A (zh) * 2010-04-29 2011-11-09 Abb公司 安装基座
CN101316495B (zh) * 2007-06-01 2011-12-21 富准精密工业(深圳)有限公司 散热模组
CN101420834B (zh) * 2007-10-26 2012-03-21 富准精密工业(深圳)有限公司 散热装置
CN106052450A (zh) * 2016-07-29 2016-10-26 苏州聚力电机有限公司 具回路型热管的新型散热模块

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CN100562230C (zh) * 2005-09-02 2009-11-18 富准精密工业(深圳)有限公司 热管散热装置
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