CN101616567B - 散热装置 - Google Patents

散热装置 Download PDF

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CN101616567B
CN101616567B CN2008100681036A CN200810068103A CN101616567B CN 101616567 B CN101616567 B CN 101616567B CN 2008100681036 A CN2008100681036 A CN 2008100681036A CN 200810068103 A CN200810068103 A CN 200810068103A CN 101616567 B CN101616567 B CN 101616567B
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condensation segment
heat
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fin
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CN101616567A (zh
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郭青磊
朱寿礼
方彝群
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Fuzhun Precision Industry Shenzhen Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4871Bases, plates or heatsinks
    • H01L21/4882Assembly of heatsink parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00Fins
    • F28F2215/04Assemblies of fins having different features, e.g. with different fin densities
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
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Abstract

一种散热装置,包括一第一散热体、分别位于该第一散热体两端的两个第二散热体及至少一热管,该热管包括一蒸发段及三个冷凝段,所述蒸发段及冷凝段弯折延伸呈一方框状结构,其中两个自由端所在的段为第一及第二冷凝段,所述第一冷凝段穿插于第一散热体内,所述第二冷凝段夹设于该第一散热体与一第二散热体之间,与该第一冷凝段邻接的段为第三冷凝段,与该第二冷凝段邻接的段为蒸发段,该第三冷凝段夹设于该第一散热体与另一第二散热体之间,增大热管与散热体的接触面积可使热量更加快速而均匀地分布到整个散热装置。

Description

散热装置
技术领域
本发明涉及一种散热装置,特别是指一种电子元件的散热装置。
背景技术
随着电子信息业不断发展,电子元件(尤为中央处理器)运行频率和速度在不断提升。但是,高频高速将使电子元件产生的热量随之增多,使得其温度不断升高,严重威胁着电子元件运行时的性能,为确保电子元件能正常运作,必须及时排出电子元件所产生的大量热量。
各种结构的散热器也因此不断地被设计出来,随着发热量的不断升级,单纯通过金属热传导方式进行散热的散热器已经不能满足高发热量的电子元件的散热需求。近年来,热管因其具有高效快速的热传导能力而在散热方面获得广泛的应用,使用热管的散热器也因此不断地以新结构出现。
为使散热器尽可能地具有较大的散热面积以加速散热,通常散热片都具有较大的尺寸,而热管通常一端为蒸发端,另一端为冷凝端,使冷凝端与散热片接触,在散热片面积增大的同时,热管与其接触面积较小,因此虽然散热鳍片能够快速的散热,但是热管的热量不能快速的传递到散热片,整体散热性能无法获得突破性提高。为此,如何在散热装置合理使用热管达到最佳的散热效果将是需要研究的课题。
发明内容
有鉴于此,有必要提供一种散热效率较好的散热装置。
一种散热装置,包括一第一散热体、分别位于该第一散热体两端的两个第二散热体及至少一热管,该热管包括一蒸发段及三个冷凝段,所述蒸发段及冷凝段弯折延伸呈一方框状结构,其中两个自由端所在的段为第一及第二冷凝段,所述第一冷凝段穿插于第一散热体内,所述第二冷凝段夹设于该第一散热体与一第二散热体之间,与该第一冷凝段邻接的段为第三冷凝段,与该第二冷凝段邻接的段为蒸发段,该第三冷凝段夹设于该第一散热体与另一第二散热体之间。
与现有技术相比,上述散热装置通过具有一蒸发段及三冷凝段结构的热管,并通过三个散热体相互配合将热管的三个冷凝段收容其内,增大热管与散热体的接触面积可使热量更加快速而均匀地分布到整个散热装置并散发,因此具有较高的散热性能。
附图说明
图1是本发明一较佳实施例散热装置的立体组装图。
图2是图1的立体分解图。
图3是图2倒置的部分组装图。
具体实施方式
以下参照附图,对本发明散热装置予以进一步说明。
图1及图2所示为本发明散热装置一较佳实施例的立体组装及分解图。该散热装置包括两根热管10、一散热器20及一扣具30,该散热装置通过扣具30与设于电路板(图未示)上的固定座(图未示)配合,使该散热器20的底端通过一吸热板40与设于电路板上的发热电子元件(图未示)接触,并吸收其热量。
该两热管10相对设置于散热器20上,该热管10为圆形热管,其弯折延伸呈一开口的方框状结构。该方框状结构的热管10的两个自由端所在的段分别为第一及第二冷凝段12、12a,与第一冷凝段12邻接的段为第三冷凝段12b,与第二冷凝段12a邻接的段为蒸发段14。该第一冷凝段12的自由端延伸至第二冷凝段12a的自由端的外侧,且第二冷凝段12a的自由端与第一冷凝段12之间形成一间距16。
该散热器20整体轮廓呈一方体结构,该散热器20包括一第一散热体200和两个第二散热体220。该第一散热体200是由若干第一散热片202依次平行间隔排列而成,该第一散热体200的相对两侧的两端部由若干第一散热片202排列形成一凸台204,该两凸台204与两凸台204间的第一散热片202围成一凹部206,该凹部206形成在第一散热体200的相对两侧的中部,使第一散热体200的整体俯视呈一I字状构造。请同时参考图3,该第一散热体200上于凸台204的外上侧的位置各形成一贯穿若干第一散热片202的收容孔2040,该收容孔2040呈圆形,分别用以将各热管10的第一冷凝段12收容其内。该收容孔2040的外缘到所靠近的第一散热体200的外边端的最小距离小于热管10上两个自由端的间距16,通过该间距16的设置可通过旋转将热管10直接组装到第一散热体200上,并使第二及第三冷凝段12a、12b分别与凹部206内的第一散热片202接触。该第一散热体200的上端中部开设一贯穿若干第一散热片202的沟槽210,该第一散热体200的底端中部形成一梯形槽208,两根热管10的蒸发段14并排设置于该梯形槽208内,且与第一散热体200的底端接触。
该两个第二散热体220的形状及结构均相同,可通过焊接分别设置于该凹部206内并与第一散热体200最外侧的第一散热片202接触,该第二散热体220刚好与第一散热体200的凹部206相吻合。该第二散热体220由金属材料一体制成,其包括一导热部222及由该导热部222延伸形成的若干第二散热片224。该导热部222包括一基部2220及由该基部2220顶面的中部斜向外、向上延伸出二导热翼部2222,该二导热翼部2222构成一V形结构。该导热翼部2222上靠近第一散热体200的一侧开设一凹槽2224,该凹槽2224的形状与导热翼部2222的形状对应呈V字形,该凹槽2224用以和第一散热体200配合分别将一根热管10的第三冷凝段12b和另一根热管10的第二冷凝段12a夹设其中,并收容于散热器20内。该两个第二散热体220分别设于第一散热体200的凹部206内后,两根热管10的第一、第二、第三冷凝段12、12a、12b均被收容在散热器20内。该基部2220的底端形成一开口槽2226,该开口槽2226与凹槽2224的底端相连通,且开口2226的形状与梯形槽208相对应,用于配合梯形槽208将吸热板40设置其内,并与该吸热板40上端开设的沟槽42一起形成一收容腔(图未示),该收容腔用于将热管10的蒸发段14收容其内。该若干第二散热片224是由该导热翼部2222分别竖直向上、向下延伸形成,且该第二散热片224与第一散热片202相垂直。该向上延伸的第二散热片224与沟槽210对应的部分短于其他向上延伸的第二散热片224,使该第二散热体220的上端形成一切槽2240,该切槽2240配合沟槽210用以收容扣具30的弹性臂32从而将该散热装置固定于电路板上。
该散热装置使发热电子元件产生的热量通过吸热板40传导至热管10的蒸发段14,再由蒸发段14传导至各冷凝段12b、12a、12,通过各冷凝段12b、12a、12传导至散热器20,通过各散热器20向外散发,由于热管10的特殊设置,且三个冷凝段12、12a、12b完全与散热器20接触,增加了热管10与散热器20的接触面积,从而提高散热性能。

Claims (9)

1.一种散热装置,包括一第一散热体、分别位于该第一散热体两端的两个第二散热体及至少一热管,其特征在于:该热管包括一蒸发段及三个冷凝段,所述蒸发段及冷凝段弯折延伸呈一方框状结构,其中两个自由端所在的段为第一及第二冷凝段,所述第一冷凝段穿插于第一散热体内,所述第二冷凝段夹设于该第一散热体与一第二散热体之间,与该第一冷凝段邻接的段为第三冷凝段,与该第二冷凝段邻接的段为蒸发段,该第三冷凝段夹设于该第一散热体与另一第二散热体之间。
2.如权利要求1所述的散热装置,其特征在于:所述热管的第一冷凝段与第二冷凝段之间形成一间距。
3.如权利要求1或2所述的散热装置,其特征在于:该第一散热体包括若干散热片,靠近该第一散热体的一边端设有贯穿该若干散热片的一收容孔,该热管的第一冷凝段收容于该收容孔内。
4.如权利要求3所述的散热装置,其特征在于:该收容孔到所靠近的边端的最小距离小于该间距。
5.如权利要求1所述的散热装置,其特征在于:该第一散热体由若干第一散热片顺次排列而成,该第一散热体的相对两侧的两端部由若干第一散热片排列形成一凸台,该两凸台与两凸台间的第一散热片围成一凹部,该两个第二散热体分别刚好设置于该凹部内,且分别与第一散热体最外侧的散热片接触。
6.如权利要求5所述的散热装置,其特征在于:该第一散热体相对的两侧于凸台的外上侧的位置各形成一贯穿若干第一散热片的收容孔,该热管的第一冷凝段收容于该收容孔内。
7.如权利要求6所述的散热装置,其特征在于:该两个第二散热体形状结构相同,各包括一导热部及由该导热部延伸形成的若干第二散热片,该导热部上形成一V字形的沟槽。
8.如权利要求7所述的散热装置,其特征在于:该沟槽与第一散热体配合分别将热管第二及第三冷凝段收容其内。
9.如权利要求6至8中任何一项所述的散热装置,其特征在于:所述热管的第一冷凝段到第二冷凝段之间形成一间距,该收容孔到所靠近的边端的最小距离小于该间距。
CN2008100681036A 2008-06-25 2008-06-25 散热装置 Expired - Fee Related CN101616567B (zh)

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